公开(公告)号：US08439723B2

公开(公告)日：2013-05-14

申请号：US12189641

申请日：2008-08-11

申请人： Robert A. Marks ,  Christopher Heung-Gyun Lee ,  Garlen C. Leung ,  Gregory E. Menk ,  Jie Diao ,  Erik S. Rondum

发明人： Robert A. Marks ,  Christopher Heung-Gyun Lee ,  Garlen C. Leung ,  Gregory E. Menk ,  Jie Diao ,  Erik S. Rondum

IPC分类号： B24B49/14

CPC分类号： B24B37/015

摘要： A chemical mechanical apparatus comprises a polishing platen, a roller pad assembly capable of advancing a polishing pad across the platen, a substrate carrier to press a substrate against the polishing pad, and a heater to heat the substrate to a temperature sufficiently high to provide a rate of removal of material from the substrate that compensates for the wear of the polishing pad.

摘要翻译： 一种化学机械装置包括抛光台板，能够使抛光垫穿过压板的滚子垫组件，将衬底压靠在抛光垫上的衬底载体，以及将衬底加热到​​足够高的温度以提供 从衬底去除材料的速率，其补偿抛光垫的磨损。

公开(公告)号：US20100035515A1

公开(公告)日：2010-02-11

申请号：US12189641

申请日：2008-08-11

申请人： Robert Marks ,  Christopher Heung-Gyun Lee ,  Garlen C. Leung ,  Gregory E. Menk ,  Jie Diao ,  Erik S. Rondum

发明人： Robert Marks ,  Christopher Heung-Gyun Lee ,  Garlen C. Leung ,  Gregory E. Menk ,  Jie Diao ,  Erik S. Rondum

IPC分类号： B24B49/14 ,  B24B29/02

CPC分类号： B24B37/015

摘要： A chemical mechanical apparatus comprises a polishing platen, a roller pad assembly capable of advancing a polishing pad across the platen, a substrate carrier to press a substrate against the polishing pad, and a heater to heat the substrate to a temperature sufficiently high to provide a rate of removal of material from the substrate that compensates for the wear of the polishing pad.

摘要翻译： 一种化学机械装置包括抛光台板，能够使抛光垫穿过压板的滚子垫组件，将衬底压靠在抛光垫上的衬底载体，以及将衬底加热到​​足够高的温度以提供 从衬底去除材料的速率，其补偿抛光垫的磨损。

公开(公告)号：US08211325B2

公开(公告)日：2012-07-03

申请号：US12757767

申请日：2010-04-09

申请人： Jie Diao ,  Garlen C. Leung ,  Christopher Heung-Gyun Lee ,  Lakshmanan Karuppiah

发明人： Jie Diao ,  Garlen C. Leung ,  Christopher Heung-Gyun Lee ,  Lakshmanan Karuppiah

IPC分类号： B44C1/22 ,  C03C15/00 ,  C03C25/68 ,  C23F1/00

CPC分类号： H01L21/31053 ,  B24B37/042 ,  B24B37/245 ,  H01L21/76229

摘要： A method and apparatus for polishing or planarizing a pre-metal dielectric layer by a chemical mechanical polishing process are provided. The method comprises providing a semiconductor substrate having feature definitions formed thereon, forming a pre-metal dielectric layer over the substrate, wherein the as-deposited pre-metal dielectric layer has an uneven surface topography, and planarizing the uneven surface topography of the pre-metal dielectric layer using chemical mechanical polishing techniques, wherein planarizing the uneven surface topography comprises polishing the pre-metal dielectric layer with a fixed abrasive polishing pad and a first polishing composition to remove a bulk portion of the pre-metal dielectric layer and achieve a first predetermined planarity, and polishing the pre-metal dielectric layer with a non-abrasive polishing pad and high selectivity slurry to remove a residual portion of the pre-metal dielectric and achieve a second predetermined planarity.

摘要翻译： 提供了一种通过化学机械抛光工艺抛光或平坦化预金属介电层的方法和设备。 该方法包括提供其上形成有特征定义的半导体衬底，在衬底上形成预金属介电层，其中所沉积的预金属介电层具有不平坦的表面形貌，并且平坦化前预处理电介质层的不平坦表面形貌， 使用化学机械抛光技术的金属介电层，其中平坦化所述不平坦表面形貌包括用固定的研磨抛光垫和第一抛光组合物抛光所述预金属介电层，以去除所述金属前介电层的主体部分并实现第一 预定的平面度，以及用非磨料抛光垫和高选择性浆料抛光预金属介电层，以去除前金属电介质的剩余部分并实现第二预定平面度。

公开(公告)号：US07063597B2

公开(公告)日：2006-06-20

申请号：US10693683

申请日：2003-10-24

申请人： Gopalakrishna B. Prabhu ,  Thomas H. Osterheld ,  Garlen C. Leung ,  Adam H. Zhong ,  Peter McReynolds ,  Yi-Yung Tao ,  Gregory E. Menk ,  Vasanth N. Mohan ,  Christopher Heung-Gyun Lee

发明人： Gopalakrishna B. Prabhu ,  Thomas H. Osterheld ,  Garlen C. Leung ,  Adam H. Zhong ,  Peter McReynolds ,  Yi-Yung Tao ,  Gregory E. Menk ,  Vasanth N. Mohan ,  Christopher Heung-Gyun Lee

IPC分类号： B24B1/00

CPC分类号： H01L21/76229 ,  H01L21/31053

摘要： Methods and compositions are provided for planarizing a substrate surface with reduced or minimal topographical defect formation during a polishing process for dielectric materials. In one aspect a method is provided for polishing a substrate containing two or more dielectric layers, such as silicon oxide, silicon nitride, silicon oxynitride, with at least one processing step using a fixed-abrasive polishing article as a polishing article. The processing steps may be used to remove all, substantially all, or a portion of the one or more dielectric layers, which may include removal of the topography, the bulk dielectric, or residual dielectric material of a dielectric layer in two or more steps.

摘要翻译： 提供的方法和组合物用于在电介质材料的抛光工艺期间使衬底表面平坦化，减少或最小的形貌缺陷形成。 在一个方面，提供一种用于使用固定磨料抛光制品作为抛光制品的至少一个加工步骤来研磨含有两个或更多个介电层的衬底的方法，例如氧化硅，氮化硅，氮氧化硅。 处理步骤可以用于去除一个或多个介电层的全部，基本上全部或一部分，其可以包括以两个或更多个步骤去除介电层的形貌，体电介质或残余电介质材料。

公开(公告)号：US20100285666A1

公开(公告)日：2010-11-11

申请号：US12757767

申请日：2010-04-09

申请人： JIE DIAO ,  Garlen C. Leung ,  Christopher Heung-Gyun Lee ,  Lakshmanan Karuppiah

发明人： JIE DIAO ,  Garlen C. Leung ,  Christopher Heung-Gyun Lee ,  Lakshmanan Karuppiah

IPC分类号： H01L21/306

CPC分类号： H01L21/31053 ,  B24B37/042 ,  B24B37/245 ,  H01L21/76229

摘要： A method and apparatus for polishing or planarizing a pre-metal dielectric layer by a chemical mechanical polishing process are provided. The method comprises providing a semiconductor substrate having feature definitions formed thereon, forming a pre-metal dielectric layer over the substrate, wherein the as-deposited pre-metal dielectric layer has an uneven surface topography, and planarizing the uneven surface topography of the pre-metal dielectric layer using chemical mechanical polishing techniques, wherein planarizing the uneven surface topography comprises polishing the pre-metal dielectric layer with a fixed abrasive polishing pad and a first polishing composition to remove a bulk portion of the pre-metal dielectric layer and achieve a first predetermined planarity, and polishing the pre-metal dielectric layer with a non-abrasive polishing pad and high selectivity slurry to remove a residual portion of the pre-metal dielectric and achieve a second predetermined planarity.

摘要翻译： 提供了一种通过化学机械抛光工艺抛光或平坦化预金属介电层的方法和设备。 该方法包括提供其上形成有特征定义的半导体衬底，在衬底上形成预金属介电层，其中所沉积的预金属介电层具有不平坦的表面形貌，并且平坦化前预处理电介质层的不平坦表面形貌， 使用化学机械抛光技术的金属介电层，其中平坦化所述不平坦表面形貌包括用固定的研磨抛光垫和第一抛光组合物抛光所述预金属介电层，以去除所述金属前介电层的主体部分并实现第一 预定的平面度，以及用非磨料抛光垫和高选择性浆料抛光预金属介电层，以去除前金属电介质的剩余部分并实现第二预定平面度。

公开(公告)号：US07553214B2

公开(公告)日：2009-06-30

申请号：US11707548

申请日：2007-02-15

申请人： Gregory E. Menk ,  Peter McReynolds ,  Erik S. Rondum ,  Anand N. Iyer ,  Gopalakrishna B. Prabhu ,  Garlen C. Leung

发明人： Gregory E. Menk ,  Peter McReynolds ,  Erik S. Rondum ,  Anand N. Iyer ,  Gopalakrishna B. Prabhu ,  Garlen C. Leung

IPC分类号： B24B49/12 ,  B24D11/00

CPC分类号： B24B21/06 ,  B24B21/04 ,  B24B21/12 ,  B24B37/12 ,  B24B37/205 ,  B24B37/26 ,  B24D11/001

摘要： A method is described. The method includes contacting a non-solid material to a non-linear edge of a sheet of polishing material, and causing the non-solid material to solidify to form a window that contacts the non-linear edge of the polishing material.

摘要翻译： 描述了一种方法。 该方法包括使非固体材料与抛光材料片的非线性边缘接触，并使非固体材料固化以形成接触抛光材料的非线性边缘的窗口。

公开(公告)号：US20100112919A1

公开(公告)日：2010-05-06

申请号：US12263908

申请日：2008-11-03

申请人： Benjamin A. Bonner ,  Gopalakrishna B. Prabhu ,  Erik S. Rondum ,  Gregory E. Menk ,  Anand N. Iyer ,  Peter McReynolds ,  Garlen C. Leung

发明人： Benjamin A. Bonner ,  Gopalakrishna B. Prabhu ,  Erik S. Rondum ,  Gregory E. Menk ,  Anand N. Iyer ,  Peter McReynolds ,  Garlen C. Leung

IPC分类号： B24D11/00

CPC分类号： B24D11/003 ,  B24B21/004 ,  B24B37/205

摘要： A chemical mechanical polishing article can be a single contiguous layer having a polishing surface, the layer being an elongated substantially rectangular sheet having a width and a length at least four times greater than the width. Forming a polishing article can include depositing a liquid precursor on a moving belt, at least partially curing the liquid precursor while on the moving belt to form a polishing layer, and detaching the polishing layer from the belt.

摘要翻译： 化学机械抛光制品可以是具有抛光表面的单个邻接层，该层是具有宽度和长度至少比宽度大至少四倍的长度的基本上矩形的片材。 形成抛光制品可以包括在移动的带上沉积液体前体，在移动的带上至少部分地固化液体前体以形成抛光层，并且将抛光层与带分离。

公开(公告)号：US07841925B2

公开(公告)日：2010-11-30

申请号：US12488437

申请日：2009-06-19

申请人： Gregory E. Menk ,  Peter McReynolds ,  Erik S. Rondum ,  Anand N. Iyer ,  Gopalakrishna B. Prabhu ,  Garlen C. Leung

发明人： Gregory E. Menk ,  Peter McReynolds ,  Erik S. Rondum ,  Anand N. Iyer ,  Gopalakrishna B. Prabhu ,  Garlen C. Leung

IPC分类号： B24B49/12

CPC分类号： B24B21/06 ,  B24B21/04 ,  B24B21/12 ,  B24B37/12 ,  B24B37/205 ,  B24B37/26 ,  B24D11/001

摘要： A polishing article includes a polishing layer having a polishing surface and a solid light-transmissive window in the polishing layer, the window having a first non-linear edge that extends along a first axis parallel to the polishing surface, the first non-linear edge including a plurality of projections and a plurality of recesses extending parallel to the polishing surface and disposed in an alternating pattern along the first axis.

摘要翻译： 抛光制品包括在抛光层中具有抛光表面和固体透光窗的抛光层，该窗具有沿平行于研磨表面的第一轴延伸的第一非线性边缘，第一非线性边缘 包括多个突起和与所述抛光表面平行延伸并沿所述第一轴线交替设置的多个凹槽。

公开(公告)号：US07601050B2

公开(公告)日：2009-10-13

申请号：US11707651

申请日：2007-02-15

申请人： Steven M. Zuniga ,  Peter McReynolds ,  Erik S. Rondum ,  Benjamin A. Bonner ,  Henry H. Au ,  Gregory E. Menk ,  Gopalakrishna B. Prabhu ,  Anand N. Iyer ,  Garlen C. Leung

发明人： Steven M. Zuniga ,  Peter McReynolds ,  Erik S. Rondum ,  Benjamin A. Bonner ,  Henry H. Au ,  Gregory E. Menk ,  Gopalakrishna B. Prabhu ,  Anand N. Iyer ,  Garlen C. Leung

IPC分类号： B24B7/22

CPC分类号： B24B21/06 ,  B24B21/04 ,  B24B21/12 ,  B24B37/12 ,  B24B37/205 ,  B24B37/26 ,  B24D11/001

摘要： A polishing apparatus is described. The polishing apparatus includes a rotatable platen, a drive mechanism to incrementally advance a polishing sheet having a polishing surface in a linear direction across the platen, a subpad on the platen to support the polishing sheet, the subpad having a groove formed therein, and a vacuum source connected to the groove of the subpad and configured to apply a vacuum sufficient to pull portions of the polishing sheet into the groove of the subpad to induce a groove in the polishing surface.

摘要翻译： 描述了抛光装置。 抛光装置包括可旋转压板，驱动机构，用于逐渐推进具有沿着线性方向的研磨表面的抛光片横过压板，压板上的子垫以支撑抛光片，子板具有形成在其中的凹槽，以及 真空源连接到子垫的凹槽，并被配置为施加足以将抛光片的一部分拉入到子垫的凹槽中以在抛光表面中引起凹槽的真空。

公开(公告)号：US20090253358A1

公开(公告)日：2009-10-08

申请号：US12488437

申请日：2009-06-19

申请人： Gregory E. Menk ,  Peter McReynolds ,  Erik S. Rondum ,  Anand N. Iyer ,  Gopalakrishna B. Prabhu ,  Garlen C. Leung

发明人： Gregory E. Menk ,  Peter McReynolds ,  Erik S. Rondum ,  Anand N. Iyer ,  Gopalakrishna B. Prabhu ,  Garlen C. Leung

IPC分类号： B24D11/00

CPC分类号： B24B21/06 ,  B24B21/04 ,  B24B21/12 ,  B24B37/12 ,  B24B37/205 ,  B24B37/26 ,  B24D11/001

摘要： A polishing article includes a polishing layer having a polishing surface and a solid light-transmissive window in the polishing layer, the window having a first non-linear edge that extends along a first axis parallel to the polishing surface, the first non-linear edge including a plurality of projections and a plurality of recesses extending parallel to the polishing surface and disposed in an alternating pattern along the first axis.

摘要翻译： 抛光制品包括在抛光层中具有抛光表面和固体透光窗的抛光层，该窗具有沿平行于研磨表面的第一轴延伸的第一非线性边缘，第一非线性边缘 包括多个突起和与所述抛光表面平行延伸并沿所述第一轴线交替设置的多个凹槽。