摘要:
A parallel calibration system for an electronic circuit tester comprises test and measurement electronics, a test fixture coupled to the test and measurement electronics, the test fixture comprising clock reference circuitry and clock distribution circuitry, a device under test interface, and a plurality of calibration boards coupled to the device under test interface, wherein the plurality of calibration boards and the clock distribution circuitry simultaneously test the signal paths of a plurality of test channels.
摘要:
Systems and methods for calibrating the timing of electronic circuit testers and verifying the timing calibration of electronic circuit testers are described. In some embodiments, a calibration reference signal is transmitted from the test head directly through the load board interface, rather than through external instruments, so that timing errors associated with external wires and cables may be avoided. The timing calibration and timing calibration verification functionality is provided on a single calibration board, thereby reducing the calibration set-up time relative to conventional robot-based calibrators. In addition, a high pin count electronic circuit testers may be calibrated by a calibration board that is configured to calibrate one subset of the test channels at a time. In some embodiments, test channels are connected directly to calibration board comparators to avoid the accumulated signal degradation and the signal path route errors that may result from transmitting tester channel signals through a mechanical relay selection matrix.
摘要:
A parallel calibration system for an electronic circuit tester comprises test and measurement electronics, a test fixture coupled to the test and measurement electronics, the test fixture comprising clock reference circuitry and clock distribution circuitry, a device under test interface, and a plurality of calibration boards coupled to the device under test interface, wherein the plurality of calibration boards and the clock distribution circuitry simultaneously test the signal paths of a plurality of test channels.
摘要:
An epoxy filled via hole in a printed circuit board is presented. The epoxy filled via hole may have metal plating between the epoxy and the via hole walls of the printed circuit board. The epoxy filled via hole may have a land pad directly over the epoxy filling, creating a compact contact area for an ATE interposer.
摘要:
Apparatus is for processing signals between a tester and devices under test. In one embodiment, the apparatus includes at least one multichip module. Each multichip module has a plurality of micro-electromechanical switches between a set of connectors to the tester and a set of connectors to devices under test. At least one driver is provided to operate each of the micro-electromechanical switches. A method of processing signals between a tester and devices under test is disclosed. In an embodiment, the method includes connecting the tester and the devices under test with at least one multichip module. Each of the at least one multichip module has a plurality of micro-electromechanical switches between a set of connectors to the tester and a set of connectors to the devices under test. The method includes operating each of the micro-electromechanical switches. Other embodiments are also disclosed.
摘要:
In one embodiment, a mock wafer for calibrating automated test equipment includes a printed circuit board having a number of interconnect areas, with each interconnect area having a pair of mock die pads that are coupled via a connecting trace. In another embodiment, a method for calibrating automated test equipment (ATE) may include coupling the mock wafer to the ATE, and then causing the ATE to i) index the mock wafer with respect to a test head connector, ii) couple a number of probes or the test head connector to a number of the mock wafer's mock die pads, iii) transmit a test signal between a pair of the probes that are coupled via a pair of mock die pads and connecting trace of the mock wafer, and iv) calibrate a selected signal path or paths of the ATE by recording a characteristic of the transmitted test signal.
摘要:
In one embodiment, a mating circuit assembly is coupled and decoupled to a system by 1) mechanically and electrically coupling at least a first interposer, mounted on at least one of first and second substrates, to the mating circuit assembly. The mechanical and electrical coupling is accomplished using at least first and second spring mechanisms, with the first and second spring mechanisms being mounted between the connector housing and respective ones of the first and second substrates. At least one of the first and second substrates transmits signals between the first interposer and the system. The first interposer is electrically and mechanically decoupled from the mating circuit assembly by creating a vacuum between the connector housing and at least one of the first and second substrates. Other embodiments are also disclosed.
摘要:
In one embodiment, an integrated circuit (IC) includes a power distribution network having a first set of power distribution lines connected to a source voltage and a second set of power distribution lines connected to a ground voltage, and a first capacitor. A first variable resistive element is electrically coupled in series with the first capacitor between the first and second sets of power lines of the power distribution network. A control circuit is coupled to the variable resistive element and is configured and arranged to adjust a level of resistance of the first variable resistive element in response to an input signal. The adjustment of the level of resistance adjusts an equivalent series resistance of the power distribution network.
摘要:
A paddle board probe card for connecting a device under test with an ATE tester by means of ZIF connectors is presented. The paddle board probe card may include more than one printed circuit board mounted on a probe card in such a manner that the more than one printed circuit boards mate with ZIF connectors on an ATE testhead interface.