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    Sensing environmental parameter through stress induced in IC
    1.
    发明授权
    Sensing environmental parameter through stress induced in IC 有权
    通过IC引起的应力感应环境参数

    公开(公告)号：US08872290B2

    公开(公告)日：2014-10-28

    申请号：US13057075

    申请日：2009-07-30

    申请人： Romano Hoofman ,  Remco Henricus Wilhelmus Pijnenbrug ,  Youri Victorovitch Ponomarev

    发明人： Romano Hoofman ,  Remco Henricus Wilhelmus Pijnenbrug ,  Youri Victorovitch Ponomarev

    IPC分类号： H04L23/00 ,  G01D5/18

    CPC分类号： G01D5/18

    摘要： A sensor is provided for sensing a value of a physical parameter characteristic of the sensor's environment. The sensor is implemented in semiconductor technology. A behavior of the sensor's electronic circuitry is affected by stress. The stress is induced by a film covering the circuitry or only part thereof. The stress is caused by the film's material, whose dimensions depend on a value of the parameter. This dependence is different from the 5 dependence of the circuitry's substrate on the same parameter.

    摘要翻译： 提供了用于感测传感器环境的物理参数特性值的传感器。 传感器采用半导体技术实现。 传感器的电子电路的行为受到压力的影响。 应力由覆盖电路或仅部分的膜引起。 压力是由胶片材料造成的，其尺寸取决于参数值。 这种依赖性不同于电路衬底对相同参数的依赖性。

    SENSING ENVIRONMENTAL PARAMETER THROUGH STRESS INDUCED IN IC
    2.
    发明申请
    SENSING ENVIRONMENTAL PARAMETER THROUGH STRESS INDUCED IN IC 有权
    通过IC中诱发的应力感测环境参数

    公开(公告)号：US20110127627A1

    公开(公告)日：2011-06-02

    申请号：US13057075

    申请日：2009-07-30

    申请人： Romano Hoofman ,  Remco Henricus Wilhelmus Pijnenbrug ,  Youri Victorovitch Ponomarev

    发明人： Romano Hoofman ,  Remco Henricus Wilhelmus Pijnenbrug ,  Youri Victorovitch Ponomarev

    IPC分类号： H01L31/0352 ,  H01L29/66

    CPC分类号： G01D5/18

    摘要： A sensor is provided for sensing a value of a physical parameter characteristic of the sensor's environment. The sensor is implemented in semiconductor technology. A behavior of the sensor's electronic circuitry is affected by stress. The stress is induced by a film covering the circuitry or only part thereof. The stress is caused by the film's material, whose dimensions depend on a value of the parameter. This dependence is different from the 5 dependence of the circuitry's substrate on the same parameter.

    摘要翻译： 提供了用于感测传感器环境的物理参数特性值的传感器。 传感器采用半导体技术实现。 传感器的电子电路的行为受到压力的影响。 应力由覆盖电路或仅部分的膜引起。 压力是由胶片材料造成的，其尺寸取决于参数值。 这种依赖性不同于电路衬底对相同参数的依赖性。

    Intrusion protection using stress changes
    3.
    发明授权
    Intrusion protection using stress changes 有权
    使用压力变化的入侵保护

    公开(公告)号：US08330191B2

    公开(公告)日：2012-12-11

    申请号：US12997576

    申请日：2009-05-26

    申请人： Romano Hoofman ,  Remco Henricus Wilhelmus Pijnenburg ,  Youri Victorovitch Ponomarev

    发明人： Romano Hoofman ,  Remco Henricus Wilhelmus Pijnenburg ,  Youri Victorovitch Ponomarev

    IPC分类号： H01L29/84 ,  G08B13/14

    CPC分类号： H01L23/576 ,  G06F21/87 ,  H01L2924/0002 ,  H01L2924/00

    摘要： The invention relates to a integrated circuit comprising an electronic circuit integrated on a substrate (5), and further comprising protections means for protection of the electronic circuit (25). The protection means comprise: i) a first strained encapsulation layer (10) being provided on a first side of the substrate (5), wherein the first strained encapsulation layer (10) has a strain (S1) in a direction parallel to the substrate (5), and ii) disabling means (20) arranged for at least partially disabling the electronic circuit (25) under control of a strain change in the substrate (5). The invention further relates to a method of manufacturing such integrated circuit, and to a system comprising such integrated circuit. Such system is selected from a group comprising: a bank-card, a smart-card, a contact-less card and an RFID. All embodiments of the integrated circuit in accordance with the invention provide essentially an alternative tamper protection to the data stored or present in the electronic circuit therein. A first main group of embodiments concerns an integrated circuit wherein tamper protection is obtained by detecting a strain change during tampering and subsequently disabling the electronic circuit. A second main group of embodiments concerns an integrated circuit wherein tamper protection is obtained by designing a stack of strained encapsulation layers, such that tampering causes releasing of strain and thereby mechanical disintegrate (break, delaminate, etc) of the integrated circuit, and thus disabling the electronic circuit.

    摘要翻译： 本发明涉及一种集成电路，其包括集成在基板（5）上的电子电路，并且还包括用于保护电子电路（25）的保护装置。 保护装置包括：i）第一应变封装层（10），设置在基板（5）的第一侧上，其中第一应变封装层（10）在平行于基板的方向上具有应变（S1） （5），以及ii）布置成在所述衬底（5）中的应变变化的控制下至少部分地禁用所述电子电路（25）的禁用装置（20）。 本发明还涉及一种制造这种集成电路的方法，以及包括这种集成电路的系统。 这样的系统从包括银行卡，智能卡，无接触卡和RFID的组中选择。 根据本发明的集成电路的所有实施例基本上为存储或存在于其中的电子电路中的数据提供了替代的篡改保护。 第一主要实施例涉及集成电路，其中通过在篡改期间检测应变变化并随后禁用电子电路来获得篡改保护。 第二主要实施例涉及一种集成电路，其中通过设计应变封装层的堆叠来获得防篡改，使得篡改导致应变释放，从而导致集成电路的机械分解（破坏，分层等），从而导致无效 电子电路。

    FOOD PACKAGE WITH INTEGRATED RFID-TAG AND SENSOR
    4.
    发明申请
    FOOD PACKAGE WITH INTEGRATED RFID-TAG AND SENSOR 有权
    具有集成RFID标签和传感器的食品包装

    公开(公告)号：US20110291806A1

    公开(公告)日：2011-12-01

    申请号：US13116920

    申请日：2011-05-26

    申请人： Romano Hoofman ,  Roel Daamen ,  Youri Victorovitch Ponomarev ,  Fotopoulou Kyriaki ,  Matthias Merz ,  Gilberto Curatola ,  Anton Tombeur

    发明人： Romano Hoofman ,  Roel Daamen ,  Youri Victorovitch Ponomarev ,  Fotopoulou Kyriaki ,  Matthias Merz ,  Gilberto Curatola ,  Anton Tombeur

    IPC分类号： H04Q5/22

    CPC分类号： B65D79/02 ,  B65D2203/10 ,  G01N33/0062 ,  G01N33/02

    摘要： A container for containing a perishable substance has a container wall with an inner side and an outer side. The wall has an electrically conductive layer extending between the inner side and the outer side. The inner side faces the space containing the substance. The container comprises electronic circuitry having a sensor for sensing a physical property or condition of the substance, and an antenna for communicating an RF signal to a receiver, external to the container. The RF signal is indicative of the physical property or condition sensed. The sensor is positioned so as to be exposed to the space containing the substance in operational use of the container. The antenna is positioned at the outer side, or between the outer side and the electrically conductive layer, and is electrically isolated from the electrically conductive layer.

    摘要翻译： 用于容纳易腐物质的容器具有容纳有内侧和外侧的容器壁。 该壁具有在内侧和外侧之间延伸的导电层。 内侧面向包含物质的空间。 容器包括具有用于感测物质的物理性质或状况的传感器的电子电路和用于将RF信号传送到容器外部的接收器的天线。 RF信号表示所感测到的物理属性或状况。 传感器被定位成在容器的操作使用中暴露于容纳物质的空间。 天线位于外侧，或位于外侧和导电层之间，并且与导电层电隔离。

    Humidity sensor based on progressive corrosion of exposed material
    7.
    发明授权
    Humidity sensor based on progressive corrosion of exposed material 失效
    基于暴露材料逐渐腐蚀的湿度传感器

    公开(公告)号：US08683861B2

    公开(公告)日：2014-04-01

    申请号：US12670715

    申请日：2008-07-30

    申请人： Aurelie Humbert ,  Youri Victorovitch Ponomarev ,  Matthias Merz ,  Romano Hoofman

    发明人： Aurelie Humbert ,  Youri Victorovitch Ponomarev ,  Matthias Merz ,  Romano Hoofman

    IPC分类号： G01N19/00

    CPC分类号： G01N17/04

    摘要： A sensor senses a characteristic of an environment, e.g., humidity. The sensor has a substrate with strips of material that is sensitive to corrosion as a result of the characteristic. The strips are configured to respond differently to the characteristic. By means of repeatedly measuring the resistances of the strips, the environment can be monitored in terms of accumulated exposure to the characteristic. The strips are manufactured in a semiconductor technology so as to generate accurate sensors that behave predictably.

    摘要翻译： 传感器感测环境的特性，例如湿度。 传感器具有由于特性而对腐蚀敏感的材料条带的基板。 条带被配置为对特性做出不同的响应。 通过重复测量条的电阻，可以根据特征的累积暴露来监测环境。 这些条以半导体技术制造，以便产生可预测地行为的精确传感器。

    INTRUSION PROTECTION USING STRESS CHANGES
    8.
    发明申请
    INTRUSION PROTECTION USING STRESS CHANGES 有权
    使用压力变化的侵入保护

    公开(公告)号：US20110089506A1

    公开(公告)日：2011-04-21

    申请号：US12997576

    申请日：2009-05-26

    申请人： Romano Hoofman ,  Remco Henricus Wilhelmus Pijnenburg ,  Youri Victorovitch Ponomarev

    发明人： Romano Hoofman ,  Remco Henricus Wilhelmus Pijnenburg ,  Youri Victorovitch Ponomarev

    IPC分类号： H01L29/84 ,  G06K19/073 ,  H01L21/56

    CPC分类号： H01L23/576 ,  G06F21/87 ,  H01L2924/0002 ,  H01L2924/00

    摘要： The invention relates to a integrated circuit comprising an electronic circuit integrated on a substrate (5), and further comprising protections means for protection of the electronic circuit (25). The protection means comprise: i) a first strained encapsulation layer (10) being provided on a first side of the substrate (5), wherein the first strained encapsulation layer (10) has a strain (S1) in a direction parallel to the substrate (5), and ii) disabling means (20) arranged for at least partially disabling the electronic circuit (25) under control of a strain change in the substrate (5). The invention further relates to a method of manufacturing such integrated circuit, and to a system comprising such integrated circuit. Such system is selected from a group comprising: a bank-card, a smart-card, a contact-less card and an RFID. All embodiments of the integrated circuit in accordance with the invention provide essentially an alternative tamper protection to the data stored or present in the electronic circuit therein. A first main group of embodiments concerns an integrated circuit wherein tamper protection is obtained by detecting a strain change during tampering and subsequently disabling the electronic circuit. A second main group of embodiments concerns an integrated circuit wherein tamper protection is obtained by designing a stack of strained encapsulation layers, such that tampering causes releasing of strain and thereby mechanical disintegrate (break, delaminate, etc) of the integrated circuit, and thus disabling the electronic circuit.

    摘要翻译： 本发明涉及一种集成电路，其包括集成在基板（5）上的电子电路，并且还包括用于保护电子电路（25）的保护装置。 保护装置包括：i）第一应变封装层（10），设置在基板（5）的第一侧上，其中第一应变封装层（10）在平行于基板的方向上具有应变（S1） （5），以及ii）布置成在所述衬底（5）中的应变变化的控制下至少部分地禁用所述电子电路（25）的禁用装置（20）。 本发明还涉及一种制造这种集成电路的方法，以及包括这种集成电路的系统。 这样的系统从包括银行卡，智能卡，无接触卡和RFID的组中选择。 根据本发明的集成电路的所有实施例基本上为存储或存在于其中的电子电路中的数据提供了替代的篡改保护。 第一主要实施例涉及集成电路，其中通过在篡改期间检测应变变化并随后禁用电子电路来获得篡改保护。 第二主要实施例涉及一种集成电路，其中通过设计应变封装层的堆叠来获得防篡改，使得篡改导致应变释放，从而导致集成电路的机械分解（破坏，分层等），从而导致无效 电子电路。

    HUMIDITY SENSOR BASED ON PROGRESSIVE CORROSION OF EXPOSED MATERIAL
    9.
    发明申请
    HUMIDITY SENSOR BASED ON PROGRESSIVE CORROSION OF EXPOSED MATERIAL 失效
    基于暴露材料逐渐腐蚀的湿度传感器

    公开(公告)号：US20100192688A1

    公开(公告)日：2010-08-05

    申请号：US12670715

    申请日：2008-07-30

    申请人： Aurelie Humbert ,  Youri Victorovitch Ponomarev ,  Matthias Merz ,  Romano Hoofman

    发明人： Aurelie Humbert ,  Youri Victorovitch Ponomarev ,  Matthias Merz ,  Romano Hoofman

    IPC分类号： G01N17/04

    CPC分类号： G01N17/04

    摘要： A sensor senses a characteristic of an environment, e.g., humidity. The sensor has a substrate with strips of material that is sensitive to corrosion as a result of the characteristic. The strips are configured to respond differently to the characteristic. By means of repeatedly measuring the resistances of the strips, the environment can be monitored in terms of accumulated exposure to the characteristic. The strips are manufactured in a semiconductor technology so as to generate accurate sensors that behave predictably.

    摘要翻译： 传感器感测环境的特性，例如湿度。 传感器具有由于特性而对腐蚀敏感的材料条带的基板。 条带被配置为对特性做出不同的响应。 通过重复测量条的电阻，可以根据特征的累积暴露来监测环境。 这些条以半导体技术制造，以便产生可预测地行为的精确传感器。