公开(公告)号：US20180073149A1

公开(公告)日：2018-03-15

申请号：US15263655

申请日：2016-09-13

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Hung Tat Chan ,  Ka Ming Yip ,  Chit Yiu Chan ,  Kwok Wai Yee

IPC: C23C18/16 ,  C08J7/04 ,  B05D1/02 ,  B05D1/18 ,  B05D3/00 ,  B05D3/06 ,  C23C18/38 ,  B05D5/08

CPC classification number: C23C18/1612 ,  B05D1/02 ,  B05D1/18 ,  B05D3/007 ,  B05D3/06 ,  B05D5/068 ,  B05D5/08 ,  B05D2201/02 ,  B05D2505/00 ,  C08J7/045 ,  C08J2379/02 ,  C23C18/1605 ,  C23C18/1641 ,  C23C18/165 ,  C23C18/2013 ,  C23C18/204 ,  C23C18/2086 ,  C23C18/22 ,  C23C18/30 ,  C23C18/38

Abstract: Shielding coatings are applied to polymer substrates for selective metallization of the substrates. The shielding coatings include a primer component and a hydrophobic top coat. The primer is first applied to the polymer substrate followed by application of the top coat component. The shielding coating is then selectively etched to form an outline of a desired current pattern. A catalyst is applied to the patterned polymer substrate followed by electroless metal plating in the etched portions. The portions of the polymer substrate which contain the shielding coating inhibit electroless metal plating. The primers contain polyamines and the top coat contains hydrophobic alky organic compounds.

公开(公告)号：US09850578B1

公开(公告)日：2017-12-26

申请号：US15263645

申请日：2016-09-13

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Hung Tat Chan ,  Ka Ming Yip ,  Chit Yiu Chan ,  Kwok Wai Yee

IPC: C23C18/16 ,  C23C18/18 ,  C23C18/38 ,  C09K13/00 ,  C23C18/22 ,  C23C18/20

CPC classification number: C23C18/1641 ,  C09K13/00 ,  C23C18/1605 ,  C23C18/2013 ,  C23C18/204 ,  C23C18/2086 ,  C23C18/22 ,  C23C18/30 ,  C23C18/38

Abstract: Shielding coatings are applied to polymer substrates for selective metallization of the substrates. The shielding coatings include a primer component and a hydrophobic top coat. The primer is first applied to the polymer substrate followed by application of the top coat component. The shielding coating is then selectively etched to form an outline of a desired current pattern. A catalyst is applied to the patterned polymer substrate followed by electroless metal plating in the etched portions. The portions of the polymer substrate which contain the shielding coating inhibit electroless metal plating. The primers contain five-membered heterocyclic nitrogen compounds and the top coat contains hydrophobic alky organic compounds.

公开(公告)号：US09797043B1

公开(公告)日：2017-10-24

申请号：US15263640

申请日：2016-09-13

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Hung Tat Chan ,  Ka Ming Yip ,  Chit Yiu Chan ,  Kwok Wai Yee

IPC: H01B13/00 ,  C23C18/16 ,  C23C18/38 ,  C23C18/18

CPC classification number: C23C18/38 ,  C23C18/1605 ,  C23C18/1641 ,  C23C18/2006 ,  C23C18/2013 ,  C23C18/204 ,  C23C18/22 ,  C23C18/285 ,  C23C18/30 ,  C23C18/40

Abstract: Shielding coatings are applied to polymer substrates for selective metallization of the substrates. The shielding coatings include a primer component and a hydrophobic top coat. The primer is first applied to the polymer substrate followed by application of the top coat component. The shielding coating is then selectively etched to form an outline of a desired current pattern. A catalyst is applied to the patterned polymer substrate followed by electroless metal plating in the etched portions. The portions of the polymer substrate which contain the shielding coating inhibit electroless metal plating. The primers contain aromatic heterocyclic compounds and the top coat contains hydrophobic alky organic compounds.

公开(公告)号：US09970114B2

公开(公告)日：2018-05-15

申请号：US15263655

申请日：2016-09-13

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Hung Tat Chan ,  Ka Ming Yip ,  Chit Yiu Chan ,  Kwok Wai Yee

IPC: H01B13/00 ,  C23C18/16 ,  C23C18/38 ,  C23C18/18 ,  C09K13/00 ,  C23C18/22 ,  C23C18/20 ,  B05D5/06 ,  C08J7/04 ,  B05D1/02 ,  B05D1/18 ,  B05D3/00 ,  B05D3/06 ,  B05D5/08

CPC classification number: C23C18/1612 ,  B05D1/02 ,  B05D1/18 ,  B05D3/007 ,  B05D3/06 ,  B05D5/068 ,  B05D5/08 ,  B05D2201/02 ,  B05D2505/00 ,  C08J7/045 ,  C08J2379/02 ,  C23C18/1605 ,  C23C18/1641 ,  C23C18/165 ,  C23C18/2013 ,  C23C18/204 ,  C23C18/2086 ,  C23C18/22 ,  C23C18/30 ,  C23C18/38

Abstract: Shielding coatings are applied to polymer substrates for selective metallization of the substrates. The shielding coatings include a primer component and a hydrophobic top coat. The primer is first applied to the polymer substrate followed by application of the top coat component. The shielding coating is then selectively etched to form an outline of a desired current pattern. A catalyst is applied to the patterned polymer substrate followed by electroless metal plating in the etched portions. The portions of the polymer substrate which contain the shielding coating inhibit electroless metal plating. The primers contain polyamines and the top coat contains hydrophobic alky organic compounds.

公开(公告)号：US20170183783A1

公开(公告)日：2017-06-29

申请号：US15375612

申请日：2016-12-12

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Qin Tang ,  Kit Ho Tong ,  Chit Yiu Chan ,  Kwok Wai Yee

IPC: C23F11/00 ,  H05K1/03 ,  H05K3/28 ,  H05K1/09 ,  C09D5/08 ,  C09D7/12

CPC classification number: C23F11/00 ,  C09D5/086 ,  C09D7/48 ,  C23C22/52 ,  C23F11/08 ,  C23F11/149 ,  H05K1/0346 ,  H05K1/09 ,  H05K3/282 ,  H05K2203/0392 ,  H05K2203/0591 ,  H05K2203/124

Abstract: A method for selective deposition of an organic solderability preservative coating on a copper surface of an article is disclosed. The method includes two steps of organic coatings by two solutions; the first step contains contacting the copper surface with a first solution including azole compound and the second step contains contacting the copper surface treated by the first solution with a second solution including a specific pyrazine derived compound.