公开(公告)号：US5036379A

公开(公告)日：1991-07-30

申请号：US371946

申请日：1989-06-27

申请人： Robert T. Smith ,  Chang-Hwa Chung

发明人： Robert T. Smith ,  Chang-Hwa Chung

IPC分类号： H05K3/36 ,  H05K3/40 ,  H05K3/42

CPC分类号： H01R12/62 ,  H05K3/365 ,  H05K3/4007 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2203/1572 ,  H05K3/423

摘要： A flexible beam lead tape having three layers having trace conductors, a dielectric and a ground plane. Vias extend through the dielectric layer at the first and second ends of the electrical conductors for providing versatile connections to either ends of the conductors. The ends of the conductors may be provided with electrical connections on either or both sides of the tape and may be connected by pressure contact or by bonding. The tape also includes means for aligning the tape with a substrate to which the tape will be interconnected.

摘要翻译： 具有三层具有迹线导体，电介质和接地平面的柔性束引线带。 通孔延伸穿过电导体的第一和第二端处的电介质层，用于为导体的任一端提供通用的连接。 导体的端部可以在带的一侧或两侧设置电连接，并且可以通过压力接触或通过粘合来连接。 胶带还包括用于将胶带与基材连接的装置，胶带将被连接到该基材上。

公开(公告)号：US5041003A

公开(公告)日：1991-08-20

申请号：US558936

申请日：1990-07-27

申请人： Robert T. Smith ,  Chang-Hwa Chung ,  Yu C. Chang

发明人： Robert T. Smith ,  Chang-Hwa Chung ,  Yu C. Chang

IPC分类号： H01R12/71 ,  H01R12/79 ,  H01R12/88

CPC分类号： H01R12/714 ,  H01R12/79 ,  H01R12/88

摘要： An electrical connector having first and second coacting engagable parts for mating a plurality of spaced electrical contacts in which the system includes predictable alignment, contact force and wiping features. The connector may use flexible circuit tape as the contact elements in which a plurality of modules may be utilized to be aligned separately to avoid cumulative alignment errors. The flexible circuit tape may be a TAB type tape which is configured to allow the end user with the capability to program the signal/ground ratio of the interconnect.

摘要翻译： 一种电连接器，具有第一和第二联合接合部分，用于配合多个间隔开的电触点，其中系统包括可预测的对准，接触力和擦拭特征。 连接器可以使用柔性电路胶带作为其中多个模块可被分开对准的接触元件，以避免累积对准误差。 柔性电路磁带可以是TAB型磁带，其被配置为允许最终用户具有对互连的信号/接地比进行编程的能力。

公开(公告)号：US4860088A

公开(公告)日：1989-08-22

申请号：US96866

申请日：1987-09-14

申请人： Robert T. Smith ,  Chang-Hwa Chung

发明人： Robert T. Smith ,  Chang-Hwa Chung

IPC分类号： H01B7/08 ,  H05K3/36 ,  H05K3/40 ,  H05K3/42

CPC分类号： H01R12/62 ,  H05K3/365 ,  H05K3/4007 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2203/1572 ,  H05K3/423

摘要： A flexible beam lead tape having three layers having trace conductors, a dielectric and a ground plane. Vias extend through the dielectric layer at the first and second ends of the electrical conductors for providing versatile connections to either ends of the conductors. The ends of the conductors may be provided with electrical connections on either or both sides of the tape and may be connected by pressure contact or by bonding.

摘要翻译： 具有三层具有迹线导体，电介质和接地平面的柔性束引线带。 通孔延伸穿过电导体的第一和第二端处的电介质层，用于为导体的任一端提供通用的连接。 导体的端部可以在带的一侧或两侧设置电连接，并且可以通过压力接触或通过粘合来连接。

公开(公告)号：US20090294931A1

公开(公告)日：2009-12-03

申请号：US12538296

申请日：2009-08-10

申请人： Man-Lung Sham ,  Huili Fu ,  Chang-Hwa Chung

发明人： Man-Lung Sham ,  Huili Fu ,  Chang-Hwa Chung

IPC分类号： H01L23/552 ,  H01L21/56

CPC分类号： H01L23/13 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/315 ,  H01L23/552 ,  H01L23/564 ,  H01L24/48 ,  H01L25/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An electronic component package having an EMI shielded space is disclosed. The package comprises a substrate having an electronic component located on its surface and a conductive enclosure having a top and downwardly extending sides enclosing the component and defining a shielded space. A vent opening is provided through the substrate and is located in the shielded space for venting the shielded space. A second vent opening may be provided in the top of the conductive enclosure.

摘要翻译： 公开了具有EMI屏蔽空间的电子部件封装。 封装包括具有位于其表面上的电子部件的基板和导电外壳，其具有包围该部件的顶部和向下延伸的侧面并限定屏蔽空间。 通气孔设置在基板上，并位于屏蔽空间中，用于排出屏蔽空间。 可以在导电外壳的顶部设置第二通气口。

公开(公告)号：US08031484B2

公开(公告)日：2011-10-04

申请号：US11454356

申请日：2006-06-16

申请人： Huili Fu ,  Man Lung Sham ,  Chang-Hwa Chung

发明人： Huili Fu ,  Man Lung Sham ,  Chang-Hwa Chung

IPC分类号： H05K7/02 ,  H05K7/04

CPC分类号： H01L23/3128 ,  H01L23/3677 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An IC package includes a substrate and a plurality of thermal dissipating vias perforating the substrate. The substrate includes a power plane, a ground plane, and a dielectric layer disposed between the power plane and the ground plane. The power plane includes a power region and a non-power region isolated from each other. The thermal dissipating vias are connected to the non-power regions of the power plane and to the ground plane.

摘要翻译： IC封装包括基板和穿过基板的多个散热通孔。 基板包括电源平面，接地平面和布置在电源平面和接地平面之间的电介质层。 电力平面包括彼此隔离的功率区域和非功率区域。 散热通孔连接到电源平面和接地平面的非功率区域。

公开(公告)号：US20070291457A1

公开(公告)日：2007-12-20

申请号：US11454356

申请日：2006-06-16

申请人： Huili Fu ,  Man Lung Sham ,  Chang-Hwa Chung

发明人： Huili Fu ,  Man Lung Sham ,  Chang-Hwa Chung

IPC分类号： H05K7/00

CPC分类号： H01L23/3128 ,  H01L23/3677 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An IC package includes a substrate and a plurality of thermal dissipating vias perforating the substrate. The substrate includes a power plane, a ground plane, and a dielectric layer disposed between the power plane and the ground plane. The power plane includes a power region and a non-power region isolated from each other. The thermal dissipating vias are connected to the non-power regions of the power plane and to the ground plane.

摘要翻译： IC封装包括基板和穿过基板的多个散热通孔。 基板包括电源平面，接地平面和布置在电源平面和接地平面之间的电介质层。 电力平面包括彼此隔离的功率区域和非功率区域。 散热通孔连接到电源平面和接地平面的非功率区域。

公开(公告)号：US07514774B2

公开(公告)日：2009-04-07

申请号：US11521753

申请日：2006-09-15

申请人： Lap Wai Leung ,  Yu-Chih Chen ,  Man-Lung Sham ,  Chang-Hwa Chung

发明人： Lap Wai Leung ,  Yu-Chih Chen ,  Man-Lung Sham ,  Chang-Hwa Chung

IPC分类号： H01L23/02 ,  H01L21/00

CPC分类号： H01L23/552 ,  H01L23/5385 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0652 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15321 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A stacked multi-chip package with an EMI shielded component has first and second substrates mounted together by a grid array of metallic connecting nodes, such as a solder Ball Grid Array. Each substrate has a conductive plane associated with it. An electronic component is mounted between the first and second substrates and is surrounded by a group of the metallic connecting nodes that are also electrically connected to the conductive planes of both substrates to form a conductive Faraday cage about the component.

摘要翻译： 具有EMI屏蔽部件的堆叠多芯片封装具有通过金属连接节点的栅格阵列（例如焊料球栅阵列）安装在一起的第一和第二基板。 每个基板具有与其相关联的导电平面。 电子部件安装在第一和第二基板之间并且被一组金属连接节点包围，金属连接节点也电连接到两个基板的导电平面，以形成围绕部件的导电法拉第笼。

公开(公告)号：US20080067650A1

公开(公告)日：2008-03-20

申请号：US11522016

申请日：2006-09-15

申请人： Man-Lung Sham ,  Huili Fu ,  Chang-Hwa Chung

发明人： Man-Lung Sham ,  Huili Fu ,  Chang-Hwa Chung

IPC分类号： H01L23/02

CPC分类号： H01L23/13 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/315 ,  H01L23/552 ,  H01L23/564 ,  H01L24/48 ,  H01L25/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An electronic component package having an EMI shielded space is disclosed. The package comprises a substrate having an electronic component located on its surface and a conductive enclosure having a top and downwardly extending sides enclosing the component and defining a shielded space. A vent opening is provided through the substrate and is located in the shielded space for venting the shielded space. A second vent opening may be provided in the top of the conductive enclosure.

摘要翻译： 公开了具有EMI屏蔽空间的电子部件封装。 封装包括具有位于其表面上的电子部件的基板和导电外壳，其具有包围该部件的顶部和向下延伸的侧面并限定屏蔽空间。 通气孔设置在基板上，并位于屏蔽空间中，用于排出屏蔽空间。 可以在导电外壳的顶部设置第二通气口。

公开(公告)号：US5049087A

公开(公告)日：1991-09-17

申请号：US604048

申请日：1990-10-26

申请人： Chang-Hwa Chung ,  Thomas H. Hunter ,  Robert H. Haskell, Jr.

发明人： Chang-Hwa Chung ,  Thomas H. Hunter ,  Robert H. Haskell, Jr.

IPC分类号： H01R12/79 ,  H01R12/88

CPC分类号： H01R12/79 ,  H01R12/88 ,  Y10T29/49179 ,  Y10T29/49211

摘要： An electrical connector having first and second coacting parts which include spaced electrical contacts uses a flexible electrical tape having lead ends for connection to a circuit board. Side panels protect the lead ends from damage, during storage and shipment in one position and are releasably connected in a second position to provide support on the leads for bonding. After bonding, the side panels protect the flexible tape from operational damage.

摘要翻译： 具有包括间隔开的电触点的第一和第二共同作用部分的电连接器使用具有用于连接到电路板的引线端的柔性电带。 侧面板在一个位置保护引线端头免受损坏，并且可释放地连接在第二位置以在引线上提供用于接合的支撑。 粘接后，侧面板可保护柔性带免受操作损坏。

公开(公告)号：US08241966B2

公开(公告)日：2012-08-14

申请号：US12538296

申请日：2009-08-10

申请人： Man-Lung Sham ,  Huili Fu ,  Chang-Hwa Chung

发明人： Man-Lung Sham ,  Huili Fu ,  Chang-Hwa Chung

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L23/13 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/315 ,  H01L23/552 ,  H01L23/564 ,  H01L24/48 ,  H01L25/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An electronic component package having an EMI shielded space is disclosed. The package comprises a substrate having an electronic component located on its surface and a conductive enclosure having a top and downwardly extending sides enclosing the component and defining a shielded space. A vent opening is provided through the substrate and is located in the shielded space for venting the shielded space. A second vent opening may be provided in the top of the conductive enclosure.

摘要翻译： 公开了具有EMI屏蔽空间的电子部件封装。 封装包括具有位于其表面上的电子部件的基板和导电外壳，其具有包围该部件的顶部和向下延伸的侧面并限定屏蔽空间。 通气孔设置在基板上，并位于屏蔽空间中，用于排出屏蔽空间。 可以在导电外壳的顶部设置第二通气口。