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公开(公告)号：US20210005376A1
公开(公告)日：2021-01-07
申请号：US17030968
申请日：2020-09-24
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jin Hyuk JANG
IPC: H01F27/255 , H01F19/00 , H01F41/04 , H01F27/28 , H01F27/02 , H01F17/04 , H01F17/00 , H01F27/29 , H01F27/32 , H01F5/00
Abstract: A coil component may include a body having a support member including a through hole, a coil disposed on at least one of an upper surface and a lower surface of the support member, and a magnetic material encapsulating the coil and the support member, and filling the through hole. The coil includes a coil pattern. The coil component further includes an external electrode connected to the coil. At least one of the upper surface and the lower surface of the support member includes a groove, having a shape corresponding to a shape of the coil pattern, and at least a portion of the coil pattern is embedded in the groove.
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公开(公告)号：US20180374626A1
公开(公告)日：2018-12-27
申请号：US15822553
申请日：2017-11-27
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jin Hyuk JANG
IPC: H01F27/255 , H01F19/00 , H01F27/02 , H01F27/28 , H01F41/04
CPC classification number: H01F27/255 , H01F17/0013 , H01F17/04 , H01F19/00 , H01F27/022 , H01F27/2871 , H01F27/292 , H01F27/323 , H01F41/04 , H01F41/041 , H01F2017/048
Abstract: A coil component may include a body having a support member including a through hole, a coil disposed on at least one of an upper surface and a lower surface of the support member, and a magnetic material encapsulating the coil and the support member, and filling the through hole. The coil includes a coil pattern. The coil component further includes an external electrode connected to the coil. At least one of the upper surface and the lower surface of the support member includes a groove, having a shape corresponding to a shape of the coil pattern, and at least a portion of the coil pattern is embedded in the groove.
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公开(公告)号：US20160095203A1
公开(公告)日：2016-03-31
申请号：US14870572
申请日：2015-09-30
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Tae Hong MIN , Myung Sam KANG , Young Gwan KO , Min Jae SEONG , Jin Hyuk JANG
CPC classification number: H05K1/0207 , H01L23/3677 , H01L23/373 , H01L23/3737 , H01L23/467 , H01L23/49827 , H01L2224/04105 , H01L2224/12105 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/16265 , H01L2224/20 , H01L2224/2518 , H01L2924/15311 , H05K1/0204 , H05K1/0206 , H05K3/4608 , H05K2201/0323 , H05K2201/10416
Abstract: Disclosed herein is a circuit board including a heat transfer structure formed of a highly thermal conductive material, wherein a part of the heat transfer structure excluding an air cooling unit exposed to outside of an insulation unit is inserted into an insulation unit, and the air cooling unit has a shape having a high non-surface area such as a wrinkled or uneven shape.
Abstract translation: 这里公开了一种电路板，其包括由高导热材料形成的传热结构，其中除暴露于绝缘单元之外的空气冷却单元的传热结构的一部分插入绝缘单元中，并且空气冷却 单元具有具有高的非表面积的形状，例如起皱或不均匀的形状。
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Patent Agency Ranking
公开(公告)号：US20230343510A1
公开(公告)日：2023-10-26
申请号：US18071157
申请日：2022-11-29
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jin Hyuk JANG
CPC classification number: H01F27/32 , H01F27/29 , H01F2027/065
Abstract: A coil component includes a body having one surface and the other surface facing each other, and a plurality of side surfaces connecting the one surface and the other surface to each other, a substrate disposed in the body, a coil portion including first and second coil patterns disposed on one surface of the substrate and each having at least one turn, and third and fourth coil patterns disposed on the other surface of the substrate and each having at least one turn, and first and second external electrodes disposed to be spaced apart from each other on the one surface of the body, respectively connected to the second and fourth coil patterns, and respectively spaced apart from the side surfaces of the body. Winding axes of the first to fourth coil patterns are parallel to the one surface of the body.
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公开(公告)号：US20180350505A1
公开(公告)日：2018-12-06
申请号：US15818490
申请日：2017-11-20
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Joung Gul RYU , Byeong Cheol MOON , Boum Seock KIM , Kang Wook BONG , Jin Hyuk JANG
Abstract: A coil component and a method of manufacturing the same are disclosed. The coil component includes: a support member, and a coil pattern disposed on at least one surface of the support member. The coil pattern includes a first coil layer and a second coil layer disposed on the first coil layer. The second coil layer includes a lower region having the same width as that of the first coil layer and an upper region having a width greater than that of the first coil layer.
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公开(公告)号：US20160095201A1
公开(公告)日：2016-03-31
申请号：US14849880
申请日：2015-09-10
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Tae Hong MIN , Myung Sam KANG , Jin Hyuk JANG , Young Gwan KO
CPC classification number: H05K1/0204 , H01L21/4882 , H01L23/3677 , H01L23/373 , H01L23/49827 , H01L23/5389 , H01L2224/16235 , H01L2224/16265 , H01L2924/15311 , H05K1/0206 , H05K1/0207 , H05K2201/0323
Abstract: A circuit board comprises a first heat transfer structure including graphite or graphene, wherein at least a portion of the first heat transfer structure is disposed inside an insulating member and a primer layer is disposed on a surface of the first heat transfer structure. The first heat transfer structure may comprise a plurality of monomers, the monomers including a primer layer disposed on at least one surface of at least one layer of graphite or graphene.
Abstract translation: 电路板包括包括石墨或石墨烯的第一传热结构，其中第一传热结构的至少一部分设置在绝缘构件的内部，底漆层设置在第一传热结构的表面上。 第一传热结构可以包括多个单体，所述单体包括设置在至少一层石墨或石墨烯的至少一个表面上的底漆层。
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公开(公告)号：US20190006100A1
公开(公告)日：2019-01-03
申请号：US15828091
申请日：2017-11-30
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Kang Wook BONG , Byeong Cheol MOON , Boum Seock KIM , Jin Hyuk JANG , Joung Gul RYU
IPC: H01F41/04 , H01F17/00 , H01F27/29 , H01F27/28 , H01F27/255
Abstract: A coil component includes a magnetic body and an external electrode disposed on an external surface of the magnetic body. The magnetic body includes a support member including a through hole, filled with a magnetic material, and a via hole, a coil disposed on at least one surface of the support member, and a magnetic material encapsulating the coil and the support member. A first conductive layer is disposed on a side surface of the via hole formed in the support member and the at least one surface of the support member. The via hole is filled with a portion of the second conductive layer disposed on the first conductive layer.
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公开(公告)号：US20180374627A1
公开(公告)日：2018-12-27
申请号：US15818468
申请日：2017-11-20
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Joung Gul RYU , Byeong Cheol MOON , Jin Hyuk JANG
IPC: H01F27/28 , H01F27/29 , H01F27/255
Abstract: A thin film-type inductor includes a body including a support member having a through-hole filled with a magnetic material and a via hole, a coil disposed on at least one side of the support member and including a plurality of coil patterns, and a magnetic material sealing the support member and the coil. Each of the coil patterns includes a first conductor layer, a second conductor layer, and a third conductor layer. The second conductor layer is disposed on a side surface of the via hole, and is disposed to seal a lower surface of the via hole.
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