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公开(公告)号：US09377825B2
公开(公告)日：2016-06-28
申请号：US14296552
申请日：2014-06-05
Applicant: Renesas Electronics Corporation
Inventor： Minoru Shinohara , Makoto Araki , Michiaki Sugiyama
IPC: H01L23/50 , G06F1/18 , G11C5/02 , G11C5/06 , H01L23/538 , H01L25/065 , H01L25/18 , H01L23/00
CPC classification number: G06F1/185 , G11C5/02 , G11C5/063 , H01L23/5388 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/97 , H01L25/0657 , H01L25/18 , H01L2224/05553 , H01L2224/05554 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48145 , H01L2224/48225 , H01L2224/48227 , H01L2224/49171 , H01L2224/49175 , H01L2224/97 , H01L2225/06506 , H01L2225/0651 , H01L2225/06527 , H01L2225/06562 , H01L2225/06572 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01023 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/30105 , H01L2924/00014 , H01L2224/85 , H01L2924/00 , H01L2924/00012
Abstract: A memory card has a wiring board, four memory chips stacked on a main surface of the wiring board, and a controller chip and an interposer mounted on a surface of the memory chip of the uppermost layer. The memory chips are stacked on the surface of the wiring board so that their long sides are directed in the same direction as that of the long side of the wiring board. The memory chip of the lowermost layer is mounted on the wiring board in a dislocated manner by a predetermined distance in a direction toward a front end of the memory card so as not to overlap the pads of the wiring board. The three memory chips stacked on the memory chip of the lowermost layer are disposed so that their short sides on which pads are formed are located at the front end of the memory card.
Abstract translation: 存储卡具有布线板，堆叠在布线板的主表面上的四个存储芯片，以及安装在最上层的存储芯片的表面上的控制器芯片和插入器。 存储芯片堆叠在布线板的表面上，使得它们的长边沿着与布线板的长边方向相同的方向。 最下层的存储芯片以错位的方式在朝向存储卡前端的方向上以预定的距离安装在布线板上，以便不与布线板的焊盘重叠。 堆叠在最下层的存储芯片上的三个存储芯片被布置成使得它们在其上形成焊盘的短边位于存储卡的前端。
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公开(公告)号：US08754534B2
公开(公告)日：2014-06-17
申请号：US13673990
申请日：2012-11-09
Applicant: Renesas Electronics Corporation
Inventor： Minoru Shinohara , Makoto Araki , Michiaki Sugiyama
CPC classification number: G06F1/185 , G11C5/02 , G11C5/063 , H01L23/5388 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/97 , H01L25/0657 , H01L25/18 , H01L2224/05553 , H01L2224/05554 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48145 , H01L2224/48225 , H01L2224/48227 , H01L2224/49171 , H01L2224/49175 , H01L2224/97 , H01L2225/06506 , H01L2225/0651 , H01L2225/06527 , H01L2225/06562 , H01L2225/06572 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01023 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/30105 , H01L2924/00014 , H01L2224/85 , H01L2924/00 , H01L2924/00012
Abstract: A memory card has a wiring board, four memory chips stacked on a main surface of the wiring board, and a controller chip and an interposer mounted on a surface of the memory chip of the uppermost layer. The memory chips are stacked on the surface of the wiring board so that their long sides are directed in the same direction as that of the long side of the wiring board. The memory chip of the lowermost layer is mounted on the wiring board in a dislocated manner by a predetermined distance in a direction toward a front end of the memory card so as not to overlap the pads of the wiring board. The three memory chips stacked on the memory chip of the lowermost layer are disposed so that their short sides on which pads are formed are located at the front end of the memory card.
Abstract translation: 存储卡具有布线板，堆叠在布线板的主表面上的四个存储芯片，以及安装在最上层的存储芯片的表面上的控制器芯片和插入器。 存储芯片堆叠在布线板的表面上，使得它们的长边沿着与布线板的长边方向相同的方向。 最下层的存储芯片以错位的方式在朝向存储卡前端的方向上以预定的距离安装在布线板上，以便不与布线板的焊盘重叠。 堆叠在最下层的存储芯片上的三个存储芯片被布置成使得它们在其上形成焊盘的短边位于存储卡的前端。
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