公开(公告)号：US20150306669A1

公开(公告)日：2015-10-29

申请号：US14650331

申请日：2013-10-09

申请人： ROBERT BOSCH GMBH

发明人： Michael Guenther ,  Andrea Feiock

IPC分类号： B22F7/06 ,  B22F1/00 ,  B22F7/00

CPC分类号： B22F7/062 ,  B22F1/0059 ,  B22F1/0062 ,  B22F7/008 ,  B22F7/064 ,  B22F7/08 ,  B23K35/0244 ,  B23K35/025 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29006 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/29399 ,  H01L2224/32013 ,  H01L2224/8384 ,  H01L2924/12044 ,  H01L2924/00

摘要： The invention relates to a method for connecting at least two components (18, 20) using a sintering process. The aim of the invention is to improve the sintering process. This is achieved in that the method has the following method steps: a) providing a starting material (10) of a sintering compound (22), comprising particles (12) which can be sintered and have at least one metal or at least one metal compound and comprising at least one polymeric, polymerizable, and/or monomeric organic compound (14), wherein the polymeric, polymerizable, and/or monomeric compound (14) has a flow temperature which is higher than or equal to the room temperature and lower than the sintering temperature, and the polymeric, polymerizable, and/or monomeric organic compound (14) further has a desorption temperature which is higher than the flow temperature and lower than or equal to the sintering temperature; b) arranging the starting material (10) between two components (18, 20) to be connected; c) heating the starting material (10) to a temperature (T1) which is higher than or equal to the flow temperature of the polymeric, polymerizable, and/or monomeric organic compound (14) and lower than the desorption temperature of the polymeric, polymerizable, and/or monomeric organic compound (14) for a period of time (t1); and d) heating the starting material (10) to a temperature (T2) which is higher than or equal to the sintering temperature of the particles (12) which can be sintered, optionally under the influence of a sintering pressure, for a period of time (t2), thereby forming a sintering compound (22).

摘要翻译： 本发明涉及一种使用烧结工艺连接至少两个部件（18,20）的方法。 本发明的目的是改善烧结过程。 这是通过以下方法实现的：a）提供烧结化合物（22）的起始材料（10），其包含可以烧结并具有至少一种金属或至少一种金属的颗粒（12） 化合物并且包含至少一种聚合物，可聚合和/或单体有机化合物（14），其中聚合物，可聚合和/或单体化合物（14）具有高于或等于室温的流动温度和较低 聚合的，可聚合的和/或单体的有机化合物（14）还具有高于流动温度并低于或等于烧结温度的解吸温度; b）将起始材料（10）布置在待连接的两个部件（18,20）之间; c）将起始原料（10）加热到高于或等于聚合物，可聚合和/或单体有机化合物（14）的流动温度的温度（T1），并且低于聚合物的可解吸温度， 可聚合和/或单体有机化合物（14）一段时间（t1）; 和d）任选地在烧结压力的影响下，将起始材料（10）加热到高于或等于可烧结的颗粒（12）的烧结温度的温度（T2），持续一段时间 时间（t2），由此形成烧结化合物（22）。

公开(公告)号：US20140234649A1

公开(公告)日：2014-08-21

申请号：US14348408

申请日：2012-09-21

申请人： Robert Bosch GmbH

发明人： Thomas Kalich ,  Frank Wetzl ,  Bernd Hohenberger ,  Rainer Holz ,  Christiane Frueh ,  Andreas Fix ,  Michael Guyenot ,  Andrea Feiock ,  Martin Rittner ,  Michael Guenther

IPC分类号： B23K35/02 ,  B32B15/06 ,  B23K1/00 ,  B32B15/16

CPC分类号： B23K35/0238 ,  B23K1/0008 ,  B23K1/0016 ,  B32B15/06 ,  B32B15/16 ,  B32B2264/105 ,  C23C26/00 ,  C23C28/021 ,  C23C28/023 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/27334 ,  H01L2224/27505 ,  H01L2224/278 ,  H01L2224/27848 ,  H01L2224/29082 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29118 ,  H01L2224/29139 ,  H01L2224/29147 ,  H01L2224/29209 ,  H01L2224/29211 ,  H01L2224/29213 ,  H01L2224/29218 ,  H01L2224/29239 ,  H01L2224/29247 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29395 ,  H01L2224/32503 ,  H01L2224/83191 ,  H01L2224/83193 ,  H01L2224/832 ,  H01L2224/83203 ,  H01L2224/83815 ,  H01L2224/8382 ,  H01L2224/8384 ,  H01L2924/01327 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/351 ,  H05K3/3478 ,  H05K2203/0405 ,  H05K2203/1131 ,  Y10T428/12049 ,  Y10T428/12063 ,  H01L2924/00013 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/01028 ,  H01L2924/0103 ,  H01L2924/01049 ,  H01L2924/01013 ,  H01L2924/01031 ,  H01L2924/0132 ,  H01L2924/00

摘要： The invention relates to a layered composite (10), in particular for connecting electronic components as joining partners, comprising at least one substrate film (11) and a layer assembly (12) applied to the substrate film. The layer assembly comprises at least one sinterable layer (13), which is applied to the substrate film (11) and which contains at least one metal powder, and a solder layer (14) applied to the sinterable layer (13). The invention further relates to a method for forming a layered composite, to a circuit assembly containing a layered composite (10) according to the invention, and to the use of a layered composite (10) in a joining method for electronic components.

摘要翻译： 本发明涉及一种分层复合材料（10），特别是用于连接作为接合伙伴的电子部件，包括至少一个基底膜（11）和施加到基底膜上的层组件（12）。 层组件包括施加到基底膜（11）并且包含至少一种金属粉末的至少一个可烧结层（13）和施加到可烧结层（13）的焊料层（14）。 本发明还涉及一种用于形成层状复合材料的方法，包括根据本发明的层状复合材料（10）的电路组件，以及在电子部件的接合方法中使用层状复合材料（10）。

公开(公告)号：US09630379B2

公开(公告)日：2017-04-25

申请号：US14348747

申请日：2012-09-21

申请人： Robert Bosch GmbH

发明人： Thomas Kalich ,  Christiane Frueh ,  Franz Wetzl ,  Bernd Hohenberger ,  Rainer Holz ,  Andreas Fix ,  Michael Guyenot ,  Andrea Feiock ,  Michael Guenther ,  Martin Rittner

IPC分类号： B22F7/00 ,  B32B15/01 ,  B23K1/00 ,  B23K35/30 ,  B23K35/02 ,  H01L23/00 ,  B23K1/19 ,  B23K101/42

CPC分类号： B32B15/01 ,  B23K1/0006 ,  B23K1/0016 ,  B23K1/19 ,  B23K35/0238 ,  B23K35/30 ,  B23K2101/42 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/2908 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29118 ,  H01L2224/29139 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/29209 ,  H01L2224/29211 ,  H01L2224/29213 ,  H01L2224/29218 ,  H01L2224/29239 ,  H01L2224/29247 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/8382 ,  H01L2924/01327 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/15787 ,  Y10T428/12063 ,  Y10T428/12222 ,  H01L2924/00

摘要： Laminated composite (10) comprising at least one electronic substrate (11) and an arrangement of layers (20, 30) made up of at least a first layer (20) of a first metal and/or a first metal alloy and of a second layer (30) of a second metal and/or a second metal alloy adjacent to this first layer (20), wherein the melting temperatures of the first and second layers are different, and wherein, after a thermal treatment of the arrangement of layers (20, 30), a region with at least one intermetallic phase (40) is formed between the first layer and the second layer, wherein the first layer (20) or the second layer (30) is formed by a reaction solder which consists of a mixture of a basic solder with an AgX, CuX or NiX alloy, wherein the component X of the AgX, CuX or NiX alloy is selected from the group consisting of B, Mg, Al, Si, Ca, Se, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Ge, Y, Zr, Nb, Mo, Ag, In, Sn, Sb, Ba, Hf, Ta, W, Au, Bi, La, Ce, Pr, Nd, Gd, Dy, Sm, Er, Tb, Eu, Ho, Tm, Yb and Lu and wherein the melting temperature of the AgX, CuX or NiX alloy is greater than the melting temperature of the basic solder. The invention also relates to a method for forming a laminated composite (10) and to a circuit arrangement containing a laminated composite (10) according to the invention.

公开(公告)号：US20140248505A1

公开(公告)日：2014-09-04

申请号：US14348747

申请日：2012-09-21

申请人： Robert Bosch GmbH

发明人： Thomas Kalich ,  Christiane Frueh ,  Franz Wetzl ,  Bernd Hohenberger ,  Rainer Holz ,  Andreas Fix ,  Michael Guyenot ,  Andrea Feiock ,  Michael Guenther ,  Martin Rittner

IPC分类号： B32B15/01 ,  B23K1/00

CPC分类号： B32B15/01 ,  B23K1/0006 ,  B23K1/0016 ,  B23K1/19 ,  B23K35/0238 ,  B23K35/30 ,  B23K2101/42 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/2908 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29118 ,  H01L2224/29139 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/29209 ,  H01L2224/29211 ,  H01L2224/29213 ,  H01L2224/29218 ,  H01L2224/29239 ,  H01L2224/29247 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/8382 ,  H01L2924/01327 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/15787 ,  Y10T428/12063 ,  Y10T428/12222 ,  H01L2924/00

摘要： Laminated composite (10) comprising at least one electronic substrate (11) and an arrangement of layers (20, 30) made up of at least a first layer (20) of a first metal and/or a first metal alloy and of a second layer (30) of a second metal and/or a second metal alloy adjacent to this first layer (20), wherein the melting temperatures of the first and second layers are different, and wherein, after a thermal treatment of the arrangement of layers (20, 30), a region with at least one intermetallic phase (40) is formed between the first layer and the second layer, wherein the first layer (20) or the second layer (30) is formed by a reaction solder which consists of a mixture of a basic solder with an AgX, CuX or NiX alloy, wherein the component X of the AgX, CuX or NiX alloy is selected from the group consisting of B, Mg, Al, Si, Ca, Se, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Ge, Y, Zr, Nb, Mo, Ag, In, Sn, Sb, Ba, Hf, Ta, W, Au, Bi, La, Ce, Pr, Nd, Gd, Dy, Sm, Er, Tb, Eu, Ho, Tm, Yb and Lu and wherein the melting temperature of the AgX, CuX or NiX alloy is greater than the melting temperature of the basic solder. The invention also relates to a method for forming a laminated composite (10) and to a circuit arrangement containing a laminated composite (10) according to the invention.

摘要翻译： 包括至少一个电子基板（11）和由至少第一金属和/或第一金属合金的第一层（20）和第二金属合金构成的层（20,30）的布置的层压复合材料（10） 与第一层（20）相邻的第二金属和/或第二金属合金的层（30），其中第一和第二层的熔化温度不同，并且其中在层的布置（ 20,30），在第一层和第二层之间形成具有至少一个金属间相（40）的区域，其中第一层（20）或第二层（30）由反应焊料形成，反应焊料由 碱性焊料与AgX，CuX或NiX合金的混合物，其中AgX，CuX或NiX合金的组分X选自B，Mg，Al，Si，Ca，Se，Ti，V， Cr，Mn，Fe，Co，Ni，Cu，Zn，Ga，Ge，Y，Zr，Nb，Mo，Ag，In，Sn，Sb，Ba，Hf，Ta，W，Au，Bi，La，Ce， Pr，Nd，Gd，Dy，Sm，Er，Tb，Eu，Ho，Tm，Yb等 Lu，其中AgX，CuX或NiX合金的熔融温度大于碱性焊料的熔融温度。 本发明还涉及层压复合材料（10）的形成方法和包含根据本发明的叠层复合材料（10）的电路装置。