Flame-retardant UV and UV/moisture curable silicone compositions
    6.
    发明授权
    Flame-retardant UV and UV/moisture curable silicone compositions 失效
    阻燃UV和UV /湿固化硅酮组合物

    公开(公告)号:US06323253B1

    公开(公告)日:2001-11-27

    申请号:US09392527

    申请日:1999-09-09

    IPC分类号: C08K322

    摘要: The present invention is directed to silicone formulations which are capable of being rapidly cured to tough elastomeric materials through exposure to UV radiation, and optionally through exposure to moisture as well. The cured products demonstrate high resistance to flammability and combustibility. The flame-retardant components is a combination of hydrated alumina and an organo ligand complex of a transition metal or an organosiloxane ligand complex of a transition metal or a combination thereof.

    摘要翻译: 本发明涉及能够通过暴露于紫外线辐射以及任选地通过暴露于水分而迅速固化成韧性弹性材料的硅氧烷制剂。 固化产物表现出高的易燃性和可燃性。 阻燃组分是水合氧化铝和过渡金属或过渡金属或其组合的有机硅氧烷配体络合物的有机配体络合物的组合。

    Conductive, resin-based compositions
    10.
    发明授权
    Conductive, resin-based compositions 失效
    导电树脂基组合物

    公开(公告)号:US06284817B1

    公开(公告)日:2001-09-04

    申请号:US09515662

    申请日:2000-02-29

    IPC分类号: C08K318

    摘要: The invention provides a conductive, resin-based composition, which includes a resinous material, and a conductive filler dispersed therein. The conductive filler includes a first conductive filler component and a second conductive filler component. The particles of the first conductive filler component are harder than those of the second conductive filler component, when measured using the Mohs hardness scale. The composition is subjected to shear mixing forces which shearingly disperse the first and second conductive filler components throughout the resinous material in such a way that the particles of the second conductive filler component occupy the interstitial voids within the network of first conductive filler component particles contained in the resinous material and thereby enhance conductivity.

    摘要翻译: 本发明提供一种导电性树脂基组合物,其包含树脂材料和分散在其中的导电填料。 导电填料包括第一导电填料组分和第二导电填料组分。 当使用莫氏硬度计测量时,第一导电填料组分的颗粒比第二导电填料组分的颗粒硬。 组合物经受剪切混合力,其剪切分散第一和第二导电填料组分整个树脂材料,使得第二导电填料组分的颗粒占据第一导电填料组分颗粒网络内的间隙, 树脂材料,从而增强导电性。