Abstract:
Disclosed is a semiconductor device that suppresses stress-induced resistance value changes. The semiconductor device includes a resistance correction circuit. The resistance correction circuit includes a first resistor whose stress-resistance value relationship is a first relationship, a second resistor whose stress-resistance value relationship is a second relationship, and a correction section that controls the resistance value of a correction target resistor. The correction section detects the difference between the resistance value of the first resistor and the resistance value of the second resistor and corrects, in accordance with the result of detection, the resistance value of the correction target resistor.
Abstract:
Disclosed is a semiconductor device that suppresses stress-induced resistance value changes. The semiconductor device includes a resistance correction circuit. The resistance correction circuit includes a first resistor whose stress-resistance value relationship is a first relationship, a second resistor whose stress-resistance value relationship is a second relationship, and a correction section that controls the resistance value of a correction target resistor. The correction section detects the difference between the resistance value of the first resistor and the resistance value of the second resistor and corrects, in accordance with the result of detection, the resistance value of the correction target resistor.
Abstract:
A resistance element includes a conductor, the conductor having a repeating pattern of: a first conductive layer formed on a first interlayer insulating layer on a semiconductor substrate; a second conductive layer formed on a second interlayer insulating layer different from the first interlayer insulating layer; and an interlayer conductive layer connecting the first conductive layer and the second conductive layer, and the second conductive layer has a resistance-value fluctuation characteristic opposite to a resistance-value fluctuation characteristic of the first conductive layer after a heat treatment.
Abstract:
A semiconductor device includes a reference voltage generation circuit configured to generate reference voltages Va and Vb capable of adjusting a primary temperature characteristic, and an oscillation circuit configured to output an oscillation signal using the reference voltages Va and Vb, in which the oscillation circuit includes a frequency/current conversion circuit that is driven by the reference voltage Va and outputs a current Ie in accordance with a frequency of a feedback signal, a control voltage generation circuit configured to generate a control voltage in accordance with a potential difference between a voltage in accordance with the current Ie and the reference voltage Vb, a voltage control oscillation circuit configured to output the oscillation signal having a frequency in accordance with the control voltage, and a frequency division circuit configured to divide a frequency of the oscillation signal and output the resulting signal as the feedback signal.
Abstract:
There is provided a semiconductor device which can provide desired output characteristics suitable to applications. A semiconductor device 10 includes a temperature sensing unit 11 which generates an analog sensing signal corresponding to a temperature, and an AD converter unit 12 which converts the analog sensing signal into a digital output signal corresponding to an adjusted temperature change rate based on a temperature change rate adjustment signal for adjusting the temperature change rate. The temperature change rate refers to a change in a detected temperature per bit of a digital output signal.
Abstract:
Disclosed is a semiconductor device that suppresses stress-induced resistance value changes. The semiconductor device includes a resistance correction circuit. The resistance correction circuit includes a first resistor whose stress-resistance value relationship is a first relationship, a second resistor whose stress-resistance value relationship is a second relationship, and a correction section that controls the resistance value of a correction target resistor. The correction section detects the difference between the resistance value of the first resistor and the resistance value of the second resistor and corrects, in accordance with the result of detection, the resistance value of the correction target resistor.
Abstract:
A polycrystalline silicon resistor is large in coefficient of fluctuation in resistance between before and after the completion of a package molding process. To enable highly accurate trimming, it is desired to implement a resistor that is hardly subjected to stress produced in a substrate during a package molding process. A resistance element is formed of a plurality of wiring layers and has a repetitive pattern of a first conductive layer formed in a first wiring layer, a second conductive layer formed in a second wiring layer, and an interlayer conductive layer coupling the first conductive layer and the second conductive layer together.
Abstract:
A frequency-locked loop circuit has a digital control oscillator that generates a clock, and an FLL controller that generates a frequency control code to control an oscillation frequency of the clock. The FLL controller has a frequency comparison unit and a delay code control unit. The frequency comparison unit compares a frequency of a clock generated by the digital control oscillator with a frequency of a multiplied reference clock. The delay code control unit generates, based on a comparison result of the frequency comparison unit, the frequency control code so that the frequency of the clock generated by the digital control oscillator matches the frequency of the multiplied reference clock. The frequency comparison unit determines the frequency of the clock by using first and second thresholds. The delay code control unit generates the frequency control code according to a determination of the frequency comparison unit.
Abstract:
Disclosed is a semiconductor device that suppresses stress-induced resistance value changes. The semiconductor device includes a resistance correction circuit. The resistance correction circuit includes a first resistor whose stress-resistance value relationship is a first relationship, a second resistor whose stress-resistance value relationship is a second relationship, and a correction section that controls the resistance value of a correction target resistor. The correction section detects the difference between the resistance value of the first resistor and the resistance value of the second resistor and corrects, in accordance with the result of detection, the resistance value of the correction target resistor.
Abstract:
Disclosed is a semiconductor device that suppresses stress-induced resistance value changes. The semiconductor device includes a resistance correction circuit. The resistance correction circuit includes a first resistor whose stress-resistance value relationship is a first relationship, a second resistor whose stress-resistance value relationship is a second relationship, and a correction section that controls the resistance value of a correction target resistor. The correction section detects the difference between the resistance value of the first resistor and the resistance value of the second resistor and corrects, in accordance with the result of detection, the resistance value of the correction target resistor.