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    METHOD FOR STABILIZED POLISHING PROCESS
    1.
    发明申请
    METHOD FOR STABILIZED POLISHING PROCESS 审中-公开
    用于稳定抛光过程的方法

    公开(公告)号：US20070062815A1

    公开(公告)日：2007-03-22

    申请号：US11532258

    申请日：2006-09-15

    申请人： Renhe Jia ,  Jie Diao ,  Stan Tsai ,  You Wang ,  Laksh Karuppiah

    发明人： Renhe Jia ,  Jie Diao ,  Stan Tsai ,  You Wang ,  Laksh Karuppiah

    IPC分类号： C25C1/22

    CPC分类号： B23H5/08 ,  C25D5/18 ,  C25F3/00 ,  C25F3/02 ,  C25F7/00 ,  H01L21/32125

    摘要： A method for electrochemically processing a substrate is provided. In one embodiment, a method for electrochemically processing a substrate includes processing a substrate using a multi-step routine that includes a first processing period performed using a varying voltage to achieve a target removal current followed by a second processing period performed using a constant voltage.

    摘要翻译： 提供了一种用于电化学处理衬底的方法。 在一个实施例中，用于电化学处理衬底的方法包括使用包括使用变化电压执行的第一处理周期的多步骤例程来处理衬底，以实现目标去除电流，接着是使用恒定电压执行的第二处理周期。

    Methods for electrochemical processing with pre-biased cells
    2.
    发明申请
    Methods for electrochemical processing with pre-biased cells 审中-公开
    使用预偏置电池进行电化学处理的方法

    公开(公告)号：US20070158207A1

    公开(公告)日：2007-07-12

    申请号：US11326647

    申请日：2006-01-06

    申请人： Jie Diao ,  Renhe Jia ,  You Wang ,  Gerald Alonzo ,  Stan Tsai ,  Lakshmanan Karuppiah

    发明人： Jie Diao ,  Renhe Jia ,  You Wang ,  Gerald Alonzo ,  Stan Tsai ,  Lakshmanan Karuppiah

    IPC分类号： B23H3/00

    CPC分类号： B23H5/08 ,  B24B53/017 ,  C25F1/00 ,  C25F3/02

    摘要： A method for electrochemically processing a substrate is provided. In one embodiment, the method includes performing a conditioning procedure on a processing pad having a plurality of process cells, energizing the process cells by applying a voltage to the conditioned processing pad, placing a substrate having at least a conductive layer disposed thereon on the energized pad, and removing at least a portion of the conductive layer in the energized process cells. In another embodiment, a method for polishing a substrate includes placing an unused conductive pad having a plurality of process cells on a platen of a processing system, breaking in the pad on the platen, energizing the process cells by applying a voltage to the broken-in pad, placing a substrate having at least a conductive layer disposed thereon on the energized pad, and removing at least a portion of the conductive layer in the energized cells.

    摘要翻译： 提供了一种用于电化学处理衬底的方法。 在一个实施例中，该方法包括在具有多个处理单元的处理垫上执行调节程序，通过向经调节的处理垫施加电压来激励处理单元，将其上布置有至少一个导电层的基板放置在通电 并且在通电的处理单元中去除导电层的至少一部分。 在另一个实施例中，用于抛光衬底的方法包括将具有多个处理单元的未使用的导电焊盘放置在处理系统的压板上，在压板上的焊盘中断开， 在衬垫中，将具有至少其上设置有导电层的衬底放置在通电焊盘上，以及去除通电电池中的至少一部分导电层。

    Process and composition for electrochemical mechanical polishing
    3.
    发明申请
    Process and composition for electrochemical mechanical polishing 审中-公开
    电化学机械抛光的工艺和组成

    公开(公告)号：US20060249395A1

    公开(公告)日：2006-11-09

    申请号：US11389867

    申请日：2006-03-27

    申请人： You Wang ,  Junzi Zhao ,  Jie Diao ,  Renhe Jia ,  Stan Tsai ,  Lakshmanan Karuppiah ,  Robert Ewald

    发明人： You Wang ,  Junzi Zhao ,  Jie Diao ,  Renhe Jia ,  Stan Tsai ,  Lakshmanan Karuppiah ,  Robert Ewald

    IPC分类号： C09K13/00 ,  B23H9/00 ,  B23H3/00

    CPC分类号： C09K3/1463 ,  B23H5/08

    摘要： Compositions and methods for processing a substrate having a conductive material layer disposed thereon are provided. In one embodiment, a composition for processing a substrate having a conductive material layer disposed thereon is provided which composition includes an acid based electrolyte, a chelating agent, a corrosion inhibitor, a passivating polymeric material, a pH adjusting agent, a leveler a solvent, and a pH between about 3 and about 10. The composition is used in a method to form a passivation layer on the conductive material layer, abrading the passivation layer to expose a portion of the conductive material layer, applying a bias to the substrate, and removing the conductive material layer.

    摘要翻译： 提供了用于处理其上设置有导电材料层的基板的组合物和方法。 在一个实施方案中，提供了一种用于处理其上设置有导电材料层的基材的组合物，其组成包括酸性电解质，螯合剂，缓蚀剂，钝化聚合物材料，pH调节剂，整理剂，溶剂， 并且pH在约3至约10之间。该组合物用于在导电材料层上形成钝化层的方法，研磨钝化层以暴露导电材料层的一部分，向衬底施加偏压，以及 去除导电材料层。

    Method and apparatus for foam removal in an electrochemical mechanical substrate polishing process
    6.
    发明申请
    Method and apparatus for foam removal in an electrochemical mechanical substrate polishing process 审中-公开
    在电化学机械衬底抛光过程中泡沫去除的方法和装置

    公开(公告)号：US20070181442A1

    公开(公告)日：2007-08-09

    申请号：US11346891

    申请日：2006-02-03

    申请人： Renhe Jia ,  Jie Diao ,  You Wang ,  Stan Tsai ,  Lakshmanan Karuppiah

    发明人： Renhe Jia ,  Jie Diao ,  You Wang ,  Stan Tsai ,  Lakshmanan Karuppiah

    IPC分类号： B23H7/00

    CPC分类号： B23H5/08 ,  B24B53/001 ,  B24B53/017 ,  C25F7/00

    摘要： The embodiments of the invention generally relate to a method and apparatus for processing a substrate where reduced defect formation is desired. Embodiments of the invention may be beneficially practiced in chemical mechanical polishing and electrochemical mechanical polishing processes, among other processes where reduction in defect formation due to foam formation is desired. In one embodiment, a processing system for planarizing a substrate is provided that includes a platen, a pad disposed on the platen, a carrier head configured to retain the substrate against the pad while contacting an electronically conductive processing solution; and a foam removal assembly. The foam removal assembly is configured to remove foam from the electrically conductive processing solution, wherein a gap exists between a surface of the electrically conductive processing solution and a bottom edge of the foam removal assembly.

    摘要翻译： 本发明的实施例一般涉及用于处理需要减少缺陷形成的衬底的方法和装置。 在化学机械抛光和电化学机械抛光工艺中，本发明的实施例以及其它需要减少形成泡沫的缺陷形成工艺也是有益的。 在一个实施例中，提供了一种用于平坦化衬底的处理系统，其包括压板，设置在压板上的衬垫，构造成在接触电子导电处理溶液的同时将衬底保持抵靠衬垫的载体头; 和泡沫去除组件。 泡沫去除组件被配置为从导电处理溶液中除去泡沫，其中在导电处理溶液的表面和泡沫去除组件的底部边缘之间存在间隙。

    Process and composition for electrochemical mechanical polishing
    9.
    发明申请
    Process and composition for electrochemical mechanical polishing 审中-公开
    电化学机械抛光的工艺和组成

    公开(公告)号：US20060249394A1

    公开(公告)日：2006-11-09

    申请号：US11251630

    申请日：2005-10-14

    申请人： Renhe Jia ,  You Wang ,  Zhihong Wang ,  Jie Diao ,  Daxin Mao ,  Stan Tsai ,  Lakshmanan Karuppiah ,  Liang-Yuh Chen

    发明人： Renhe Jia ,  You Wang ,  Zhihong Wang ,  Jie Diao ,  Daxin Mao ,  Stan Tsai ,  Lakshmanan Karuppiah ,  Liang-Yuh Chen

    IPC分类号： C09K13/00 ,  B23H9/00 ,  C25F3/00 ,  C09K13/06

    CPC分类号： C25F3/02 ,  B23H5/08 ,  C09K3/1463

    摘要： Compositions and methods for processing a substrate having a conductive material layer disposed thereon are provided. In one embodiment, a composition for processing a substrate having a conductive material layer disposed thereon is provided which composition includes an acid based electrolyte, a chelating agent, a corrosion inhibitor, a passivating polymeric material, a pH adjusting agent, a solvent, and a pH between about 3 and about 10. The composition is used in a method to form a passivation layer on the conductive material layer, abrading the passivation layer to expose a portion of the conductive material layer, applying a bias to the substrate, and removing the conductive material layer.

    摘要翻译： 提供了用于处理其上设置有导电材料层的基板的组合物和方法。 在一个实施方案中，提供了一种用于处理其上设置导电材料层的基材的组合物，其组成包括酸性电解质，螯合剂，缓蚀剂，钝化聚合物材料，pH调节剂，溶剂和 pH为约3至约10.该组合物用于在导电材料层上形成钝化层的方法，研磨钝化层以暴露导电材料层的一部分，向衬底施加偏压，以及去除 导电材料层。