公开(公告)号：US20180063961A1

公开(公告)日：2018-03-01

申请号：US15488081

申请日：2017-04-14

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Se Jong KIM ,  Won Gi KIM ,  Thomas A KIM ,  Jeong Hae KIM

IPC: H05K1/18 ,  H01L23/367 ,  H03F3/21 ,  H01L23/373 ,  H05K3/46 ,  H05K3/00 ,  H05K3/02 ,  H03F1/30 ,  H05K1/02

Abstract: A printed circuit board includes a board portion and an electronic element. The board portion includes a first substrate having an element accommodating portion and second substrates laminated on outer surfaces of the first substrate. The electronic element is disposed in the element accommodating part. The electronic element includes a heat generating element and a heat radiating member coupled to an inactive surface of the heat generating element.

公开(公告)号：US20180286822A1

公开(公告)日：2018-10-04

申请号：US15789021

申请日：2017-10-20

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hong In KIM ,  Thomas A KIM ,  Tae Sung JEONG

IPC: H01L23/66 ,  H01L23/13 ,  H01L23/538 ,  H01L23/31 ,  H01Q1/22

CPC classification number: H01L23/66 ,  H01L21/486 ,  H01L21/565 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/3677 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5389 ,  H01L2223/6677 ,  H01L2223/6683 ,  H01Q1/2283 ,  H01Q9/27

Abstract: Disclosed are substrates having an electronic component, including a frame having a through hole, the electronic component disposed in the through hole, a first wiring portion formed on a surface of the frame and the electronic component, a first layer formed on the first wiring portion, and a second wiring portion formed on the first layer, and the second wiring portion including an antenna layer.

公开(公告)号：US20180212307A1

公开(公告)日：2018-07-26

申请号：US15817329

申请日：2017-11-20

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Hong In KIM ,  Thomas A KIM ,  Ho Kyung KANG

IPC: H01Q1/22 ,  H01Q21/06 ,  H01Q1/48 ,  H01L23/66

CPC classification number: H01Q1/2283 ,  H01L23/66 ,  H01L2223/6677 ,  H01Q1/48 ,  H01Q21/065 ,  H05K1/0228 ,  H05K1/165 ,  H05K2201/10098

Abstract: An antenna-integrated radio frequency (RF) module includes a multilayer substrate disposed between an integrated chip (IC) and patch antennas, signal vias, and ground members. The IC is configured to generate RF signals. The signal vias are configured to connect and transmit/receive the RF signals from each of the patch antennas to the IC. The ground members are disposed on an outer surface layer and intermediate surface layers of the multilayer substrate to surround each of the patch antennas and the signal vias.

公开(公告)号：US20190267338A1

公开(公告)日：2019-08-29

申请号：US16408814

申请日：2019-05-10

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hong In KIM ,  Thomas A KIM ,  Tae Sung JEONG

IPC: H01L23/66 ,  H01Q9/27 ,  H01L23/538 ,  H01L23/13 ,  H01Q1/22

Abstract: Disclosed are substrates having an electronic component, including a frame having a through hole, the electronic component disposed in the through hole, a first wiring portion formed on a surface of the frame and the electronic component, a first layer formed on the first wiring portion, and a second wiring portion formed on the first layer, and the second wiring portion including an antenna layer.

公开(公告)号：US20170265339A1

公开(公告)日：2017-09-14

申请号：US15286614

申请日：2016-10-06

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Thomas A KIM ,  Chang Moo JUNG ,  Kyung In KANG

IPC: H05K9/00 ,  H05K5/04

CPC classification number: H01L23/552 ,  G01R1/04 ,  H01L23/49805 ,  H01L23/49838 ,  H01L2924/15311 ,  H01L2924/3025

Abstract: A shielded electronic device module includes a substrate that includes a first conductive member and a second conductive member separated from each other, a metal housing covering a mounting space on the substrate and connected to the first conductive member and the second conductive member, and a first terminal and a second terminal disposed on a surface of the substrate and connected to the first conductive member and the second conductive member.