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    Coaxial electrical interconnect
    2.
    发明授权
    Coaxial electrical interconnect 有权
    同轴电气互连

    公开(公告)号：US09590359B1

    公开(公告)日：2017-03-07

    申请号：US14872001

    申请日：2015-09-30

    申请人： Raytheon Company

    发明人： Chad Patterson ,  Duke Quach ,  Ethan S. Heinrich ,  Michael M. Fitzgibbon

    IPC分类号： H01R24/00 ,  H01R13/6473 ,  H01R12/75

    CPC分类号： H01R31/06 ,  G01R1/07328 ,  H01R12/714 ,  H01R12/75 ,  H01R12/91 ,  H01R13/2421 ,  H01R13/2478 ,  H01R13/405 ,  H01R13/6473 ,  H01R24/44 ,  H01R24/86

    摘要： A coaxial electrical interconnect is disclosed. The coaxial electrical interconnect can include an inner conductor including an electrically conductive spring probe. The coaxial electrical interconnect can also include an outer conductor including a plurality of electrically conductive spring probes disposed about the inner conductor. Each spring probe can have a barrel and a plunger biased out of the barrel. The plunger can have a first plunger portion external to the barrel and a second plunger portion disposed partially in the barrel. The first and second plunger portions can have different diameters. A barrel of the spring probe of the inner conductor can be located proximate a plunger of at least one of the spring probes of the outer conductor.

    摘要翻译： 公开了一种同轴电互连。 同轴电气互连可以包括包括导电弹簧探针的内部导体。 同轴电互连还可以包括外导体，其包括围绕内导体设置的多个导电弹簧探针。 每个弹簧探针都可以有一个筒体和一个柱塞偏压出筒体。 柱塞可以具有在筒外部的第一柱塞部分和部分地设置在筒体中的第二柱塞部分。 第一和第二柱塞部分可以具有不同的直径。 内导体的弹簧探针的一个筒体可以位于外导体的至少一个弹簧探针的柱塞附近。

    Coaxial electrical interconnect
    3.
    发明授权
    Coaxial electrical interconnect 有权

    公开(公告)号：US10693266B2

    公开(公告)日：2020-06-23

    申请号：US16163418

    申请日：2018-10-17

    申请人： Raytheon Company

    发明人： Chad Patterson ,  Duke Quach ,  Ethan S. Heinrich ,  Michael M. Fitzgibbon

    IPC分类号： H01R31/06 ,  H01R13/6473 ,  H01R12/75 ,  H01R12/71 ,  H01R12/91 ,  H01R13/24 ,  H01R24/44 ,  H01R24/86 ,  G01R1/073 ,  H01R13/405

    摘要： A coaxial electrical interconnect is disclosed. The coaxial electrical interconnect can include an inner conductor including an electrically conductive spring probe. The coaxial electrical interconnect can also include an outer conductor including a plurality of electrically conductive spring probes disposed about the inner conductor. Each spring probe can have a barrel and a plunger biased out of the barrel. The plunger can have a first plunger portion external to the barrel and a second plunger portion disposed partially in the barrel. The first and second plunger portions can have different diameters. A barrel of the spring probe of the inner conductor can be located proximate a plunger of at least one of the spring probes of the outer conductor.

    Electronic module for motherboard
    5.
    发明授权
    Electronic module for motherboard 有权

    公开(公告)号：US11195779B2

    公开(公告)日：2021-12-07

    申请号：US16828933

    申请日：2020-03-24

    申请人： RAYTHEON COMPANY

    发明人： Michael Benjamin Brown ,  Alberto F. Viscarra ,  Michael M. Fitzgibbon ,  John A. Crockett, Jr. ,  Chad E. Patterson ,  Kevin C. Rolston ,  Duke Quach ,  Kevin P. Agustin

    IPC分类号： H01L23/40 ,  H05K7/20 ,  H05K7/10 ,  H05K3/32

    摘要： A module. In some embodiments, the module includes a substrate; a plurality of electronic components, secured to an upper surface of the substrate; a thermally conductive heat spreader, on the electronic components and in thermal contact with an electronic component of the plurality of electronic components; a standoff, between the substrate and the heat spreader; an alignment element, extending into the substrate; a hard stop, under the substrate; and a plurality of compressible interconnects, under the substrate, and extending through the hard stop. The electronic components may be within a sight area of the substrate. The module may be configured to transmit a compressive load from an upper surface of the standoff to a lower surface of the substrate through a load path not including any of the electronic components.

    ELECTRONIC MODULE FOR MOTHERBOARD
    6.
    发明申请
    ELECTRONIC MODULE FOR MOTHERBOARD 有权

    公开(公告)号：US20210043542A1

    公开(公告)日：2021-02-11

    申请号：US16828933

    申请日：2020-03-24

    申请人： RAYTHEON COMPANY

    发明人： Michael Benjamin Brown ,  Alberto F. Viscarra ,  Michael M. Fitzgibbon ,  John A. Crockett, JR. ,  Chad E. Patterson ,  Kevin C. Rolston ,  Duke Quach ,  Kevin P. Agustin

    IPC分类号： H01L23/40 ,  G06F1/20 ,  H05K3/32 ,  H05K7/10 ,  H05K7/20

    摘要： A module. In some embodiments, the module includes a substrate; a plurality of electronic components, secured to an upper surface of the substrate; a thermally conductive heat spreader, on the electronic components and in thermal contact with an electronic component of the plurality of electronic components; a standoff, between the substrate and the heat spreader; an alignment element, extending into the substrate; a hard stop, under the substrate; and a plurality of compressible interconnects, under the substrate, and extending through the hard stop. The electronic components may be within a sight area of the substrate. The module may be configured to transmit a compressive load from an upper surface of the standoff to a lower surface of the substrate through a load path not including any of the electronic components.