Process flow for ARS mover using selenidation wafer bonding before processing a media side of a rotor wafer
    4.
    发明授权
    Process flow for ARS mover using selenidation wafer bonding before processing a media side of a rotor wafer 失效
    在处理转子晶片的介质侧之前,使用硒化晶片接合的ARS移动器的工艺流程

    公开(公告)号:US06436794B1

    公开(公告)日:2002-08-20

    申请号:US09860453

    申请日:2001-05-21

    IPC分类号: H01L2130

    摘要: An improved process flow for an atomic resolution storage (ARS) system deposits conductive electrodes on a media side of a rotor wafer before wafer thinning process, i.e., grinding and CMP, thus protecting the conductive electrodes on a media surface from the grinding process. In addition, the CMOS circuitry is formed in a stator wafer at a relatively later stage. Therefore, the CMOS circuitry is less likely to be damaged by heat processing. In addition, some of the necessary processing may be performed with loosened thermal budget. Finally, because wafer bonding of the rotor wafer and the stator wafer is performed at a later stage, there is less probability of degradation of the wafer bonding. Accordingly, device yield may be enhanced, leading to lower manufacturing cost.

    摘要翻译: 用于原子分辨率存储(ARS)系统的改进的工艺流程在晶片变薄处理(即研磨和CMP)之前在转子晶片的介质侧上沉积导电电极,从而保护介质表面上的导电电极免受研磨过程。 此外,CMOS电路在相对较晚的阶段形成在定子晶片中。 因此,CMOS电路不太可能被热处理所损坏。 另外,一些必要的处理可以用松散的热预算执行。 最后,由于转子晶片和定子晶片的晶片接合在稍后的阶段进行,所以晶片接合的劣化的可能性降低。 因此,可以提高装置产量,从而降低制造成本。

    Method of fabricating a sharp protrusion

    公开(公告)号:US20060021962A1

    公开(公告)日:2006-02-02

    申请号:US10902762

    申请日:2004-07-30

    IPC分类号: B44C1/22 C23F1/00

    摘要: A method of fabricating a sharp protrusion on an underlayer is disclosed. A tip layer is deposited on an underlayer and then a mask layer is deposited on the tip layer. The mask layer is patterned with a beam-and-hat pattern that is used to form a beam-and-hat mask in the mask layer. Portions of the tip layer that are not covered by the beam-and-hat mask are isotropically etched to form a tip including a vertex. Beam portions of the beam-and-hat mask support the hat portion and prevent a release of the hat portion during the isotropic etching process. An anisotropic etch process can be used prior to the isotropic etching process to change a character of the tip. The underlayer can be patterned and etched to form a cantilever that includes the sharp protrusion extending outward of a surface of the cantilever.

    Process flow for ARS mover using selenidation wafer bonding after processing a media side of a rotor wafer
    6.
    发明授权
    Process flow for ARS mover using selenidation wafer bonding after processing a media side of a rotor wafer 失效
    在处理转子晶片的介质侧之后使用硒化晶片接合的ARS移动器的工艺流程

    公开(公告)号:US06440820B1

    公开(公告)日:2002-08-27

    申请号:US09860452

    申请日:2001-05-21

    IPC分类号: H01L2130

    摘要: An improved process flow for an atomic resolution storage (ARS) system deposits conductive electrodes, together with a protective layer, on a media side of a rotor wafer before most of other device processing, thus preserving a surface for ARS storage media from subsequent wafer thinning process. CMOS circuitry is also formed in a stator wafer at a later stage. Therefore, the CMOS circuitry is less likely to be damaged by heat processing. In addition, processing of the media side of the rotor wafer may be performed with loosened thermal budget. Finally, because the media side of the rotor wafer is processed before wafer bonding of the rotor wafer and the stator wafer, there is less probability of degradation of the wafer bonding. Therefore, device yield may be enhanced, leading to lower manufacturing cost.

    摘要翻译: 原子分辨率存储(ARS)系统的改进的处理流程在其他器件处理之前大部分其它器件处理之前,将转移晶片的介质侧上的导电电极与保护层一起放置在一起,从而保留了ARS存储介质从后续晶片变薄的表面 处理。 在稍后阶段也在定子晶片中形成CMOS电路。 因此,CMOS电路不太可能被热处理所损坏。 此外,可以以松散的热量预算来执行转子晶片的介质侧的处理。 最后,因为转子晶片的介质侧在转子晶片和定子晶片的晶片接合之前被处理,所以晶片键合的劣化的可能性降低。 因此,可以提高装置产量,导致制造成本降低。

    Method and system for processing an image
    7.
    发明授权
    Method and system for processing an image 有权
    用于处理图像的方法和系统

    公开(公告)号:US08508643B2

    公开(公告)日:2013-08-13

    申请号:US10346462

    申请日:2003-01-17

    IPC分类号: H04N5/222

    摘要: The present invention includes a method and system for processing images captured with an image-capturing device. According to the present invention, a method and system includes reconfiguring a display of an image based on the orientation of the image-capturing device when the image is captured. Through the use of the method and system in accordance with the present invention, a user can view captured images without having to account for a rotation of the image-capturing device. The method and system includes capturing the image with an image-capturing device, determining an orientation of the image-capturing device and reconfiguring a display of the image based on the orientation of the image-capturing device.

    摘要翻译: 本发明包括一种用于处理用图像捕获装置捕获的图像的方法和系统。 根据本发明,一种方法和系统包括:当拍摄图像时,基于图像捕获装置的取向重新配置图像的显示。 通过使用根据本发明的方法和系统,用户可以观察拍摄的图像,而不必考虑图像捕获装置的旋转。 该方法和系统包括:利用图像捕获装置捕获图像,基于图像捕获装置的方向确定图像捕获装置的方位并重新配置图像的显示。

    Camera motion detection system
    9.
    发明申请
    Camera motion detection system 审中-公开
    相机运动检测系统

    公开(公告)号:US20060185431A1

    公开(公告)日:2006-08-24

    申请号:US11063509

    申请日:2005-02-23

    IPC分类号: G01P15/00

    摘要: Provided is a method and system for detecting rotational movement of a camera. Three pairs of accelerometers are located in the camera, with the motion sensing axes of each of the accelerometers in each of the pairs parallel to one another. The accelerometers are relatively positioned in the camera such that the planes formed by the motion sensing axes of each of the pairs of accelerometers are substantially mutually orthogonal.

    摘要翻译: 提供了一种用于检测照相机的旋转运动的方法和系统。 三对加速度计位于相机中,每对加速度计的运动感测轴彼此平行。 加速度计相对定位在相机中,使得由每对加速度计的运动感测轴形成的平面基本上相互正交。

    Systems and methods for rectifying and detecting signals
    10.
    发明申请
    Systems and methods for rectifying and detecting signals 有权
    整流和检测信号的系统和方法

    公开(公告)号:US20060134869A1

    公开(公告)日:2006-06-22

    申请号:US11015060

    申请日:2004-12-17

    IPC分类号: H01L21/336

    CPC分类号: G01R31/2853

    摘要: A first device has a surface and includes a plurality of at largest micrometer-scale geometry structures extending along its surface. The structures have a first portion and a second portion. A plurality of at largest micrometer-scale geometry conductors are coupled to the first portion of respective structures. A converter converts a signal in the first portion of the structures to a substantially direct current signal in the respective second portion. A sensor detects a level of a signal coupled from one of the conductors to a respective one of the structures.

    摘要翻译: 第一装置具有表面并且包括沿其表面延伸的多个最大的微米尺度的几何结构。 该结构具有第一部分和第二部分。 多个最大的微米尺度几何形状导体耦合到相应结构的第一部分。 A转换器将结构的第一部分中的信号转换成相应的第二部分中的基本上直流的信号。 传感器检测从一个导体耦合到相应的一个结构的信号的电平。