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公开(公告)号：US08153285B2
公开(公告)日：2012-04-10
申请号：US10750581
申请日：2003-12-29
申请人： Robert E. Higashi , Khanh Q. Nguyen , Karen M. Newstrom-Peitso , Tom M. Rezachek , Roland A. Wood
发明人： Robert E. Higashi , Khanh Q. Nguyen , Karen M. Newstrom-Peitso , Tom M. Rezachek , Roland A. Wood
CPC分类号： H01M8/0297 , H01M8/04007 , H01M8/04156 , H01M8/04223 , H01M8/0606 , H01M8/2404 , H01M8/241 , H01M16/006 , Y10T29/49114
摘要： A fuel cell, fuel cell array and methods of forming the same are disclosed. The fuel cell can be made by forming a first aperture defined by a first aperture surface through a first electrode layer and forming a second aperture defined by a second aperture surface through a second electrode layer. A proton exchange membrane is laminated between the first electrode layer and the second electrode layer. At least a portion of the first aperture is at least partially aligned with the second aperture.
摘要翻译： 公开了一种燃料电池，燃料电池阵列及其形成方法。 燃料电池可以通过形成由第一孔表面限定的第一孔通过第一电极层并形成由第二孔表面限定的第二孔通过第二电极层制成。 质子交换膜层压在第一电极层和第二电极层之间。 第一孔的至少一部分至少部分地与第二孔对准。
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公开(公告)号：US07276798B2
公开(公告)日：2007-10-02
申请号：US10750580
申请日：2003-12-29
IPC分类号： H01L31/0236
CPC分类号： G01J5/20 , H01L27/14618 , H01L27/14625 , H01L27/14649 , H01L27/16 , H01L31/0203 , H01L31/02162 , H01L2924/0002 , Y10T428/24355 , H01L2924/00
摘要： An integrated vacuum package having an added volume on a perimeter within the perimeter of a bonding seal between two wafers. The added volume of space may be an etching of material from the inside surface of the top wafer. This wafer may have vent holes that may be sealed to maintain a vacuum within the volume between the two wafers after the pump out of gas and air. The inside surface of the top wafer may have an anti-reflective pattern. Also, an anti-reflective pattern may be on the outside surface of the top wafer. The seal between the two wafers may be ring-like and have a spacer material. Also, it may have a malleable material such as solder to compensate for any flatness variation between the two facing surfaces of the wafers.
摘要翻译： 在两片晶片之间的接合密封的周边周边上具有相加体积的集成真空包装。 增加的空间体积可以是从顶部晶片的内表面蚀刻材料。 该晶片可以具有通气孔，其可以在泵离开气体和空气之后被密封以将真空保持在两个晶片之间的体积内。 顶部晶片的内表面可以具有抗反射图案。 此外，抗反射图案可以在顶部晶片的外表面上。 两个晶片之间的密封可以是环状的并且具有间隔物材料。 此外，它可以具有可延展的材料，例如焊料，以补偿晶片的两个相对表面之间的任何平坦度变化。
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公开(公告)号：US08188561B2
公开(公告)日：2012-05-29
申请号：US12958161
申请日：2010-12-01
IPC分类号： H01L31/0203
CPC分类号： G01J5/20 , H01L27/14618 , H01L27/14625 , H01L27/14649 , H01L27/16 , H01L31/0203 , H01L31/02162 , H01L2924/0002 , Y10T428/24355 , H01L2924/00
摘要： An integrated vacuum package having an added volume on a perimeter within the perimeter of a bonding seal between two wafers. The added volume of space may be an etching of material from the inside surface of the top wafer. This wafer may have vent holes that may be sealed to maintain a vacuum within the volume between the two wafers after the pump out of gas and air. The inside surface of the top wafer may have an anti-reflective pattern. Also, an anti-reflective pattern may be on the outside surface of the top wafer. The seal between the two wafers may be ring-like and have a spacer material. Also, it may have a malleable material such as solder to compensate for any flatness variation between the two facing surfaces of the wafers.
摘要翻译： 在两片晶片之间的接合密封的周边周边上具有相加体积的集成真空包装。 增加的空间体积可以是从顶部晶片的内表面蚀刻材料。 该晶片可以具有通气孔，其可以在泵离开气体和空气之后被密封以将真空保持在两个晶片之间的体积内。 顶部晶片的内表面可以具有抗反射图案。 此外，抗反射图案可以在顶部晶片的外表面上。 两个晶片之间的密封可以是环状的并且具有间隔物材料。 此外，它可以具有可延展的材料，例如焊料，以补偿晶片的两个相对表面之间的任何平坦度变化。
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公开(公告)号：US20110070401A1
公开(公告)日：2011-03-24
申请号：US12958161
申请日：2010-12-01
IPC分类号： B32B3/00
CPC分类号： G01J5/20 , H01L27/14618 , H01L27/14625 , H01L27/14649 , H01L27/16 , H01L31/0203 , H01L31/02162 , H01L2924/0002 , Y10T428/24355 , H01L2924/00
摘要： An integrated vacuum package having an added volume on a perimeter within the perimeter of a bonding seal between two wafers. The added volume of space may be an etching of material from the inside surface of the top wafer. This wafer may have vent holes that may be sealed to maintain a vacuum within the volume between the two wafers after the pump out of gas and air. The inside surface of the top wafer may have an anti-reflective pattern. Also, an anti-reflective pattern may be on the outside surface of the top wafer. The seal between the two wafers may be ring-like and have a spacer material. Also, it may have a malleable material such as solder to compensate for any flatness variation between the two facing surfaces of the wafers.
摘要翻译： 在两片晶片之间的接合密封的周边周边上具有相加体积的集成真空包装。 增加的空间体积可以是从顶部晶片的内表面蚀刻材料。 该晶片可以具有通气孔，其可以在泵离开气体和空气之后被密封以将真空保持在两个晶片之间的体积内。 顶部晶片的内表面可以具有抗反射图案。 此外，抗反射图案可以在顶部晶片的外表面上。 两个晶片之间的密封可以是环状的并且具有间隔物材料。 此外，它可以具有可延展的材料，例如焊料，以补偿晶片的两个相对表面之间的任何平坦度变化。
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公开(公告)号：US07875944B2
公开(公告)日：2011-01-25
申请号：US11832473
申请日：2007-08-01
IPC分类号： H01L31/0203
CPC分类号： G01J5/20 , H01L27/14618 , H01L27/14625 , H01L27/14649 , H01L27/16 , H01L31/0203 , H01L31/02162 , H01L2924/0002 , Y10T428/24355 , H01L2924/00
摘要： An integrated vacuum package having an added volume on a perimeter within the perimeter of a bonding seal between two wafers. The added volume of space may be an etching of material from the inside surface of the top wafer. This wafer may have vent holes that may be sealed to maintain a vacuum within the volume between the two wafers after the pump out of gas and air. The inside surface of the top wafer may have an anti-reflective pattern. Also, an anti-reflective pattern may be on the outside surface of the top wafer. The seal between the two wafers may be ring-like and have a spacer material. Also, it may have a malleable material such as solder to compensate for any flatness variation between the two facing surfaces of the wafers.
摘要翻译： 在两片晶片之间的接合密封的周边周边上具有相加体积的集成真空包装。 增加的空间体积可以是从顶部晶片的内表面蚀刻材料。 该晶片可以具有通气孔，其可以在泵离开气体和空气之后被密封以将真空保持在两个晶片之间的体积内。 顶部晶片的内表面可以具有抗反射图案。 此外，抗反射图案可以在顶部晶片的外表面上。 两个晶片之间的密封可以是环状的并且具有间隔物材料。 此外，它可以具有可延展的材料，例如焊料，以补偿晶片的两个相对表面之间的任何平坦度变化。
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公开(公告)号：US08513091B2
公开(公告)日：2013-08-20
申请号：US12940773
申请日：2010-11-05
IPC分类号： H01L21/30
CPC分类号： H01L24/94 , H01L21/50 , H01L23/10 , H01L24/13 , H01L24/16 , H01L24/81 , H01L25/50 , H01L2224/13083 , H01L2224/13084 , H01L2224/13109 , H01L2224/13144 , H01L2224/13155 , H01L2224/13166 , H01L2224/16145 , H01L2224/16503 , H01L2224/32014 , H01L2224/81193 , H01L2224/81201 , H01L2224/81805 , H01L2224/8181 , H01L2224/94 , H01L2924/01006 , H01L2924/01033 , H01L2924/01049 , H01L2924/01061 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2224/83 , H01L2224/81 , H01L2924/00014
摘要： Devices, methods, and systems for wafer bonding are described herein. One or more embodiments include forming a bond between a first wafer and a second wafer using a first material adjacent the first wafer and a second material adjacent the second wafer. The first material includes a layer of gold (Au) and a layer of indium (In), and the second material includes a layer of Au. Forming the bond between the first wafer and the second wafer includes combining the layer of Au in the first material, the layer of In in the first material, and a portion of the layer of Au in the second material, wherein an additional portion of the layer of Au in the second material is not combined with the layer of Au in the first material and the layer of In in the first material.
摘要翻译： 本文描述了用于晶片接合的装置，方法和系统。 一个或多个实施例包括使用与第一晶片相邻的第一材料和与第二晶片相邻的第二材料在第一晶片和第二晶片之间形成结合。 第一材料包括金（Au）层和铟（In）层，第二材料包括Au层。 形成第一晶片和第二晶片之间的结合包括将第一材料中的Au层，第一材料中的In层和第二材料中的Au层的一部分组合，其中， 第二材料中的Au层不与第一材料中的Au层和第一材料中的In层相结合。
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公开(公告)号：US07476852B2
公开(公告)日：2009-01-13
申请号：US11328735
申请日：2006-01-10
CPC分类号： G01N27/622 , G01N27/624 , G01N30/6095 , G01N30/62 , G01N30/64 , G01N30/66 , G01N30/70 , G01N30/7206 , G01N30/78 , G01N2030/025 , G01N2030/642 , G01N2030/645
摘要： Embodiments of the present invention relate to detector structures for use in a micro gas analyzer, preferably in a differential setup. The detector structures may comprise one or more detector types, such as photo-ionization (PID), electron capture (ECD), ion mobility (IMS), differential mobility (DMS), ion-trap mass spectrometer (ITMS), in which all are provided with ions and electrons from one vacuum ultra violet (VUV) source. This source may also provide ions for ion-based gas pumps.
摘要翻译： 本发明的实施例涉及用于微量气体分析仪的检测器结构，优选地在差分装置中。 检测器结构可以包括一种或多种检测器类型，例如光电离（PID），电子捕获（ECD），离子迁移率（IMS），差分迁移率（DMS），离子阱质谱仪（ITMS），其中所有 从一个真空紫外线（VUV）源提供离子和电子。 该源还可以提供用于基于离子的气体泵的离子。
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公开(公告)号：US09128028B2
公开(公告)日：2015-09-08
申请号：US12846506
申请日：2010-07-29
摘要： Thermal conductivity detectors and methods of operating thermal conductivity detectors are described herein. One or more device embodiments include a single fluidic channel, wherein the single fluidic channel includes a single inlet and a single outlet, and multiple sensors configured to determine one or more properties associated with a thermal conductivity of a fluid in the single fluidic channel.
摘要翻译： 本文描述了热导检测器和操作热导检测器的方法。 一个或多个装置实施例包括单个流体通道，其中单个流体通道包括单个入口和单个出口，以及多个传感器，其被配置为确定与单个流体通道中的流体的热导率相关联的一个或多个特性。
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公开(公告)号：US20120024043A1
公开(公告)日：2012-02-02
申请号：US12846506
申请日：2010-07-29
IPC分类号： G01N25/18
摘要： Thermal conductivity detectors and methods of operating thermal conductivity detectors are described herein. One or more device embodiments include a single fluidic channel, wherein the single fluidic channel includes a single inlet and a single outlet, and multiple sensors configured to determine one or more properties associated with a thermal conductivity of a fluid in the single fluidic channel.
摘要翻译： 本文描述了热导检测器和操作热导检测器的方法。 一个或多个装置实施例包括单个流体通道，其中单个流体通道包括单个入口和单个出口，以及多个传感器，其被配置为确定与单个流体通道中的流体的热导率相关联的一个或多个特性。
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