利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

10 条记录 (耗时 0.016 秒)

    Coaxial electrical interconnect
    2.
    发明授权
    Coaxial electrical interconnect 有权
    同轴电气互连

    公开(公告)号：US09590359B1

    公开(公告)日：2017-03-07

    申请号：US14872001

    申请日：2015-09-30

    申请人： Raytheon Company

    发明人： Chad Patterson ,  Duke Quach ,  Ethan S. Heinrich ,  Michael M. Fitzgibbon

    IPC分类号： H01R24/00 ,  H01R13/6473 ,  H01R12/75

    CPC分类号： H01R31/06 ,  G01R1/07328 ,  H01R12/714 ,  H01R12/75 ,  H01R12/91 ,  H01R13/2421 ,  H01R13/2478 ,  H01R13/405 ,  H01R13/6473 ,  H01R24/44 ,  H01R24/86

    摘要： A coaxial electrical interconnect is disclosed. The coaxial electrical interconnect can include an inner conductor including an electrically conductive spring probe. The coaxial electrical interconnect can also include an outer conductor including a plurality of electrically conductive spring probes disposed about the inner conductor. Each spring probe can have a barrel and a plunger biased out of the barrel. The plunger can have a first plunger portion external to the barrel and a second plunger portion disposed partially in the barrel. The first and second plunger portions can have different diameters. A barrel of the spring probe of the inner conductor can be located proximate a plunger of at least one of the spring probes of the outer conductor.

    摘要翻译： 公开了一种同轴电互连。 同轴电气互连可以包括包括导电弹簧探针的内部导体。 同轴电互连还可以包括外导体，其包括围绕内导体设置的多个导电弹簧探针。 每个弹簧探针都可以有一个筒体和一个柱塞偏压出筒体。 柱塞可以具有在筒外部的第一柱塞部分和部分地设置在筒体中的第二柱塞部分。 第一和第二柱塞部分可以具有不同的直径。 内导体的弹簧探针的一个筒体可以位于外导体的至少一个弹簧探针的柱塞附近。

    Coaxial electrical interconnect
    3.
    发明授权
    Coaxial electrical interconnect 有权

    公开(公告)号：US10693266B2

    公开(公告)日：2020-06-23

    申请号：US16163418

    申请日：2018-10-17

    申请人： Raytheon Company

    发明人： Chad Patterson ,  Duke Quach ,  Ethan S. Heinrich ,  Michael M. Fitzgibbon

    IPC分类号： H01R31/06 ,  H01R13/6473 ,  H01R12/75 ,  H01R12/71 ,  H01R12/91 ,  H01R13/24 ,  H01R24/44 ,  H01R24/86 ,  G01R1/073 ,  H01R13/405

    摘要： A coaxial electrical interconnect is disclosed. The coaxial electrical interconnect can include an inner conductor including an electrically conductive spring probe. The coaxial electrical interconnect can also include an outer conductor including a plurality of electrically conductive spring probes disposed about the inner conductor. Each spring probe can have a barrel and a plunger biased out of the barrel. The plunger can have a first plunger portion external to the barrel and a second plunger portion disposed partially in the barrel. The first and second plunger portions can have different diameters. A barrel of the spring probe of the inner conductor can be located proximate a plunger of at least one of the spring probes of the outer conductor.

    Tailored coldplate geometries for forming multiple coefficient of thermal expansion (CTE) zones
    6.
    发明授权
    Tailored coldplate geometries for forming multiple coefficient of thermal expansion (CTE) zones 有权

    公开(公告)号：US11032947B1

    公开(公告)日：2021-06-08

    申请号：US16792681

    申请日：2020-02-17

    申请人： Raytheon Company

    发明人： Craig H. McCordic ,  Joseph R. Ellsworth ,  Todd E. Southard ,  Ethan S. Heinrich ,  Dimitry Zarkh

    IPC分类号： H05K7/20 ,  H01L23/373 ,  H01L23/367 ,  H05K1/02 ,  H01L25/07 ,  H01L25/065

    摘要： An apparatus includes a coldplate configured to be thermally coupled to a structure to be cooled and to remove thermal energy from the structure. The coldplate includes (i) first and second outer layers having at least one first material and (ii) a third layer embedded in the outer layers and having at least one second material. The first and second materials have different coefficients of thermal expansion (CTEs). The third layer is embedded non-uniformly in the outer layers so that different zones of the coldplate have different local CTEs. The third layer may include openings extending through the second material(s), and projections of the first material(s) from at least one of the first and second outer layers may partially or completely fill the openings. The first and second outer layers may include aluminum or an aluminum alloy, and the third layer may include aluminum silicon carbide or thermal pyrolytic graphite.