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    Methods of overplating surfaces of microelectromechanical structure
    1.
    发明授权
    Methods of overplating surfaces of microelectromechanical structure 有权
    微机电结构表面超镀的方法

    公开(公告)号：US06596147B2

    公开(公告)日：2003-07-22

    申请号：US09809538

    申请日：2001-03-15

    申请人： Edward Hill ,  Robert L. Wood ,  Ramaswamy Mahadevan

    发明人： Edward Hill ,  Robert L. Wood ,  Ramaswamy Mahadevan

    IPC分类号： C25D502

    CPC分类号： H02N10/00 ,  B81B3/0024 ,  B81B3/0081 ,  H01H1/0036 ,  H01H2001/0042

    摘要： MEMS structures are provided that compensate for ambient temperature changes, process variations, and the like, and can be employed in many applications. These structures include an active microactuator adapted for thermal actuation to move in response to the active alteration of its temperature. The active microactuator may be further adapted to move in response to ambient temperature changes. These structures also include a temperature compensation element, such as a temperature compensation microactuator or frame, adapted to move in response to ambient temperature changes. The active microactuator and the temperature compensation element move cooperatively in response to ambient temperature changes. Thus, a predefined spatial relationship is maintained between the active microactuator and the associated temperature compensation microactuator over a broad range of ambient temperatures absent active alteration of the temperature of the active microactuator. In an alternative embodiment wherein the active microactuator is suspended within a frame above the substrate, the MEMS structure holds at least a portion of the active microactuator in a fixed position relative to the substrate over a broad range of ambient temperatures absent active alteration of the temperature of the active microactuator. By actively altering the temperature of the active microactuator, the active microactuator can be controllably moved relative to the temperature compensation microactuator and/or the underlying substrate. Related methods of compensating for the effects of ambient temperature variations are provided. Further, an overplating technique is provided for precisely sizing a gap defined within a MEMS structure.

    摘要翻译： 提供了补偿环境温度变化，工艺变化等的MEMS结构，并且可以用于许多应用中。 这些结构包括适于热致动以响应于其温度的主动改变而移动的主动微型致动器。 活性微致动器可以进一步适于响应于环境温度变化而移动。 这些结构还包括适于响应于环境温度变化而移动的温度补偿元件，例如温度补偿微致动器或框架。 活动微型致动器和温度补偿元件响应于环境温度变化而协同运动。 因此，在活动微型致动器的温度的有效改变的情况下，在宽的环境温度范围内，在有源微致动器和相关联的温度补偿微致动器之间保持预定的空间关系。 在其中将活性微致动器悬挂在衬底上方的框架内的MEMS替代实施例中，MEMS结构将活性微致动器的至少一部分在宽的环境温度范围内保持在相对于衬底的固定位置，而没有主动改变温度 的活性微致动器。 通过主动地改变活性微致动器的温度，可以相对于温度补偿微致动器和/或底层衬底可控地移动活性微致动器。 提供了补偿环境温度变化影响的相关方法。 此外，提供了一种用于精确地确定在MEMS结构内限定的间隙的过平面技术。

    Temperature compensated microelectromechanical structures and related methods
    2.
    发明授权
    Temperature compensated microelectromechanical structures and related methods 失效
    温度补偿微机电结构及相关方法

    公开(公告)号：US06236139B1

    公开(公告)日：2001-05-22

    申请号：US09261483

    申请日：1999-02-26

    申请人： Edward Hill ,  Robert L. Wood ,  Ramaswamy Mahadevan

    发明人： Edward Hill ,  Robert L. Wood ,  Ramaswamy Mahadevan

    IPC分类号： H02N1100

    CPC分类号： H02N10/00 ,  B81B3/0024 ,  B81B3/0081 ,  H01H1/0036 ,  H01H2001/0042

    摘要： MEMS structures are provided that compensate for ambient temperature changes, process variations, and the like, and can be employed in many applications. These structures include an active microactuator adapted for thermal actuation to move in response to the active alteration of its temperature. The active microactuator may be further adapted to move in response to ambient temperature changes. These structures also include a temperature compensation element, such as a temperature compensation microactuator or frame, adapted to move in response to ambient temperature changes. The active microactuator and the temperature compensation element move cooperatively in response to ambient temperature changes. Thus, a predefined spatial relationship is maintained between the active microactuator and the associated temperature compensation microactuator over a broad range of ambient temperatures absent active alteration of the temperature of the active microactuator. In an alternative embodiment wherein the active microactuator is suspended within a frame above the substrate, the MEMS structure holds at least a portion of the active microactuator in a fixed position relative to the substrate over a broad range of ambient temperatures absent active alteration of the temperature of the active microactuator. By actively altering the temperature of the active microactuator, the active microactuator can be controllably moved relative to the temperature compensation microactuator and/or the underlying substrate. Related methods of compensating for the effects of ambient temperature variations are provided. Further, an overplating technique is provided for precisely sizing a gap defined within a MEMS structure.

    摘要翻译： 提供了补偿环境温度变化，工艺变化等的MEMS结构，并且可以用于许多应用中。 这些结构包括适于热致动以响应于其温度的主动改变而移动的主动微型致动器。 活性微致动器可以进一步适于响应于环境温度变化而移动。 这些结构还包括适于响应于环境温度变化而移动的温度补偿元件，例如温度补偿微致动器或框架。 活动微型致动器和温度补偿元件响应于环境温度变化而协同运动。 因此，在活动微型致动器的温度的有效改变的情况下，在宽的环境温度范围内，在有源微致动器和相关联的温度补偿微致动器之间保持预定的空间关系。 在其中将活性微致动器悬挂在衬底上方的框架内的MEMS替代实施例中，MEMS结构将活性微致动器的至少一部分在宽的环境温度范围内保持在相对于衬底的固定位置，而没有主动改变温度 的活性微致动器。 通过主动地改变活性微致动器的温度，可以相对于温度补偿微致动器和/或底层衬底可控地移动活性微致动器。 提供了补偿环境温度变化影响的相关方法。 此外，提供了一种用于精确地确定在MEMS结构内限定的间隙的过平面技术。

    MEMS optical cross-connect switch
    3.
    发明授权
    MEMS optical cross-connect switch 有权
    MEMS光交叉连接开关

    公开(公告)号：US06396975B1

    公开(公告)日：2002-05-28

    申请号：US09489264

    申请日：2000-01-21

    申请人： Robert L. Wood ,  Edward A. Hill ,  Ramaswamy Mahadevan

    发明人： Robert L. Wood ,  Edward A. Hill ,  Ramaswamy Mahadevan

    IPC分类号： G02B626

    CPC分类号： G02B6/3572 ,  G02B6/3512 ,  G02B6/3546 ,  G02B6/3582 ,  G02B6/3584 ,  G02B26/085

    摘要： A microelectromechanical structure capable of switching optical signals from an input fiber to one of two or more output fibers. In one embodiment, the MEMS optical cross-connect switch comprises a first microelectronic substrate having a pop-up mirror disposed on the surface of the substrate and a rotational magnetic field source, such as a variably controlled magnetic field source. The rotational magnetic field source allows for reliable actuation of the pop-up mirror from a non-reflective state to a reflective state. Additionally the invention is embodied in a MEMS optical cross-connect switch having a first microelectronic substrate having a pop-up mirror disposed on the surface of the substrate and a positioning structure disposed in a fixed positional relationship relative to the first substrate. The positioning structure may comprise a positioning structure extending from a second microelectronic substrate that is in a fixed positional relationship relative to the first microelectronic substrate. The positioning structure serves to restrict further movement of the pop-up mirror when the pop-up mirror has been actuated into a reflective state.

    摘要翻译： 一种能够将光信号从输入光纤切换到两个或更多个输出光纤之一的微机电结构。 在一个实施例中，MEMS光学交叉连接开关包括具有设置在基板的表面上的弹出反射镜的第一微电子基板和诸如可变控制的磁场源的旋转磁场源。 旋转磁场源允许将弹出反射镜从非反射状态可靠地致动到反射状态。 另外，本发明体现在具有第一微电子衬底的MEMS光学交叉连接开关中，第一微电子衬底具有设置在衬底的表面上的弹出反射镜和相对于第一衬底以固定位置关系设置的定位结构。 定位结构可以包括从相对于第一微电子衬底处于固定位置关系的第二微电子衬底延伸的定位结构。 当弹起反射镜已经被启动成反射状态时，定位结构用于限制弹出反射镜的进一步移动。

    Variable capacitors including tandem movers/bimorphs and associated operating methods
    5.
    发明授权
    Variable capacitors including tandem movers/bimorphs and associated operating methods 失效
    可变电容器，包括串联驱动器/双压电晶片和相关操作方法

    公开(公告)号：US06400550B1

    公开(公告)日：2002-06-04

    申请号：US09860213

    申请日：2001-05-18

    申请人： Robert L. Wood ,  Vivek Agrawal ,  Ramaswamy Mahadevan ,  Edward A. Hill

    发明人： Robert L. Wood ,  Vivek Agrawal ,  Ramaswamy Mahadevan ,  Edward A. Hill

    IPC分类号： H01G501

    CPC分类号： H01G5/16 ,  B81B3/0056

    摘要： A variable capacitor is provided having first and second capacitor plates, a tandem mover and an actuator. The first and second capacitor plates are positioned such that the first and second capacitor plates face one another in a spaced apart relationship. The tandem mover is configured to move the first and second capacitor plates in tandem in response to changes in ambient temperature to maintain a consistent spaced apart relationship between the capacitor plates. The actuator is then configured to vary the spaced apart relationship between the first and second capacitor plates in response to an external input. The capacitance of the variable capacitor can therefore be varied by increasing and decreasing the spaced apart relationship between the first and second capacitor plates.

    摘要翻译： 提供具有第一和第二电容器板，串联移动器和致动器的可变电容器。 第一和第二电容器板被定位成使得第一和第二电容器板以间隔开的关系彼此面对。 串联移动器被配置成响应于环境温度的变化串联地移动第一和第二电容器板，以保持电容器板之间的一致的间隔开的关系。 致动器然后被配置成响应于外部输入而改变第一和第二电容器板之间的间隔开的关系。 因此，可变电容器的电容可以通过增加和减小第一和第二电容器板之间的间隔开的关系来改变。

    Microelectromechanical actuators including sinuous beam structures
    7.
    发明授权
    Microelectromechanical actuators including sinuous beam structures 失效
    微机电致动器包括弯曲梁结构

    公开(公告)号：US06367252B1

    公开(公告)日：2002-04-09

    申请号：US09610047

    申请日：2000-07-05

    申请人： Edward A. Hill ,  Vijayakumar Rudrappa Dhuler ,  Allen Cowen ,  Ramaswamy Mahadevan ,  Robert L. Wood

    发明人： Edward A. Hill ,  Vijayakumar Rudrappa Dhuler ,  Allen Cowen ,  Ramaswamy Mahadevan ,  Robert L. Wood

    IPC分类号： F01B2910

    CPC分类号： B81B3/0051 ,  B81B2201/038 ,  B81B2203/0109 ,  B81B2203/056 ,  H01H1/0036 ,  H01H61/00 ,  H01H2061/006

    摘要： In embodiments of the present invention, a microelectromechanical actuator includes a beam having respective first and second ends attached to a substrate and a body disposed between the first and second ends having a sinuous shape. The body includes a portion operative to engage a object of actuation and apply a force thereto in a direction perpendicular to the beam responsive to at least one of a compressive force and a tensile force on the beam. The sinuous shape may be sinusoidal, e.g., a shape approximating a single period of a cosine curve or a single period of a sine curve. The beam may be thermally actuated or driven by another actuator. In other embodiments, a rotary actuator includes first and second beams, a respective one of which has first and second ends attached to a substrate and a body disposed between the first and second ends. Each body includes first and second oppositely inflected portions. The bodies of the first and second beams intersect one another at points at which the first and second oppositely inflected portions of the first and second bodies meet. The bodies of the first and second beams are operative to engage the object of actuation and rotate the object of actuation around the point of intersection responsive to at least one of compressive force and tensile force on the first and second beams. Related methods are also described.

    摘要翻译： 在本发明的实施例中，微机电致动器包括具有附接到基板的相应的第一端和第二端的梁，以及设置在具有弯曲形状的第一端和第二端之间的主体。 主体包括可操作地接合致动对象的部分，该部分响应于梁上的压缩力和拉力中的至少一个，沿垂直于梁的方向施加力。 弯曲形状可以是正弦的，例如，近似于余弦曲线的单个周期或正弦曲线的单个周期的形状。 梁可以由另一致动器热致动或驱动。 在其他实施例中，旋转致动器包括第一和第二梁，其中相应的一个具有附接到基板的第一和第二端以及设置在第一和第二端之间的主体。 每个主体包括第一和第二相对弯曲的部分。 第一和第二梁的主体在第一和第二主体的第一和第二相对弯曲部分相交的点处彼此相交。 第一和第二梁的主体可操作以接合致动对象，并且响应于第一和第二梁上的压缩力和拉力中的至少一个而使作动点周围的相对点旋转。 还描述了相关方法。

    Microelectromechanical systems including thermally actuated beams on heaters that move with the thermally actuated beams
    9.
    发明授权
    Microelectromechanical systems including thermally actuated beams on heaters that move with the thermally actuated beams 失效
    微机电系统包括加热器上的热致动梁，其与热致动梁一起移动

    公开(公告)号：US06333583B1

    公开(公告)日：2001-12-25

    申请号：US09537588

    申请日：2000-03-28

    申请人： Ramaswamy Mahadevan ,  Edward A. Hill ,  Robert L. Wood ,  Allen Cowen

    发明人： Ramaswamy Mahadevan ,  Edward A. Hill ,  Robert L. Wood ,  Allen Cowen

    IPC分类号： H01N1000

    CPC分类号： B81B3/0024 ,  B81B2201/031 ,  B81B2203/0109 ,  B81B2203/051 ,  F03G7/06 ,  H01H1/0036 ,  H01H61/02 ,  H01H2001/0068 ,  H01H2061/006

    摘要： Improved microelectromechanical structures include spaced-apart supports on a microelectronic substrate and a beam that extends between the spaced-apart supports and that expands upon application of heat thereto to thereby cause displacement of the beam between the spaced-apart supports. A heater, located on the beam, applies heat to the beam and displaces with the beam as the beam displaces. Therefore, heat can be directly applied to the arched beam, thereby reducing thermal loss between the heater and the arched beam. Furthermore, an air gap between the heater and arched beam may not need to be heated, thereby allowing improved transient thermal response. Moreover, displacing the heater as the arched beam displaces may further reduce thermal loss and transient thermal response by reducing the separation between the heater and the arched beam as the arched beam displaces.

    摘要翻译： 改进的微机电结构包括微电子衬底上的间隔开的支撑件和在间隔开的支撑件之间延伸的梁，并且在施加热量时膨胀，从而导致梁在间隔开的支撑件之间的位移。 位于梁上的加热器对梁施加热量，并随着梁的移位而与梁一起移位。 因此，可以将热量直接施加到拱形梁上，从而减少加热器与拱形梁之间的热损失。 此外，加热器和拱形梁之间的空气间隙可能不需要被加热，从而允许改善的瞬态热响应。 此外，当拱形梁移位时移动加热器可以通过当拱形梁移位时减小加热器和拱形梁之间的间隔来进一步减少热损失和瞬态热响应。