公开(公告)号：US20150072479A1

公开(公告)日：2015-03-12

申请号：US14021938

申请日：2013-09-09

申请人： Rajendra C. Dias ,  Lars D. Skoglund ,  Anil R. Indluru ,  Edward R. Prack ,  Danish Faruqui ,  Tyler N. Osborn ,  Amram Eitan ,  Timothy A. Gosselin

发明人： Rajendra C. Dias ,  Lars D. Skoglund ,  Anil R. Indluru ,  Edward R. Prack ,  Danish Faruqui ,  Tyler N. Osborn ,  Amram Eitan ,  Timothy A. Gosselin

IPC分类号： H01L21/56

CPC分类号： H01L21/56 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/563 ,  H01L23/3114 ,  H01L24/11 ,  H01L24/13 ,  H01L2021/60022 ,  H01L2224/0391 ,  H01L2224/0401 ,  H01L2224/05571 ,  H01L2224/05647 ,  H01L2224/11332 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/1146 ,  H01L2224/1148 ,  H01L2224/11849 ,  H01L2224/13023 ,  H01L2224/131 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/94 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2224/11 ,  H01L2924/00012 ,  H01L2924/014

摘要： Introducing an underfill material over contact pads on a surface of an integrated circuit substrate; and ablating the introduced underfill material to expose an area of the contact pads using temporally coherent electromagnetic radiation. A method including first ablating an underfill material to expose an area of contact pads on a substrate using temporally coherent electromagnetic radiation; introducing a solder to the exposed area of the contact pads; and second ablating the underfill material using temporally coherent electromagnetic radiation. A method including introducing an underfill material over contact pads on a surface of an integrated circuit substrate; defining an opening in the underfill material to expose an area of the contact pads using temporally coherent electromagnetic radiation; introducing a solder material to the exposed area of the contact pads; and after introducing the solder, removing the sacrificial material.

摘要翻译： 在集成电路基板的表面上的接触焊盘上引入底部填充材料; 并且消融所引入的底部填充材料以使用时间相干的电磁辐射来暴露接触焊盘的区域。 一种方法，包括首先使用时间相干电磁辐射烧蚀底部填充材料以暴露衬底上接触焊盘的区域; 向焊盘的暴露区域引入焊料; 并且使用时间相干的电磁辐射第二次消融底部填充材料。 一种方法，包括在集成电路基板的表面上的接触焊盘上引入底部填充材料; 在底部填充材料中限定开口以使用时间上相干的电磁辐射暴露接触垫的区域; 将焊料材料引入到接触焊盘的暴露区域; 并且在引入焊料之后，去除牺牲材料。

公开(公告)号：US09786517B2

公开(公告)日：2017-10-10

申请号：US14021938

申请日：2013-09-09

申请人： Rajendra C. Dias ,  Lars D. Skoglund ,  Anil R. Indluru ,  Edward R. Prack ,  Danish Faruqui ,  Tyler N. Osborn ,  Amram Eitan ,  Timothy A. Gosselin

发明人： Rajendra C. Dias ,  Lars D. Skoglund ,  Anil R. Indluru ,  Edward R. Prack ,  Danish Faruqui ,  Tyler N. Osborn ,  Amram Eitan ,  Timothy A. Gosselin

IPC分类号： H01L21/56 ,  H01L23/00 ,  H01L21/48 ,  H01L21/60 ,  H01L23/31

CPC分类号： H01L21/56 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/563 ,  H01L23/3114 ,  H01L24/11 ,  H01L24/13 ,  H01L2021/60022 ,  H01L2224/0391 ,  H01L2224/0401 ,  H01L2224/05571 ,  H01L2224/05647 ,  H01L2224/11332 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/1146 ,  H01L2224/1148 ,  H01L2224/11849 ,  H01L2224/13023 ,  H01L2224/131 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/94 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2224/11 ,  H01L2924/00012 ,  H01L2924/014

摘要： Introducing an underfill material over contact pads on a surface of an integrated circuit substrate; and ablating the introduced underfill material to expose an area of the contact pads using temporally coherent electromagnetic radiation. A method including first ablating an underfill material to expose an area of contact pads on a substrate using temporally coherent electromagnetic radiation; introducing a solder to the exposed area of the contact pads; and second ablating the underfill material using temporally coherent electromagnetic radiation. A method including introducing an underfill material over contact pads on a surface of an integrated circuit substrate; defining an opening in the underfill material to expose an area of the contact pads using temporally coherent electromagnetic radiation; introducing a solder material to the exposed area of the contact pads; and after introducing the solder, removing the sacrificial material.

公开(公告)号：US20150072515A1

公开(公告)日：2015-03-12

申请号：US14021954

申请日：2013-09-09

申请人： Rajendra C. Dias ,  Lars D. Skoglund ,  Anil R. Indluru ,  Edward R. Prack ,  Danish Faruqui ,  Tyler N. Osborn

发明人： Rajendra C. Dias ,  Lars D. Skoglund ,  Anil R. Indluru ,  Edward R. Prack ,  Danish Faruqui ,  Tyler N. Osborn

IPC分类号： H01L23/00

CPC分类号： H01L24/11 ,  H01L23/3171 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/0381 ,  H01L2224/0391 ,  H01L2224/0401 ,  H01L2224/05571 ,  H01L2224/05647 ,  H01L2224/11332 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/13023 ,  H01L2224/131 ,  H01L2224/94 ,  H01L2924/12042 ,  H01L2224/11 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/014

摘要： A method including introducing a passivation material over contact pads on a surface of an integrated circuit substrate; patterning a sacrificial material on the passivation material to define openings in the sacrificial material to the contact pads; introducing solder to the contact pads; and after introducing the solder, removing the sacrificial material with the proviso that, where the sacrificial material is a photosensitive material, removing comprises using temporally coherent electromagnetic radiation. A method including introducing a passivation material over contact pads; exposing the contact pads; patterning a photosensitive material on the passivation material; introducing solder to the contact pads; and after introducing the solder, removing the photosensitive material using temporally coherent electromagnetic radiation. A method including introducing a passivation material over contact pads; exposing the contact pads; patterning a non-photosensitive material on the passivation material; introducing solder to the contact pads; and after introducing the solder, removing the non-photosensitive material.

摘要翻译： 一种方法，包括在集成电路基板的表面上的接触焊盘上引入钝化材料; 在所述钝化材料上图案化牺牲材料以在所述牺牲材料中限定到所述接触垫的开口; 将焊料引入接触焊盘; 并且在引入焊料之后，除去牺牲材料，条件是在牺牲材料是感光材料的情况下，去除包括使用时间相干的电磁辐射。 一种方法，包括在接触垫上引入钝化材料; 露出接触垫; 在钝化材料上图案化感光材料; 将焊料引入接触焊盘; 并且在引入焊料之后，使用时间相干的电磁辐射去除感光材料。 一种方法，包括在接触垫上引入钝化材料; 露出接触垫; 在钝化材料上图案化非感光材料; 将焊料引入接触焊盘; 并且在引入焊料之后，去除非感光材料。

公开(公告)号：US20140264951A1

公开(公告)日：2014-09-18

申请号：US13830126

申请日：2013-03-14

申请人： Danish Faruqui ,  Edward R. Prack ,  Sergei L. Voronov ,  David K. Wilkinson, JR. ,  Tony Dambrauskas ,  Lars D. Skoglund ,  Yoshihiro Tomita ,  Mihir A. Oka ,  Rajen C. Dias

发明人： Danish Faruqui ,  Edward R. Prack ,  Sergei L. Voronov ,  David K. Wilkinson, JR. ,  Tony Dambrauskas ,  Lars D. Skoglund ,  Yoshihiro Tomita ,  Mihir A. Oka ,  Rajen C. Dias

IPC分类号： H01L23/00

CPC分类号： H01L24/83 ,  H01L21/56 ,  H01L21/568 ,  H01L21/76898 ,  H01L23/49816 ,  H01L23/5389 ,  H01L23/544 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L24/92 ,  H01L25/0657 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/08225 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29311 ,  H01L2224/29318 ,  H01L2224/29323 ,  H01L2224/29324 ,  H01L2224/29347 ,  H01L2224/29366 ,  H01L2224/29387 ,  H01L2224/29393 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73259 ,  H01L2224/73267 ,  H01L2224/81132 ,  H01L2224/83132 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83224 ,  H01L2224/92125 ,  H01L2224/92143 ,  H01L2224/9222 ,  H01L2224/94 ,  H01L2225/06541 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10328 ,  H01L2924/10329 ,  H01L2924/10332 ,  H01L2924/10335 ,  H01L2924/10525 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1431 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2924/014 ,  H01L2224/27 ,  H01L2924/0535 ,  H01L2924/01023 ,  H01L2924/00

摘要： Embodiments of the present disclosure are directed to die adhesive films for integrated circuit (IC) packaging, as well as methods for forming and removing die adhesive films and package assemblies and systems incorporating such die adhesive films. A die adhesive film may be transparent to a first wavelength of light and photoreactive to a second wavelength of light. In some embodiments, the die adhesive film may be applied to a back or “inactive” side of a die, and the die surface may be detectable through the die adhesive film. The die adhesive film may be cured and/or marked with laser energy having the second wavelength of light. The die adhesive film may include a thermochromic dye and/or nanoparticles configured to provide laser mark contrast. UV laser energy may be used to remove the die adhesive film in order to expose underlying features such as TSV pads.

摘要翻译： 本公开的实施例涉及用于集成电路（IC）封装的芯片粘合膜，以及用于形成和去除模具粘合剂膜和封装组件的方法以及结合这种模具粘合剂膜的系统。 模具粘合剂膜可以对第一波长的光是透明的，并且对第二波长的光进行光反应。 在一些实施例中，模具粘合剂膜可以施加到模具的背面或“非活性”侧，并且模具表面可以通过模具粘合剂膜检测。 模具粘合剂膜可以用具有第二波长的光的激光能量固化和/或标记。 模具粘合剂膜可以包括被配置为提供激光标记对比度的热变色染料和/或纳米颗粒。 可以使用UV激光能量去除模具粘合剂膜以暴露诸如TSV焊盘之类的底层特征。

公开(公告)号：US20150001717A1

公开(公告)日：2015-01-01

申请号：US13930082

申请日：2013-06-28

申请人： Omkar G. Karhade ,  Nitin A. Deshpande ,  Rajendra C. Dias ,  Edvin Cetegen ,  Lars D. Skoglund

发明人： Omkar G. Karhade ,  Nitin A. Deshpande ,  Rajendra C. Dias ,  Edvin Cetegen ,  Lars D. Skoglund

IPC分类号： H01L23/31 ,  H01L23/485

CPC分类号： H01L23/485 ,  H01L21/563 ,  H01L23/49838 ,  H01L24/17 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/18 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/17505 ,  H01L2224/26175 ,  H01L2224/2919 ,  H01L2224/32058 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81203 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06568 ,  H01L2924/12042 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/0665

摘要： Underfill material flow control for reduced die-to-die spacing in semiconductor packages and the resulting semiconductor packages are described. In an example, a semiconductor apparatus includes first and second semiconductor dies, each having a surface with an integrated circuit thereon coupled to contact pads of an uppermost metallization layer of a common semiconductor package substrate by a plurality of conductive contacts, the first and second semiconductor dies separated by a spacing. A barrier structure is disposed between the first semiconductor die and the common semiconductor package substrate and at least partially underneath the first semiconductor die. An underfill material layer is in contact with the second semiconductor die and with the barrier structure, but not in contact with the first semiconductor die.

摘要翻译： 对半导体封装中的管芯间间距减小的底层填充材料流动控制以及所得到的半导体封装进行了描述。 在一个示例中，半导体器件包括第一和第二半导体管芯，每个半导体管芯具有其上具有集成电路的表面，其上通过多个导电触点与公共半导体封装衬底的最上层金属化层的接触焊盘耦合，第一和第二半导体 模具间隔开。 阻挡结构设置在第一半导体管芯和公共半导体封装衬底之间并且至少部分地位于第一半导体管芯的下方。 底部填充材料层与第二半导体管芯和阻挡结构接触，但不与第一半导体管芯接触。