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    PRINTED CIRCUIT BOARD
    2.
    发明申请
    PRINTED CIRCUIT BOARD 审中-公开
    印刷电路板

    公开(公告)号：US20150136446A1

    公开(公告)日：2015-05-21

    申请号：US14213282

    申请日：2014-03-14

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Joung Gul RYU ,  Sung Taek LIM ,  Mi Sun HWANG

    IPC: H05K1/02 ,  H05K1/03 ,  H05K1/18 ,  H05K1/09 ,  H05K1/11

    CPC classification number: H05K1/0271 ,  H05K1/0366 ,  H05K3/445 ,  H05K3/4688

    Abstract: Embodiments of the invention provide a printed circuit board having a structure in which a plurality of insulating layers having a metal wiring formed on one surface thereof are stacked, wherein a metal layer is interposed in the insulating layers, in order to improve warpage property of the board.

    Abstract translation: 本发明的实施例提供了一种印刷电路板，其结构是在其一个表面上堆叠形成有金属布线的多个绝缘层，其中在绝缘层中插入有金属层，以提高绝缘层的翘曲性能 板。

    COIL COMPONENT
    3.
    发明申请
    COIL COMPONENT 有权

    公开(公告)号：US20210050140A1

    公开(公告)日：2021-02-18

    申请号：US16668611

    申请日：2019-10-30

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Joung Gul RYU ,  Ju Hwan YANG

    IPC: H01F27/28 ,  H01F27/29

    Abstract: A coil component includes a body; a support substrate embedded in the body; and a coil portion disposed on the support substrate and embedded in the body, and including a lead-out pattern disposed on one surface of the support substrate, and an auxiliary lead-out pattern disposed on the other surface of the support substrate and corresponding to the lead-out pattern. The auxiliary lead-out pattern includes an external surface exposed from a surface of the body and an internal surface opposing the external surface, and the body includes an anchor portion disposed inside the auxiliary lead-out pattern.

    COIL COMPONENT
    4.
    发明申请
    COIL COMPONENT 审中-公开

    公开(公告)号：US20190333687A1

    公开(公告)日：2019-10-31

    申请号：US16161869

    申请日：2018-10-16

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Ju Hwan YANG ,  Byeong Cheol MOON ,  Joung Gul RYU

    IPC: H01F27/29 ,  H01F17/00 ,  H01F41/04

    Abstract: A coil component is disclosed. The coil component includes a body having one surface and the other surface opposing each other, and a plurality of wall surfaces connecting one surface and the other surface to each other; a coil part embedded in the body and having both ends exposed to both end surfaces of the plurality of wall surfaces of the body, opposing each other; an insulating layer covering one surface of the body; and first and second external electrodes disposed on both end surfaces of the body, respectively, to extend onto the insulating layer, and including a bonded conductive layer disposed on the insulating layer, and an external conductive layer disposed on the bonded conductive layer, respectively.

    COIL COMPONENT
    6.
    发明申请
    COIL COMPONENT 有权

    公开(公告)号：US20210057146A1

    公开(公告)日：2021-02-25

    申请号：US16696052

    申请日：2019-11-26

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Ju Hwan YANG ,  Seo Eun KIM ,  Byung Soo KANG ,  Byeong Cheol MOON ,  Joung Gul RYU

    IPC: H01F27/29 ,  H01F27/32

    Abstract: A coil component includes a support substrate and a coil portion disposed on the support substrate, a body, in which the support substrate and the coil portion are embedded, having one surface and the other surface, one side surface and the other side surface, and one end surface and the other end surface, a first lead-out portion and a second lead-out portion, respectively extending from the coil portion to be exposed from the one side surface and the other side surface, an insulating layer disposed on each of the one surface and the other surface, and an oxide insulating layer disposed on each of the one side surface and the other side surface and each of the one end surface and the other end surface. The insulating layer is provided with a plurality of slits spaced apart from each other to expose a surface of the body.

    HEAT DISSIPATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
    8.
    发明申请
    HEAT DISSIPATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME 有权
    散热基板及其制造方法

    公开(公告)号：US20140165346A1

    公开(公告)日：2014-06-19

    申请号：US14185546

    申请日：2014-02-20

    Applicant: Samsung Electro-Mechanics Co., Ltd.

    Inventor： Sang Youp LEE ,  Joung Gul RYU ,  Dong Sun KIM ,  Jae Hoon CHOI ,  In Ho SEO

    IPC: H05K3/40

    CPC classification number: H05K3/4007 ,  C25D5/02 ,  C25D5/12 ,  C25D5/48 ,  H01L2924/0002 ,  H05K3/4069 ,  H05K3/4608 ,  H05K3/4647 ,  H05K3/4652 ,  H05K2201/0338 ,  H05K2203/0361 ,  Y10T29/302 ,  Y10T29/417 ,  H01L2924/00

    Abstract: Embodiments of the invention provide a heat dissipating substrate, including: a heat dissipating circuit layer formed of an electrolytic invar layer including an invar layer and electrolytic copper plating layers formed on both sides of the invar layer; insulation layers formed on both sides of the heat dissipating circuit layer such that the heat dissipating circuit layer is interposed between the insulation layers; first and second circuit layers formed on the insulation layers; and a first bump connecting the heat dissipating circuit layer with the first circuit layer and a second bump connecting the heat dissipating circuit layer with the second circuit layer. The heat dissipating substrate exhibits excellent heat dissipation efficiency and can be made thin.

    Abstract translation: 本发明的实施例提供一种散热基板，包括：散热电路层，其由包含凹凸层的电解凹槽层和形成在所述凹凸层两侧的电解铜镀层形成; 绝热层，形成在散热电路层的两侧，使得散热电路层插入在绝缘层之间; 形成在绝缘层上的第一和第二电路层; 以及将散热电路层与第一电路层连接的第一凸块和将散热电路层与第二电路层连接的第二凸块。 散热基板表现出优异的散热效率并且可以变薄。

    COIL COMPONENT
    9.
    发明申请
    COIL COMPONENT 有权

    公开(公告)号：US20210375530A1

    公开(公告)日：2021-12-02

    申请号：US17399752

    申请日：2021-08-11

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Byung Soo KANG ,  Byeong Cheol MOON ,  Joung Gul RYU ,  Ju Hwan YANG

    IPC: H01F27/29 ,  H01F27/32 ,  H01F27/28 ,  H01F41/04 ,  H01F27/34

    Abstract: A coil component includes a body having a first surface and a second surface opposing each other in a thickness direction of the body and including a core formed in the thickness direction; a coil part embedded in the body and including at least one turn around the core; an insulating layer disposed on the first surface of the body; a bonded conductive layer disposed on the insulating layer and having a surface roughness of the first surface which is in contact with the insulating layer greater than a surface roughness of the second surface opposing the first surface of the bonded conductive layer; and external electrodes connected to the coil part and covering the bonded conductive layer.

    COIL COMPONENT
    10.
    发明申请
    COIL COMPONENT 审中-公开

    公开(公告)号：US20200335256A1

    公开(公告)日：2020-10-22

    申请号：US16530417

    申请日：2019-08-02

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Ji Hyung JUNG ,  Byeong Cheol MOON ,  Jae Hun KIM ,  Joung Gul RYU

    IPC: H01F27/28 ,  H01F27/29 ,  H01F27/32 ,  H01F41/04 ,  H01F41/12

    Abstract: A coil component includes a body having one surface and the other surface facing each other, and having one end surface and the other end surface facing each other in one direction; a supporting substrate embedded in the body; a coil portion disposed on the supporting substrate; a first lead-out portion connected to one end of the coil portion and exposed from the body; and a second lead-out portion connected to the other end of the coil portion and exposed from the body. The coil portion has a first pattern region facing the one surface and a second pattern region facing the other surface, each of the first and second pattern regions extends in the one direction, and a distance of the first pattern region in the one direction is shorter than a distance of the second pattern region in the one direction.

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