公开(公告)号：US20170194089A1

公开(公告)日：2017-07-06

申请号：US15270484

申请日：2016-09-20

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Su Bong JANG ,  Won Gi KIM ,  Han KIM ,  Sang Jong LEE

IPC: H01F27/29 ,  H01F27/28

Abstract: A coil component includes: a coil including connection pads; a first bonding wire connected to a first connection pad among the connection pads; and a second bonding wire connected to a second connection pad among the connection pads.

公开(公告)号：US20190306993A1

公开(公告)日：2019-10-03

申请号：US16180104

申请日：2018-11-05

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Won Gi KIM

IPC: H05K3/46 ,  H05K1/09 ,  H05K1/02 ,  H05K1/03 ,  B32B15/20 ,  B32B9/00 ,  B32B9/04 ,  H01L23/367 ,  H01L23/538

Abstract: An electronic device and rigid-flexible substrate module includes a rigid-flexible substrate having a first region and a second region more flexible than the first region and having a first laterally extended region extending in a first lateral direction further than the first region, an integrated circuit (IC) disposed in a position lower than a position of the first region of the rigid-flexible substrate, a signal line electrically connected to the IC and extending to a lateral end of the second region of the rigid-flexible substrate, and a first heat dissipation ground layer including a first portion that overlaps the first region when viewed in a vertical direction, and a second portion different from the portion that overlaps the first laterally extended region when viewed in a vertical direction.

公开(公告)号：US20180211944A1

公开(公告)日：2018-07-26

申请号：US15928745

申请日：2018-03-22

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Won Gi KIM

IPC: H01L25/10 ,  H01L23/367 ,  H01L23/66 ,  H01L23/31 ,  H01L23/538 ,  H01L23/00

CPC classification number: H01L25/105 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/3677 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5389 ,  H01L23/66 ,  H01L24/20 ,  H01L2224/214 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/1094

Abstract: A fan-out semiconductor package includes a first connection member having a through-hole, a semiconductor chip with connection pads on its active surface disposed in the through-hole and a first encapsulant encapsulating at least portions of the first connection member and the semiconductor chip. A second connection member is disposed below the first connection member and the semiconductor chip. A first heat dissipation member is formed in the first connection member. A component package is disposed on the fan-out semiconductor package and includes a wiring substrate connected to the first connection member through connection terminals, electronic components disposed on the wiring substrate, a second encapsulant encapsulating at least portions of the electronic components, and a second heat dissipation member formed in the wiring substrate. At least one of the electronic components is connected to the first heat dissipation member through the second heat dissipation member.

公开(公告)号：US20170141744A1

公开(公告)日：2017-05-18

申请号：US15349110

申请日：2016-11-11

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Won Gi KIM ,  Sun Hong KIM

IPC: H03F3/195 ,  H05K1/11 ,  H05K1/18 ,  H05K1/02 ,  H03F3/24 ,  H05K5/02

CPC classification number: H03F3/195 ,  H01L23/13 ,  H01L23/3677 ,  H01L23/49822 ,  H01L23/49827 ,  H01L25/0655 ,  H01L2224/73257 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H03F3/211 ,  H03F3/245 ,  H03F3/72 ,  H03F2200/111 ,  H03F2200/447 ,  H03F2200/451 ,  H03F2203/7209 ,  H04B1/40 ,  H05K1/0206 ,  H05K1/021 ,  H05K1/0243 ,  H05K1/115 ,  H05K1/181 ,  H05K2201/10166 ,  H05K2201/10416 ,  H05K2203/049 ,  Y02P70/611

Abstract: A front end module, includes a circuit board; a plurality of electronic components positioned on the circuit board, the electronic components comprising an amplifier configured to amplify a wireless frequency signal, a duplexer and filter configured to filter the wireless frequency signal amplified by the amplifier, and a switch selectively connecting the duplexer and filter with the amplifier; and a heat sink embedded within the circuit board under the amplifier and connected to the amplifier.

公开(公告)号：US20210257318A1

公开(公告)日：2021-08-19

申请号：US15930734

申请日：2020-05-13

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Myeong Woo HAN ,  Young Sik HUR ,  Won Gi KIM ,  Soo Ki CHOI

IPC: H01L23/66 ,  H01L23/498 ,  H01Q1/38 ,  H01Q21/00 ,  H01Q21/06 ,  H01Q1/22 ,  H01L23/00 ,  H01Q9/04

Abstract: A radio frequency module includes a radio frequency integrated circuit (RFIC) to input or output a base signal and a radio frequency (RF) signal having a higher frequency than the base signal, a wiring via extending upward from the RFIC and a feed line electrically connected to the wiring via to provide a transmission path of the RF signal, a second ground layer surrounding the feed line, a first ground layer spaced above the second ground layer, a third ground layer between the second ground layer and the RFIC, a feed-line insulating layer disposed between the first and third ground layers, an IC wiring layer between the third ground layer and the RFIC, electrically connected to the RFIC, and providing a transmission path of the base signal, and an IC insulating layer between the third ground layer and the RFIC, having a higher dielectric constant than the feed-line insulating layer.

公开(公告)号：US20180226366A1

公开(公告)日：2018-08-09

申请号：US15715237

申请日：2017-09-26

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Se Jong KIM ,  Dong Tack MOON ,  Won Gi KIM

IPC: H01L23/66 ,  H01L23/538 ,  H01L25/10 ,  H01L23/31 ,  H01L25/18 ,  H01L23/367 ,  H03H7/38 ,  H01L25/00 ,  H01L21/56 ,  H01L21/48 ,  H01L23/13 ,  H01L25/065

CPC classification number: H01L23/66 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/56 ,  H01L21/568 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/367 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5389 ,  H01L24/08 ,  H01L24/19 ,  H01L24/20 ,  H01L25/0655 ,  H01L25/105 ,  H01L25/18 ,  H01L25/50 ,  H01L2223/6616 ,  H01L2223/6655 ,  H01L2223/6677 ,  H01L2224/08235 ,  H01L2224/18 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H03H7/38 ,  H01L2924/00012 ,  H01L2924/0001

Abstract: A semiconductor package includes a device embedded portion including a first substrate having a first device embedded therein and a second substrate disposed on the first substrate, a device mounting portion comprising a second device disposed on the device embedded portion, and a sealing portion for sealing the second device, and a second module mounted on a surface of the device embedded portion that is opposite of a surface on which the device mounting portion is disposed.

公开(公告)号：US20210313672A1

公开(公告)日：2021-10-07

申请号：US17354425

申请日：2021-06-22

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Hak Gu KIM ,  Young Sik HUR ,  Yoo Sam NA ,  Won Gi KIM ,  Young Bal KIM ,  Soo Ki CHOI ,  Ho Kyung KANG ,  Young Kyoon IM ,  Seong Jong CHEON

IPC: H01Q1/22 ,  H01Q1/08 ,  H01Q21/28 ,  H04B1/16 ,  H04B1/04

Abstract: A radio-frequency device includes a radio-frequency module. The radio-frequency module includes a first substrate, a second substrate, a radio-frequency integrated circuit (RFIC), a front-end integrated circuit (FEIC), and a flexible substrate. The RFIC has at least a portion surrounded by a first core member and is configured to input or output a base signal and a first radio-frequency (RF) signal having a frequency higher than a frequency of the base signal. The FEIC has at least a portion surrounded by a second core member and is configured to input or output the first RF signal and a second RF signal having a power different from a power of the first RF signal. The flexible substrate is configured to connect the first and second substrates to each other, provide a transmission path for the first RF signal, and being more flexible than the first and second substrates.

公开(公告)号：US20210143525A1

公开(公告)日：2021-05-13

申请号：US16937981

申请日：2020-07-24

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Hak Gu KIM ,  Young Sik HUR ,  Yoo Sam NA ,  Won Gi KIM ,  Young Bal KIM ,  Soo Ki CHOI ,  Ho Kyung KANG ,  Young Kyoon IM ,  Seong Jong CHEON

IPC: H01Q1/22 ,  H01Q1/08 ,  H04B1/04 ,  H04B1/16 ,  H01Q21/28

Abstract: A radio-frequency device includes a radio-frequency module. The radio-frequency module includes a first substrate, a second substrate, a radio-frequency integrated circuit (RFIC), a front-end integrated circuit (FEIC), and a flexible substrate. The RFIC has at least a portion surrounded by a first core member and is configured to input or output a base signal and a first radio-frequency (RF) signal having a frequency higher than a frequency of the base signal. The FEIC has at least a portion surrounded by a second core member and is configured to input or output the first RF signal and a second RF signal having a power different from a power of the first RF signal. The flexible substrate is configured to connect the first and second substrates to each other, provide a transmission path for the first RF signal, and being more flexible than the first and second substrates.

公开(公告)号：US20180063961A1

公开(公告)日：2018-03-01

申请号：US15488081

申请日：2017-04-14

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Se Jong KIM ,  Won Gi KIM ,  Thomas A KIM ,  Jeong Hae KIM

IPC: H05K1/18 ,  H01L23/367 ,  H03F3/21 ,  H01L23/373 ,  H05K3/46 ,  H05K3/00 ,  H05K3/02 ,  H03F1/30 ,  H05K1/02

Abstract: A printed circuit board includes a board portion and an electronic element. The board portion includes a first substrate having an element accommodating portion and second substrates laminated on outer surfaces of the first substrate. The electronic element is disposed in the element accommodating part. The electronic element includes a heat generating element and a heat radiating member coupled to an inactive surface of the heat generating element.

公开(公告)号：US20150116950A1

公开(公告)日：2015-04-30

申请号：US14524940

申请日：2014-10-27

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ji No YOO ,  Han KIM ,  Won Gi KIM ,  Suk Hyeon CHO

IPC: H01F27/28 ,  H05K7/02 ,  H01F41/02 ,  H01F27/29

CPC classification number: H01F27/2804 ,  H01F27/022 ,  H01F27/255 ,  H05K1/116 ,  H05K1/185 ,  H05K3/46 ,  H05K2201/086 ,  H05K2201/1003 ,  H05K2201/10196 ,  Y10T29/49075

Abstract: A coil component may be capable of being easily manufactured and significantly decreasing direct current (DC) resistance of its wiring. The coil component may include a coil assembly including a core substrate and coil patterns formed on the core substrate; and a magnetic material part embedding the coil assembly therein.

Abstract translation: 线圈部件可以容易地制造并且显着降低其布线的直流（DC）电阻。 线圈部件可以包括线圈组件，其包括芯基板和形成在芯基板上的线圈图案; 以及将线圈组件嵌入其中的磁性材料部分。