公开(公告)号：US20190123498A1

公开(公告)日：2019-04-25

申请号：US16163418

申请日：2018-10-17

Applicant: Raytheon Company

Inventor： Chad Patterson ,  Duke Quach ,  Ethan S. Heinrich ,  Michael M. Fitzgibbon

IPC: H01R31/06 ,  H01R12/71 ,  H01R12/75 ,  H01R24/44 ,  H01R13/24 ,  H01R12/91 ,  H01R13/6473 ,  H01R24/86

CPC classification number: H01R31/06 ,  G01R1/07328 ,  H01R12/714 ,  H01R12/75 ,  H01R12/91 ,  H01R13/2421 ,  H01R13/2478 ,  H01R13/405 ,  H01R13/6473 ,  H01R24/44 ,  H01R24/86

Abstract: A coaxial electrical interconnect is disclosed. The coaxial electrical interconnect can include an inner conductor including an electrically conductive spring probe. The coaxial electrical interconnect can also include an outer conductor including a plurality of electrically conductive spring probes disposed about the inner conductor. Each spring probe can have a barrel and a plunger biased out of the barrel. The plunger can have a first plunger portion external to the barrel and a second plunger portion disposed partially in the barrel. The first and second plunger portions can have different diameters. A barrel of the spring probe of the inner conductor can be located proximate a plunger of at least one of the spring probes of the outer conductor.

公开(公告)号：US20170170617A1

公开(公告)日：2017-06-15

申请号：US15445841

申请日：2017-02-28

Applicant: Raytheon Company

Inventor： Chad Patterson ,  Duke Quach ,  Ethan S. Heinrich ,  Michael M. Fitzgibbon

IPC: H01R31/06 ,  H01R13/24

CPC classification number: H01R31/06 ,  G01R1/07328 ,  H01R12/714 ,  H01R12/75 ,  H01R12/91 ,  H01R13/2421 ,  H01R13/2478 ,  H01R13/405 ,  H01R13/6473 ,  H01R24/44 ,  H01R24/86

Abstract: A coaxial electrical interconnect is disclosed. The coaxial electrical interconnect can include an inner conductor including an electrically conductive spring probe. The coaxial electrical interconnect can also include an outer conductor including a plurality of electrically conductive spring probes disposed about the inner conductor. Each spring probe can have a barrel and a plunger biased out of the barrel. The plunger can have a first plunger portion external to the barrel and a second plunger portion disposed partially in the barrel. The first and second plunger portions can have different diameters. A barrel of the spring probe of the inner conductor can be located proximate a plunger of at least one of the spring probes of the outer conductor.

公开(公告)号：US09520368B1

公开(公告)日：2016-12-13

申请号：US14980602

申请日：2015-12-28

Applicant: Raytheon Company

Inventor： Samuel D. Tonomura ,  Anthony M. Petrucelli ,  Cynthia Y. Hang ,  Chad Patterson ,  Ethan S. Heinrich ,  Michael M. Fitzgibbon ,  John G. Heston

IPC: H01L23/66 ,  H01L23/00 ,  H01L23/528 ,  H01L23/522 ,  H01L23/498

CPC classification number: H01L23/66 ,  H01L23/49822 ,  H01L23/5222 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L2223/6627 ,  H01L2223/6672 ,  H01L2223/6683 ,  H01L2224/13023 ,  H01L2224/13025 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/17106 ,  H01L2224/1712 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/1423 ,  H01L2924/00012

Abstract: An integrated circuit system having: (A) a semiconductor chip with a signal strip conductor disposed on an upper surface of the chip; an active semiconductor device disposed of the upper surface of the chip electrically connected to the signal strip conductor; and a first ground plane conductor disposed on a bottom surface of the chip disposed under the signal strip conductor; and (B) a support structure having: a second ground plane disposed over, and separated from, the signal strip conductor by a dielectric region between the second ground plane and the signal strip conductor on the chip; a signal contact disposed on the bottom surface of the support structure displaced, electrically insulated, from the second ground plane conductor, and electrically connected to a portion of the signal strip conductor. The signal strip conductor, the first ground plane conductor, and the second ground plane conductor provide a stripline microwave transmission line.

Abstract translation: 一种集成电路系统，具有：（A）具有设置在所述芯片的上表面上的信号条导体的半导体芯片; 设置在所述芯片的上表面的电连接到所述信号带导体的有源半导体器件; 以及设置在设置在所述信号带状导体下方的所述芯片的底面上的第一接地面导体; 和（B）支撑结构，其具有：通过芯片上的第二接地平面和信号带导体之间的电介质区域布置在信号带状导体之上并与之隔离的第二接地面; 信号触点，其布置在所述支撑结构的底表面上，与所述第二接地平面导体电绝缘并且电连接到所述信号带导体的一部分。 信号条导体，第一接地平面导体和第二接地平面导体提供带状线微波传输线。

公开(公告)号：US10693266B2

公开(公告)日：2020-06-23

申请号：US16163418

申请日：2018-10-17

Applicant: Raytheon Company

Inventor： Chad Patterson ,  Duke Quach ,  Ethan S. Heinrich ,  Michael M. Fitzgibbon

IPC: H01R31/06 ,  H01R13/6473 ,  H01R12/75 ,  H01R12/71 ,  H01R12/91 ,  H01R13/24 ,  H01R24/44 ,  H01R24/86 ,  G01R1/073 ,  H01R13/405

Abstract: A coaxial electrical interconnect is disclosed. The coaxial electrical interconnect can include an inner conductor including an electrically conductive spring probe. The coaxial electrical interconnect can also include an outer conductor including a plurality of electrically conductive spring probes disposed about the inner conductor. Each spring probe can have a barrel and a plunger biased out of the barrel. The plunger can have a first plunger portion external to the barrel and a second plunger portion disposed partially in the barrel. The first and second plunger portions can have different diameters. A barrel of the spring probe of the inner conductor can be located proximate a plunger of at least one of the spring probes of the outer conductor.

公开(公告)号：US20170093092A1

公开(公告)日：2017-03-30

申请号：US14872001

申请日：2015-09-30

Applicant: Raytheon Company

Inventor： Chad Patterson ,  Duke Quach ,  Ethan S. Heinrich ,  Michael M. Fitzgibbon

IPC: H01R13/6473 ,  H01R12/75

CPC classification number: H01R31/06 ,  G01R1/07328 ,  H01R12/714 ,  H01R12/75 ,  H01R12/91 ,  H01R13/2421 ,  H01R13/2478 ,  H01R13/405 ,  H01R13/6473 ,  H01R24/44 ,  H01R24/86

Abstract: A coaxial electrical interconnect is disclosed. The coaxial electrical interconnect can include an inner conductor including an electrically conductive spring probe. The coaxial electrical interconnect can also include an outer conductor including a plurality of electrically conductive spring probes disposed about the inner conductor. Each spring probe can have a barrel and a plunger biased out of the barrel. The plunger can have a first plunger portion external to the barrel and a second plunger portion disposed partially in the barrel. The first and second plunger portions can have different diameters. A barrel of the spring probe of the inner conductor can be located proximate a plunger of at least one of the spring probes of the outer conductor.

公开(公告)号：US09590359B1

公开(公告)日：2017-03-07

申请号：US14872001

申请日：2015-09-30

Applicant: Raytheon Company

Inventor： Chad Patterson ,  Duke Quach ,  Ethan S. Heinrich ,  Michael M. Fitzgibbon

IPC: H01R24/00 ,  H01R13/6473 ,  H01R12/75

CPC classification number: H01R31/06 ,  G01R1/07328 ,  H01R12/714 ,  H01R12/75 ,  H01R12/91 ,  H01R13/2421 ,  H01R13/2478 ,  H01R13/405 ,  H01R13/6473 ,  H01R24/44 ,  H01R24/86

Abstract: A coaxial electrical interconnect is disclosed. The coaxial electrical interconnect can include an inner conductor including an electrically conductive spring probe. The coaxial electrical interconnect can also include an outer conductor including a plurality of electrically conductive spring probes disposed about the inner conductor. Each spring probe can have a barrel and a plunger biased out of the barrel. The plunger can have a first plunger portion external to the barrel and a second plunger portion disposed partially in the barrel. The first and second plunger portions can have different diameters. A barrel of the spring probe of the inner conductor can be located proximate a plunger of at least one of the spring probes of the outer conductor.

Abstract translation: 公开了一种同轴电互连。 同轴电气互连可以包括包括导电弹簧探针的内部导体。 同轴电互连还可以包括外导体，其包括围绕内导体设置的多个导电弹簧探针。 每个弹簧探针都可以有一个筒体和一个柱塞偏压出筒体。 柱塞可以具有在筒外部的第一柱塞部分和部分地设置在筒体中的第二柱塞部分。 第一和第二柱塞部分可以具有不同的直径。 内导体的弹簧探针的一个筒体可以位于外导体的至少一个弹簧探针的柱塞附近。

公开(公告)号：US09391684B1

公开(公告)日：2016-07-12

申请号：US14851532

申请日：2015-09-11

Applicant: RAYTHEON COMPANY

Inventor： Harry Marr ,  Jeffery Jay Logan ,  David Couto ,  Chad Patterson

IPC: H04L25/03 ,  H04B7/06 ,  H04B1/04

CPC classification number: H04B7/0617

Abstract: An asymmetric power amplifier includes: an input port for receiving a multi carrier signal including a first subcarrier and a second subcarrier; a first tunable analog filter for filtering the received multi carrier signal into a first signal of the first subcarrier; a second tunable analog filter for filtering the received multi carrier signal into a second signal of the second subcarrier; an amplifier for amplifying the first signal of the first subcarrier; a power amplifier for power amplifying the second signal of the second subcarrier; a combiner for power combining the amplified first signal and the amplified second signal to form a power combined multi carrier signal; and an output port for outputting the power combined multi carrier signal to be transmitted by a transmitter.

Abstract translation: 非对称功率放大器包括：用于接收包括第一子载波和第二副载波的多载波信号的输入端口; 第一可调模拟滤波器，用于将所接收的多载波信号滤波成第一子载波的第一信号; 第二可调模拟滤波器，用于将接收的多载波信号滤波成第二子载波的第二信号; 放大器，用于放大第一副载波的第一信号; 功率放大器，用于对第二副载波的第二信号进行功率放大; 组合器，用于将放大的第一信号和放大的第二信号组合以形成功率组合多载波信号; 以及用于输出要由发射机发射的功率合成多载波信号的输出端口。