公开(公告)号：US08123896B2

公开(公告)日：2012-02-28

申请号：US11596582

申请日：2005-05-31

申请人： Ryosuke Watanabe ,  Hidekazu Takahashi ,  Takuya Tsurume

发明人： Ryosuke Watanabe ,  Hidekazu Takahashi ,  Takuya Tsurume

IPC分类号： B29C65/22 ,  B29C65/56 ,  B32B37/06 ,  B32B37/10 ,  B32B37/14 ,  B30B15/34 ,  B32B37/04 ,  B32B37/18 ,  B30B5/02

CPC分类号： H01L21/56 ,  B32B37/20 ,  B32B2305/342 ,  B42D25/45 ,  B42D2033/46 ,  G06K19/07718 ,  G06K19/07749 ,  G06K19/0775 ,  H01L21/67126 ,  H01L21/67132 ,  H01L21/67144 ,  H01L21/6835 ,  H01L27/1214 ,  H01L27/1266 ,  H01L2221/68318 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2924/0002 ,  Y10T156/1089 ,  Y10T156/1093 ,  Y10T156/1712 ,  H01L2924/00

摘要： It is an object of the invention to improve the production efficiency in sealing a thin film integrated circuit and to prevent the damage and break. Further, it is another object of the invention to prevent a thin film integrated circuit from being damaged in shipment and to make it easier to handle the thin film integrated circuit. The invention provides a laminating system in which rollers are used for supplying a substrate for sealing, receiving IC chips, separating, and sealing. The separation, sealing, and reception of a plurality of thin film integrated circuits can be carried out continuously by rotating the rollers; thus, the production efficiency can be extremely improved. Further, the thin film integrated circuits can be easily sealed since a pair of rollers opposite to each other is used.

摘要翻译： 本发明的目的是提高密封薄膜集成电路的生产效率并防止损坏和断裂。 此外，本发明的另一个目的是防止薄膜集成电路在运输中受损，并且使得更容易处理薄膜集成电路。 本发明提供了一种层压系统，其中辊子用于供应用于密封的基板，接收IC芯片，分离和密封。 通过旋转辊可以连续地进行多个薄膜集成电路的分离，密封和接收; 从而可以极大地提高生产效率。 此外，由于使用了彼此相对的一对辊，所以能够容易地密封薄膜集成电路。

公开(公告)号：US08698156B2

公开(公告)日：2014-04-15

申请号：US12403988

申请日：2009-03-13

申请人： Ryosuke Watanabe ,  Hidekazu Takahashi ,  Takuya Tsurume

发明人： Ryosuke Watanabe ,  Hidekazu Takahashi ,  Takuya Tsurume

IPC分类号： H01L29/12 ,  H01L29/786 ,  H01L23/31

CPC分类号： H01L21/56 ,  B32B37/20 ,  B32B2305/342 ,  B42D25/45 ,  B42D2033/46 ,  G06K19/07718 ,  G06K19/07749 ,  G06K19/0775 ,  H01L21/67126 ,  H01L21/67132 ,  H01L21/67144 ,  H01L21/6835 ,  H01L27/1214 ,  H01L27/1266 ,  H01L2221/68318 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2924/0002 ,  Y10T156/1089 ,  Y10T156/1093 ,  Y10T156/1712 ,  H01L2924/00

摘要： It is an object of the invention to improve the production efficiency in sealing a thin film integrated circuit and to prevent the damage and break. Further, it is another object of the invention to prevent a thin film integrated circuit from being damaged in shipment and to make it easier to handle the thin film integrated circuit. The invention provides a laminating system in which rollers are used for supplying a substrate for sealing, receiving IC chips, separating, and sealing. The separation, sealing, and reception of a plurality of thin film integrated circuits can be carried out continuously by rotating the rollers; thus, the production efficiency can be extremely improved. Further, the thin film integrated circuits can be easily sealed since a pair of rollers opposite to each other is used.

摘要翻译： 本发明的目的是提高密封薄膜集成电路的生产效率并防止损坏和断裂。 此外，本发明的另一个目的是防止薄膜集成电路在运输中受损，并且使得更容易处理薄膜集成电路。 本发明提供了一种层压系统，其中辊子用于供应用于密封的基板，接收IC芯片，分离和密封。 通过旋转辊可以连续地进行多个薄膜集成电路的分离，密封和接收; 从而可以极大地提高生产效率。 此外，由于使用了彼此相对的一对辊，所以能够容易地密封薄膜集成电路。

公开(公告)号：US20060011288A1

公开(公告)日：2006-01-19

申请号：US11168353

申请日：2005-06-29

申请人： Ryosuke Watanabe ,  Hidekazu Takahashi ,  Takuya Tsurume ,  Yasuyuki Arai ,  Yasuko Watanabe ,  Miyuki Higuchi

发明人： Ryosuke Watanabe ,  Hidekazu Takahashi ,  Takuya Tsurume ,  Yasuyuki Arai ,  Yasuko Watanabe ,  Miyuki Higuchi

IPC分类号： B32B37/00 ,  B29C65/00

CPC分类号： H01L21/56 ,  B32B37/153 ,  B32B37/226 ,  B32B2305/342 ,  B32B2519/02 ,  G06K19/07718 ,  G06K19/07749 ,  H01L21/67132 ,  H01L2924/0002 ,  Y10T29/41 ,  Y10T156/1095 ,  Y10T156/1734 ,  H01L2924/00

摘要： The invention provides a laminating system in which one of second and third substrates for sealing a thin film integrated circuit is supplied to a first substrate having the plurality of thin film integrated circuit while being extruded in a heated and melted state, and further rollers are used for supplying the other substrate, receiving IC chips, separating, and sealing. Processes of separating the thin film integrated circuits provided over the first substrate, sealing the separated thin film integrated circuits, and receiving the sealed thin film integrated circuits can be continuously carried out by rotating the rollers. Thus, the production efficiency can be extremely improved.

公开(公告)号：US07591863B2

公开(公告)日：2009-09-22

申请号：US11168353

申请日：2005-06-29

申请人： Ryosuke Watanabe ,  Hidekazu Takahashi ,  Takuya Tsurume ,  Yasuyuki Arai ,  Yasuko Watanabe ,  Miyuki Higuchi

发明人： Ryosuke Watanabe ,  Hidekazu Takahashi ,  Takuya Tsurume ,  Yasuyuki Arai ,  Yasuko Watanabe ,  Miyuki Higuchi

IPC分类号： H01L21/00 ,  H01L21/64

CPC分类号： H01L21/56 ,  B32B37/153 ,  B32B37/226 ,  B32B2305/342 ,  B32B2519/02 ,  G06K19/07718 ,  G06K19/07749 ,  H01L21/67132 ,  H01L2924/0002 ,  Y10T29/41 ,  Y10T156/1095 ,  Y10T156/1734 ,  H01L2924/00

摘要： The invention provides a laminating system in which one of second and third substrates for sealing a thin film integrated circuit is supplied to a first substrate having the plurality of thin film integrated circuit while being extruded in a heated and melted state, and further rollers are used for supplying the other substrate, receiving IC chips, separating, and sealing. Processes of separating the thin film integrated circuits provided over the first substrate, sealing the separated thin film integrated circuits, and receiving the sealed thin film integrated circuits can be continuously carried out by rotating the rollers. Thus, the production efficiency can be extremely improved.

摘要翻译： 本发明提供了一种层压系统，其中用于密封薄膜集成电路的第二和第三基板中的一个被提供到具有多个薄膜集成电路的第一基板，同时在加热和熔融状态下挤出，并且使用另外的辊 用于供给另一个基板，接收IC芯片，分离和密封。 通过旋转辊可以连续地进行分离设置在第一基板上的薄膜集成电路，密封分离的薄膜集成电路和接收密封的薄膜集成电路的工艺。 因此，可以极大地提高生产效率。

公开(公告)号：US20080044940A1

公开(公告)日：2008-02-21

申请号：US11596582

申请日：2005-05-31

申请人： Ryosuke Watanabe ,  Hidekazu Takahashi ,  Takuya Tsurume

发明人： Ryosuke Watanabe ,  Hidekazu Takahashi ,  Takuya Tsurume

IPC分类号： H01L21/67

CPC分类号： H01L21/56 ,  B32B37/20 ,  B32B2305/342 ,  B42D25/45 ,  B42D2033/46 ,  G06K19/07718 ,  G06K19/07749 ,  G06K19/0775 ,  H01L21/67126 ,  H01L21/67132 ,  H01L21/67144 ,  H01L21/6835 ,  H01L27/1214 ,  H01L27/1266 ,  H01L2221/68318 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2924/0002 ,  Y10T156/1089 ,  Y10T156/1093 ,  Y10T156/1712 ,  H01L2924/00

摘要： It is an object of the invention to improve the production efficiency in sealing a thin film integrated circuit and to prevent the damage and break. Further, it is another object of the invention to prevent a thin film integrated circuit from being damaged in shipment and to make it easier to handle the thin film integrated circuit. The invention provides a laminating system in which rollers are used for supplying a substrate for sealing, receiving IC chips, separating, and sealing. The separation, sealing, and reception of a plurality of thin film integrated circuits can be carried out continuously by rotating the rollers; thus, the production efficiency can be extremely improved. Further, the thin film integrated circuits can be easily sealed since a pair of rollers opposite to each other is used.

摘要翻译： 本发明的目的是提高密封薄膜集成电路的生产效率并防止损坏和断裂。 此外，本发明的另一个目的是防止薄膜集成电路在运输中受损，并且使得更容易处理薄膜集成电路。 本发明提供了一种层压系统，其中辊子用于供应用于密封的基板，接收IC芯片，分离和密封。 通过旋转辊可以连续地进行多个薄膜集成电路的分离，密封和接收; 从而可以极大地提高生产效率。 此外，由于使用了彼此相对的一对辊，所以能够容易地密封薄膜集成电路。

公开(公告)号：US09040998B2

公开(公告)日：2015-05-26

申请号：US13530392

申请日：2012-06-22

申请人： Takuya Tsurume ,  Hideomi Suzawa ,  Shunpei Yamazaki

发明人： Takuya Tsurume ,  Hideomi Suzawa ,  Shunpei Yamazaki

IPC分类号： H01L27/15 ,  H01L27/32 ,  H01L27/12 ,  H01L51/52

CPC分类号： H01L27/3246 ,  H01L27/1225 ,  H01L27/3262 ,  H01L51/5237 ,  H01L51/5259

摘要： A light-emitting device in which reduction in performance due to moisture is suppressed is provided. The light-emitting device has a structure in which a partition having a porous structure surrounds each of light-emitting elements. The partition having a porous structure physically adsorbs moisture; therefore, in the light-emitting device, the partition functions as a hygroscopic film at a portion extremely close to the light-emitting element, so that moisture or water vapor remaining in the light-emitting device or entering from the outside can be effectively adsorbed. Thus, reduction in performance of the light-emitting device due to moisture or water vapor can be effectively suppressed.

摘要翻译： 提供抑制湿气性能下降的发光装置。 发光装置具有其中具有多孔结构的分隔件围绕每个发光元件的结构。 具有多孔结构的分隔物物理吸附水分; 因此，在发光装置中，隔板在与发光元件非常接近的部分处起吸湿性的作用，从而能够有效地吸附残留在发光元件中或从外部进入的水分或水蒸汽 。 因此，可以有效地抑制由于水分或水蒸气导致的发光装置的性能的降低。

公开(公告)号：US08822272B2

公开(公告)日：2014-09-02

申请号：US11885958

申请日：2006-03-17

申请人： Takuya Tsurume ,  Etsuko Asano

发明人： Takuya Tsurume ,  Etsuko Asano

IPC分类号： H01L29/36

CPC分类号： G01R31/2601 ,  G01R31/2607 ,  G01R31/2822 ,  G01R31/2884 ,  H01L21/6835 ,  H01L21/78 ,  H01L22/14 ,  H01L22/34 ,  H01L23/66 ,  H01L2221/68359 ,  H01L2223/6677 ,  H01L2924/0002 ,  H01L2924/00

摘要： To provide a semiconductor device capable of being easily subjected to a physical test without deteriorating characteristics. According to a measuring method of a semiconductor device in which an element layer provided with a test element including a terminal portion is sealed with first and second films having flexibility, the first film formed over the terminal portion is removed to form a contact hole reaching the terminal portion; the contact hole is filled with a resin containing a conductive material; heating is carried out after arranging a wiring substrate having flexibility over the resin with which filling has been performed so that the terminal portion and the wiring substrate having flexibility are electrically connected via the resin containing a conductive material; and a measurement is performed.

摘要翻译： 提供能够容易进行物理测试而不劣化特性的半导体器件。 根据半导体器件的测量方法，其中设置有包括端子部分的测试元件的元件层被具有柔性的第一和第二膜密封，去除在端子部分上形成的第一膜以形成到达 端子部分 接触孔填充含有导电材料的树脂; 在将具有柔性的布线基板布置在已经进行了填充的树脂上之后进行加热，使得具有柔性的端子部分和布线基板通过包含导电材料的树脂电连接; 并进行测量。

公开(公告)号：US08734915B2

公开(公告)日：2014-05-27

申请号：US12391840

申请日：2009-02-24

申请人： Shunpei Yamazaki ,  Takahiro Ibe ,  Takuya Tsurume ,  Koichiro Tanaka ,  Satoshi Seo

发明人： Shunpei Yamazaki ,  Takahiro Ibe ,  Takuya Tsurume ,  Koichiro Tanaka ,  Satoshi Seo

IPC分类号： B05D3/06 ,  B05D5/12 ,  C23C14/32 ,  C23C14/28

CPC分类号： C23C14/28 ,  C23C14/048 ,  H01L27/3211 ,  H01L51/0013 ,  H01L51/56

摘要： A film-formation method whereby a minute pattern thin film can be formed on a deposition substrate, without provision of a mask between a material and the deposition substrate. Moreover, a light-emitting element is formed by such a film-formation method, and a high-definition light-emitting device can be manufactured. Through a film-formation substrate in which a reflective layer, a light-absorbing layer and a material layer are formed, the light-absorbing layer is irradiated with light, so that a material contained in the material layer is deposited on a deposition substrate which is disposed to face the film-formation substrate. Since the reflective layer is selectively formed, a film to be deposited on the deposition substrate can be selectively formed with a minute pattern reflecting the pattern of the reflective layer. A wet process can be employed for formation of the material layer.

摘要翻译： 可以在沉积基板上形成微图案薄膜而不在材料和沉积基板之间设置掩模的成膜方法。 此外，通过这样的成膜方法形成发光元件，并且可以制造高清晰度发光器件。 通过形成反射层，光吸收层和材料层的成膜基板，对光吸收层照射光，使得包含在材料层中的材料沉积在沉积基板上 配置成面对成膜基板。 由于选择性地形成反射层，所以可以以反射层的图案的微小图案选择性地形成沉积在沉积基板上的膜。 可以采用湿法来形成材料层。

公开(公告)号：US08673739B2

公开(公告)日：2014-03-18

申请号：US13303519

申请日：2011-11-23

申请人： Toru Takayama ,  Yuugo Goto ,  Yumiko Fukumoto ,  Junya Maruyama ,  Takuya Tsurume

发明人： Toru Takayama ,  Yuugo Goto ,  Yumiko Fukumoto ,  Junya Maruyama ,  Takuya Tsurume

IPC分类号： H01L21/30

CPC分类号： H01L27/1266 ,  H01L27/1214 ,  H01L33/0079

摘要： It is an object of the invention to provide a lightweight semiconductor device having a highly reliable sealing structure which can prevent ingress of impurities such as moisture that deteriorate element characteristics, and a method of manufacturing thereof. A protective film having superior gas barrier properties (which is a protective film that is likely to damage an element if the protective film is formed on the element directly) is previously formed on a heat-resistant substrate other than a substrate with the element formed thereon. The protective film is peeled off from the heat-resistant substrate, and transferred over the substrate with the element formed thereon so as to seal the element.

摘要翻译： 本发明的目的是提供一种具有高度可靠的密封结构的轻质半导体器件及其制造方法，该密封结构能够防止元素特性恶化的诸如水分等杂质的侵入。 具有优异阻气性的保护膜（其是如果在元件上直接形成保护膜时可能损坏元件的保护膜）预先在其上形成有元件的基板之外的耐热基板上形成 。 保护膜从耐热基材上剥离，并在其上形成的元件在基板上转印以密封元件。

公开(公告)号：US08617995B2

公开(公告)日：2013-12-31

申请号：US13217543

申请日：2011-08-25

申请人： Takuya Tsurume ,  Akihiro Chida

发明人： Takuya Tsurume ,  Akihiro Chida

IPC分类号： H01L21/461

CPC分类号： H01L51/5253 ,  H01L51/5203 ,  H01L2251/5338 ,  H01L2251/558

摘要： When a semiconductor device having a surface provided with a flexible protective material is manufactured, the misalignment of the protective material occurs at the time of disposing the protective material or performing adhesion treatment. In the case where the terminal portion over the substrate has a length X of 5 mm or less, by providing a step layer with a thickness of 0.38 X or more and 2 mm or less over the element portion, a space is formed between a surface of the terminal portion and the protective material even though the protective material disposed over the step layer so as to cover the element portion is overlapped with the terminal portion. By using an attaching member including an elastic material with a surface hardness of 50 or more and 100 or less in this state, the protective material and the substrate may be attached to each other.

摘要翻译： 当制造具有设置有柔性保护材料的表面的半导体器件时，在设置保护材料或进行粘合处理时发生保护材料的未对准。 在衬底上的端子部分的长度X为5mm以下的情况下，通过在元件部分上设置厚度为0.38×2以上且2mm以下的台阶层，在表面 即使设置在台阶层上的覆盖元件部分的保护材料与端子部分重叠，也可以是端子部分和保护材料。 通过在这种状态下使用包括表面硬度为50以上且100以下的弹性材料的安装构件，可以将保护材料和基板相互连接。