公开(公告)号：US08617995B2

公开(公告)日：2013-12-31

申请号：US13217543

申请日：2011-08-25

申请人： Takuya Tsurume ,  Akihiro Chida

发明人： Takuya Tsurume ,  Akihiro Chida

IPC分类号： H01L21/461

CPC分类号： H01L51/5253 ,  H01L51/5203 ,  H01L2251/5338 ,  H01L2251/558

摘要： When a semiconductor device having a surface provided with a flexible protective material is manufactured, the misalignment of the protective material occurs at the time of disposing the protective material or performing adhesion treatment. In the case where the terminal portion over the substrate has a length X of 5 mm or less, by providing a step layer with a thickness of 0.38 X or more and 2 mm or less over the element portion, a space is formed between a surface of the terminal portion and the protective material even though the protective material disposed over the step layer so as to cover the element portion is overlapped with the terminal portion. By using an attaching member including an elastic material with a surface hardness of 50 or more and 100 or less in this state, the protective material and the substrate may be attached to each other.

摘要翻译： 当制造具有设置有柔性保护材料的表面的半导体器件时，在设置保护材料或进行粘合处理时发生保护材料的未对准。 在衬底上的端子部分的长度X为5mm以下的情况下，通过在元件部分上设置厚度为0.38×2以上且2mm以下的台阶层，在表面 即使设置在台阶层上的覆盖元件部分的保护材料与端子部分重叠，也可以是端子部分和保护材料。 通过在这种状态下使用包括表面硬度为50以上且100以下的弹性材料的安装构件，可以将保护材料和基板相互连接。

公开(公告)号：US20120049340A1

公开(公告)日：2012-03-01

申请号：US13217543

申请日：2011-08-25

申请人： Takuya Tsurume ,  Akihiro Chida

发明人： Takuya Tsurume ,  Akihiro Chida

IPC分类号： H01L23/28 ,  H01L21/56

CPC分类号： H01L51/5253 ,  H01L51/5203 ,  H01L2251/5338 ,  H01L2251/558

摘要： When a semiconductor device having a surface provided with a flexible protective material is manufactured, the misalignment of the protective material occurs at the time of disposing the protective material or performing adhesion treatment. In the case where the terminal portion over the substrate has a length X of 5 mm or less, by providing a step layer with a thickness of 0.38 X or more and 2 mm or less over the element portion, a space is formed between a surface of the terminal portion and the protective material even though the protective material disposed over the step layer so as to cover the element portion is overlapped with the terminal portion. By using an attaching member including an elastic material with a surface hardness of 50 or more and 100 or less in this state, the protective material and the substrate may be attached to each other.

摘要翻译： 当制造具有设置有柔性保护材料的表面的半导体器件时，在设置保护材料或进行粘合处理时发生保护材料的未对准。 在衬底上的端子部分的长度X为5mm以下的情况下，通过在元件部分上设置厚度为0.38×2以上且2mm以下的台阶层，在表面 即使设置在台阶层上的覆盖元件部分的保护材料与端子部分重叠，也可以是端子部分和保护材料。 通过在这种状态下使用包括表面硬度为50以上且100以下的弹性材料的安装构件，可以将保护材料和基板相互连接。

公开(公告)号：US09000442B2

公开(公告)日：2015-04-07

申请号：US13005766

申请日：2011-01-13

申请人： Kaoru Hatano ,  Takaaki Nagata ,  Nozomu Sugisawa ,  Tatsuya Okano ,  Akihiro Chida ,  Tatsunori Inoue

发明人： Kaoru Hatano ,  Takaaki Nagata ,  Nozomu Sugisawa ,  Tatsuya Okano ,  Akihiro Chida ,  Tatsunori Inoue

IPC分类号： H01L27/14 ,  H01L27/12

CPC分类号： H01L27/1266 ,  H01L27/1225

摘要： To simply provide a flexible light-emitting device with long lifetime. To provide a flexible light-emitting device with favorable display characteristics, high yield, and high reliability without display unevenness. Provided is a flexible light-emitting device including: a substrate having flexibility and a property of transmitting visible light; an adhesive layer provided over the substrate; a conductive layer having a property of transmitting visible light provided over the adhesive layer; an insulating layer disposed over the conductive layer; a transistor provided over the insulating layer; an interlayer insulating layer covering the transistor, a light-emitting element including a first electrode electrically connected to source or drain electrodes of the transistor and provided over the interlayer insulating layer, a second electrode facing the first electrode, and a layer including an organic compound having a light-emitting property provided between the first and second electrodes; and a sealing layer covering the light-emitting element.

摘要翻译： 简单地提供具有长寿命的柔性发光装置。 提供具有良好的显示特性，高产率和高可靠性的柔性发光装置，而不会出现显示不均匀。 提供一种柔性发光装置，包括：具有柔性的透射可见光的特性的基板; 设置在所述基板上的粘合层; 导电层，其具有透射在所述粘合剂层上方提供的可见光的性质; 设置在所述导电层上的绝缘层; 设置在所述绝缘层上的晶体管; 覆盖晶体管的层间绝缘层，发光元件，包括电连接到晶体管的源极或漏极并设置在层间绝缘层上的第一电极，面对第一电极的第二电极和包含有机化合物的层 具有设置在第一和第二电极之间的发光特性; 以及覆盖发光元件的密封层。

公开(公告)号：US08597965B2

公开(公告)日：2013-12-03

申请号：US13467166

申请日：2012-05-09

申请人： Kaoru Hatano ,  Akihiro Chida ,  Akihisa Shimomura ,  Shunpei Yamazaki

发明人： Kaoru Hatano ,  Akihiro Chida ,  Akihisa Shimomura ,  Shunpei Yamazaki

IPC分类号： H01L21/00 ,  H01L33/00

CPC分类号： H01L27/3246 ,  H01L51/0024 ,  H01L51/003 ,  H01L51/525 ,  H01L51/56

摘要： An object is to provide a method for manufacturing a light-emitting device including a flexible substrate, in which separation is performed without separation at the interface between the light-emitting layer and the electrode. A spacer formed of a light absorbing material which absorbs laser light is formed over a partition of one of substrates, a coloring layer is formed over the other substrate, and the substrates are bonded to each other with the use of a bonding layer. The light-emitting layer and the electrode which are formed over the spacer are irradiated with laser light through the coloring layer, so that at least the bonding layer among the light-emitting layer, the electrode, the coloring layer, and the bonding layer is melted to form a fixed portion where the bonding layer and the spacer are bonded by welding.

摘要翻译： 本发明的目的是提供一种制造包括柔性基板的发光装置的方法，其中在发光层和电极之间的界面处进行分离而不分离。 由吸收激光的吸光材料形成的间隔物形成在一个基板的隔板上，在另一个基板上形成着色层，并且通过使用接合层将基板彼此接合。 通过着色层，用激光照射在间隔物上形成的发光层和电极，使得至少发光层，电极，着色层和接合层的结合层为 熔化以形成固定部分，其中粘合层和间隔物通过焊接结合。

公开(公告)号：US08044499B2

公开(公告)日：2011-10-25

申请号：US12465703

申请日：2009-05-14

申请人： Akihiro Chida ,  Tomoyuki Aoki

发明人： Akihiro Chida ,  Tomoyuki Aoki

IPC分类号： H01L23/48 ,  H01L21/00

CPC分类号： H05K3/4647 ,  H01L21/6835 ,  H01L23/3733 ,  H01L27/124 ,  H01L27/1266 ,  H01L29/78603 ,  H01L2221/6835 ,  H01L2224/29499 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/19043 ,  H01L2924/3025 ,  H05K1/0366 ,  H05K3/4069 ,  H05K2201/029 ,  H05K2203/1147 ,  Y10T442/2418 ,  H01L2924/00

摘要： A wiring substrate is provided, including an insulating resin layer which is provided on both surfaces of a sheet-like fibrous body and with which the sheet-like fibrous body is impregnated, and a through wiring provided in a region surrounded by the insulating resin layer. The through wiring is formed using a conductive material, the conductive material is exposed on both surfaces of the insulating resin layer, the sheet-like fibrous body is positioned in the conductive material, and the sheet-like fibrous body is impregnated with the conductive material. A manufacturing method of the wiring substrate is also provided.

摘要翻译： 提供了一种布线基板，包括设置在片状纤维体的两个表面上且被片状纤维体浸渍的绝缘树脂层，以及设置在由绝缘树脂层围绕的区域中的通孔 。 贯通布线使用导电材料形成，导电材料暴露在绝缘树脂层的两个表面上，片状纤维体位于导电材料中，并且片状纤维体浸渍有导电材料 。 还提供了布线基板的制造方法。

公开(公告)号：US07398864B2

公开(公告)日：2008-07-15

申请号：US10572351

申请日：2004-05-24

申请人： Akihiro Chida

发明人： Akihiro Chida

IPC分类号： B66B1/00 ,  B66B1/34

CPC分类号： B66B5/0031

摘要： In an elevator control apparatus, a power supply voltage monitoring circuit monitors a power supply voltage supplied to a processing portion. A voltage monitoring soundness checking function circuit outputs a monitoring input voltage forcible change signal for forcibly changing a power supply voltage input to the power supply voltage monitoring circuit in response to a control signal from the processing portion. A voltage abnormality detection signal from the power supply voltage monitoring circuit is input to the voltage monitoring soundness checking function circuit. The processing portion checks the soundness of the power supply voltage monitoring circuit by reading data held by the voltage monitoring soundness checking function circuit.

摘要翻译： 在电梯控制装置中，电源电压监视电路监视供给到处理部的电源电压。 电压监视声音检查功能电路响应于来自处理部分的控制信号输出监视输入电压强制变化信号，强制变更输入到电源电压监视电路的电源电压。 来自电源电压监视电路的电压异常检测信号被输入到电压监视正确性检查功能电路。 处理部通过读取由电压监视健全性检查功能电路保持的数据来检查电源电压监视电路的健全性。

公开(公告)号：US06405834B1

公开(公告)日：2002-06-18

申请号：US09856249

申请日：2001-05-18

申请人： Akihiro Chida ,  Junichiro Ishikawa ,  Shigeki Yamakawa ,  Hiroshi Ando ,  Kunio Katou

发明人： Akihiro Chida ,  Junichiro Ishikawa ,  Shigeki Yamakawa ,  Hiroshi Ando ,  Kunio Katou

IPC分类号： B66B1108

CPC分类号： B66B11/001 ,  B66B1/46 ,  B66B1/466 ,  B66B1/467 ,  B66B5/0087

摘要： In a maintenance driving control apparatus of an elevator, switches and other components operated at the time of maintenance are separated from a control panel and combined in a driving operation panel. A maintenance operation panel having this driving operation panel and at least one of a brake release device for remote operation, a meter for indicating a voltage of a speed generator, and car position confirmation unit utilizing movement of a rope or some other member is provided in the vicinity of an elevator hall. The maintenance driving control apparatus enables maintenance operations without directly operating the control panel or a hoisting machine.

摘要翻译： 在电梯的维修驱动控制装置中，在维护时操作的开关等部件与控制面板分离，并组合在驱动操作面板中。 具有该驱动操作面板的维护操作面板和用于远程操作的制动器释放装置中的至少一个，用于指示速度发生器的电压的仪表以及利用绳索或其它构件的移动的轿厢位置确认单元 电梯大厅附近。 维护驱动控制装置能够在不直接操作控制面板或起重机的情况下进行维护操作。

公开(公告)号：US08563397B2

公开(公告)日：2013-10-22

申请号：US12498462

申请日：2009-07-07

申请人： Akihiro Chida

发明人： Akihiro Chida

IPC分类号： H01L21/30

CPC分类号： H01L25/50 ,  H01L21/6835 ,  H01L23/295 ,  H01L23/66 ,  H01L24/11 ,  H01L24/13 ,  H01L24/29 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/0657 ,  H01L2221/6835 ,  H01L2221/68381 ,  H01L2223/6677 ,  H01L2224/02205 ,  H01L2224/0221 ,  H01L2224/02215 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/111 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/11438 ,  H01L2224/11848 ,  H01L2224/13022 ,  H01L2224/1329 ,  H01L2224/13339 ,  H01L2224/13344 ,  H01L2224/13347 ,  H01L2224/13355 ,  H01L2224/13364 ,  H01L2224/13366 ,  H01L2224/13369 ,  H01L2224/1338 ,  H01L2224/13381 ,  H01L2224/16146 ,  H01L2224/81005 ,  H01L2224/81101 ,  H01L2224/81191 ,  H01L2224/81903 ,  H01L2224/83005 ,  H01L2224/83101 ,  H01L2224/83862 ,  H01L2224/9211 ,  H01L2225/06513 ,  H01L2225/06548 ,  H01L2225/06572 ,  H01L2924/12036 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H05K1/0366 ,  H05K1/095 ,  H05K3/002 ,  H05K3/4069 ,  H05K3/4644 ,  H05K2201/029 ,  H05K2203/1163 ,  H01L2224/03436 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/035 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00

摘要： The present invention relates to a semiconductor device and its manufacturing method including the steps of: forming a first semiconductor element layer having a first wiring over a substrate; forming a second semiconductor element layer having a second wiring and fixed to a first structure body having a first sheet-like fiber body, a first organic resin, and a first electrode; preparing a second structure body having a second sheet-like fiber body, a second organic resin which is not cured, and a second electrode; disposing the second structure body between the first and second semiconductor element layers so that the first wiring, the second electrode, and the second wiring are overlapped with each other over the substrate; and curing the second organic resin.

摘要翻译： 半导体器件及其制造方法技术领域本发明涉及半导体器件及其制造方法，包括以下步骤：在衬底上形成具有第一布线的第一半导体元件层; 形成具有第二布线并固定到具有第一片状纤维体，第一有机树脂和第一电极的第一结构体的第二半导体元件层; 制备具有第二片状纤维体的第二结构体，未固化的第二有机树脂和第二电极; 将第二结构体设置在第一和第二半导体元件层之间，使得第一布线，第二电极和第二布线在基板上彼此重叠; 并固化第二有机树脂。

公开(公告)号：US08409973B2

公开(公告)日：2013-04-02

申请号：US13168059

申请日：2011-06-24

申请人： Akihiro Chida ,  Kaoru Hatano

发明人： Akihiro Chida ,  Kaoru Hatano

IPC分类号： H01L21/304

CPC分类号： H01L27/1266 ,  H01L21/67092 ,  H01L21/6838 ,  H01L21/68735 ,  H01L27/1214 ,  Y10T156/1906

摘要： Objects are to reduce the number of steps in a process for separating a substrate and a semiconductor element, to provide a separation apparatus capable of reducing the number of steps, to suppress manufacturing cost by reducing the number of steps in a separation process, and to improve productivity in manufacturing semiconductor elements. A separation apparatus including a frame body, a porous body having a chamfered, rounded corner portion, a suction unit configured to create suction in the porous body and the frame body, and a jig which includes a unit adopted to press down part of an object to be separated and a unit adopted to lift another part of the object to be separated, and also a separation method and a method for manufacturing a semiconductor element by using the separation apparatus, are provided.

摘要翻译： 目的是减少用于分离衬底和半导体元件的工艺中的步骤数量，以提供能够减少步骤数量的分离装置，通过减少分离工艺中的步骤数来抑制制造成本，以及 提高制造半导体元件的生产率。 一种分离装置，包括框体，具有倒角的圆角部分的多孔体，构造成在多孔体和框体中产生吸力的吸引单元，以及包括用于将物体的一部分压下的单元的夹具 以及用于提升要分离的物体的另一部分的单元，还提供了使用分离装置制造半导体元件的分离方法和方法。

公开(公告)号：US20130048995A1

公开(公告)日：2013-02-28

申请号：US13592722

申请日：2012-08-23

申请人： Shunpei Yamazaki ,  Kaoru Hatano ,  Satoshi Seo ,  Akihiro Chida

发明人： Shunpei Yamazaki ,  Kaoru Hatano ,  Satoshi Seo ,  Akihiro Chida

IPC分类号： H01L33/08

CPC分类号： H01L51/5259 ,  H01L2251/5369

摘要： A highly reliable light-emitting module including an organic EL element or a light-emitting device using a highly reliable light-emitting module including an organic EL element is provided. Alternatively, a method of manufacturing a highly reliable light-emitting module including an organic EL element, or a method of manufacturing a light-emitting device using a highly reliable light-emitting module including an organic EL element is provided. The light-emitting module has a structure in which a light-emitting element formed over a first substrate and a viscous material layer are sealed in a space between the first substrate and a second substrate which face each other, with a sealing material surrounding the light-emitting element. The viscous material layer is provided between the light-emitting element and the second substrate and includes a non-solid material and a drying agent which reacts with or adsorbs an impurity.

摘要翻译： 提供了一种包括有机EL元件或使用包括有机EL元件的高可靠性发光模块的发光装置的高度可靠的发光模块。 或者，提供一种制造包括有机EL元件的高可靠性发光模块的方法，或者使用包括有机EL元件的高可靠性发光模块的发光装置的制造方法。 发光模块具有这样的结构，其中形成在第一基板和粘性材料层上的发光元件被密封在第一基板和彼此面对的第二基板之间的空间中，围绕光的密封材料 -emitting元素。 粘性材料层设置在发光元件和第二基板之间，并且包括非固体材料和与杂质反应或吸附杂质的干燥剂。