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    WIRING SUBSTRATE
    1.
    发明申请
    WIRING SUBSTRATE 审中-公开
    接线基板

    公开(公告)号：US20150319847A1

    公开(公告)日：2015-11-05

    申请号：US14689478

    申请日：2015-04-17

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Seong Yeon KIM ,  Hong In KIM

    IPC: H05K1/02 ,  H05K1/11

    CPC classification number: H05K1/0245 ,  H05K1/0216 ,  H05K1/0219 ,  H05K1/0224 ,  H05K1/115 ,  H05K2201/09236

    Abstract: A wiring substrate may include an insulating layer; a differential signal transmission line including a first wiring formed on a first surface of the insulating layer and a second wiring formed on a second surface of the insulating layer, the first wiring and the second wiring transmitting differential signals; and a ground part including a first ground layer and a second ground layer disposed to be spaced apart from the first wiring by the predetermined distance on the first surface of the insulating layer and a third ground layer and a fourth ground layer disposed to be spaced apart from the second wiring by the predetermined distance on the second surface of the insulating layer.

    Abstract translation: 布线基板可以包括绝缘层; 差分信号传输线，包括形成在所述绝缘层的第一表面上的第一布线和形成在所述绝缘层的第二表面上的第二布线，所述第一布线和所述第二布线传输差分信号; 以及接地部，包括第一接地层和第二接地层，所述第一接地层和第二接地层设置成与所述绝缘层的所述第一表面上的所述第一布线间隔预定距离，以及设置成间隔开的第三接地层和第四接地层 从绝缘层的第二表面上的第二布线预定距离。

    WIRELESS POSITION ESTIMATION APPARATUS AND METHOD
    2.
    发明申请
    WIRELESS POSITION ESTIMATION APPARATUS AND METHOD 审中-公开
    无线位置估计装置及方法

    公开(公告)号：US20150319580A1

    公开(公告)日：2015-11-05

    申请号：US14689567

    申请日：2015-04-17

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Seong Yeon KIM ,  Hong In KIM

    IPC: H04W4/02 ,  H04W24/08

    CPC classification number: G01C5/06 ,  G01C21/08 ,  G01C21/16 ,  G01S5/0263 ,  G01S5/14 ,  H04W4/027 ,  H04W24/08

    Abstract: A wireless position estimation apparatus may include a wireless communications unit receiving radio signals including positional information related to a plurality of APs from the plurality of APs including a plurality of antennas, a radio signal processing unit combining radio signals received from the plurality of antennas or selecting one of the radio signals, depending on whether or not channel gains of the respective antennas are changed, for a respective AP, a distance calculating unit measuring received signal strength indication (RSSI) values of the radio signals combined or selected by the radio signal processing unit and calculating distance values to the APs using the measured RSSI values, and a position estimating unit estimating a position of a terminal using the calculated distance values and the positional information.

    Abstract translation: 无线位置估计装置可以包括无线通信单元，其从包括多个天线的多个AP接收包括与多个AP相关的位置信息的无线电信号，无线电信号处理单元，组合从多个天线接收的无线电信号或选择 对于各个AP，取决于各个天线的信道增益是否改变的无线电信号之一，距离计算单元，测量由无线电信号处理组合或选择的无线电信号的接收信号强度指示（RSSI）值 使用测量的RSSI值对AP进行单位和计算距离值，以及位置估计单元，使用所计算的距离值和位置信息来估计终端的位置。

    CHIP ANTENNA MODULE ARRAY AND CHIP ANTENNA MODULE
    5.
    发明申请
    CHIP ANTENNA MODULE ARRAY AND CHIP ANTENNA MODULE 有权

    公开(公告)号：US20210376450A1

    公开(公告)日：2021-12-02

    申请号：US17404411

    申请日：2021-08-17

    Applicant: Samsung Electro-Mechanics Co., Ltd.

    Inventor： Jeong Ki RYOO ,  Ju Hyoung PARK ,  Nam Ki KIM ,  Dae Ki LIM ,  Won Cheol LEE ,  Hong In KIM

    IPC: H01Q1/22 ,  H01Q1/24 ,  H01Q21/06 ,  H01Q9/04

    Abstract: A chip antenna module array includes a connection member and chip antenna modules mounted on the connection member. Each chip antenna module includes: a first patch antenna dielectric layer; a feed via extending through the first patch antenna dielectric layer; and a patch antenna pattern disposed on an upper surface of the first patch antenna dielectric layer and configured to be fed from the feed via. At least one chip antenna module includes: a ground pattern disposed on a lower surface of the first patch antenna dielectric layer; a chip-antenna feed line including a second part disposed on a lower surface of the ground pattern, and electrically connecting a connection member feed line to the feed via; a first feed line dielectric layer disposed on a lower surface of the second part; and a solder layer disposed on a lower surface of the first feed line dielectric layer.

    ANTENNA APPARATUS
    6.
    发明申请
    ANTENNA APPARATUS 审中-公开

    公开(公告)号：US20190273325A1

    公开(公告)日：2019-09-05

    申请号：US16169367

    申请日：2018-10-24

    Applicant: Samsung Electro-Mechanics Co., Ltd.

    Inventor： Jeong Ki RYOO ,  Hong In KIM ,  Myeong Woo HAN ,  Nam Ki KIM ,  Dae Ki LIM ,  Ju Hyoung PARK

    IPC: H01Q21/10 ,  H01Q21/00 ,  H01Q9/16 ,  H01Q5/35 ,  H01Q9/04

    Abstract: An antenna apparatus includes patch antennas arranged in an N×1 array, first feed vias, second feed vias, third feed vias, and fourth feed vias connected to a point offset from a center of each of the patch antennas, in a first direction, second direction, third direction, and fourth direction, respectively a first RF signal of a first phase passes through the first feed vias and the second feed vias, a second RF signal of a second phase passes through the third feed vias and the fourth feed vias, and wherein a line between the point in the first direction and the point in the second direction is oblique to a direction of an array of the patch antennas, and a line between the point in the third direction and the point in the fourth direction is oblique to the direction of the array.

    CHIP ANTENNA MODULE ARRAY AND CHIP ANTENNA MODULE
    8.
    发明申请
    CHIP ANTENNA MODULE ARRAY AND CHIP ANTENNA MODULE 有权

    公开(公告)号：US20210175609A1

    公开(公告)日：2021-06-10

    申请号：US16822776

    申请日：2020-03-18

    Applicant: Samsung Electro-Mechanics Co., Ltd.

    Inventor： Jeong Ki RYOO ,  Ju Hyoung PARK ,  Nam Ki KIM ,  Dae Ki LIM ,  Won Cheol LEE ,  Hong In KIM

    IPC: H01Q1/22 ,  H01Q1/24 ,  H01Q9/04 ,  H01Q21/06

    Abstract: A chip antenna module array includes a connection member and chip antenna modules mounted on the connection member. Each chip antenna module includes: a first patch antenna dielectric layer; a feed via extending through the first patch antenna dielectric layer; and a patch antenna pattern disposed on an upper surface of the first patch antenna dielectric layer and configured to be fed from the feed via. At least one chip antenna module includes: a ground pattern disposed on a lower surface of the first patch antenna dielectric layer; a chip-antenna feed line including a second part disposed on a lower surface of the ground pattern, and electrically connecting a connection member feed line to the feed via; a first feed line dielectric layer disposed on a lower surface of the second part; and a solder layer disposed on a lower surface of the first feed line dielectric layer.

    ANTENNA APPARATUS, ANTENNA MODULE, AND CHIP PATCH ANTENNA OF ANTENNA APPARATUS AND ANTENNA MODULE
    9.
    发明申请
    ANTENNA APPARATUS, ANTENNA MODULE, AND CHIP PATCH ANTENNA OF ANTENNA APPARATUS AND ANTENNA MODULE 审中-公开

    公开(公告)号：US20200303805A1

    公开(公告)日：2020-09-24

    申请号：US16515464

    申请日：2019-07-18

    Applicant: Samsung Electro-Mechanics Co., Ltd.

    Inventor： Jeong Ki RYOO ,  Nam Ki KIM ,  Eun Young JUNG ,  Hong In KIM ,  Ju Hyoung PARK ,  Won Cheol LEE ,  Kyu Bum HAN

    IPC: H01Q1/22 ,  H01Q23/00 ,  H01Q1/38 ,  H01Q9/04

    Abstract: An antenna apparatus includes: a ground plane having a through-hole; a feed line disposed below the ground plane; an insulating layer disposed between the feed line and the ground plane; a feed via electrically connected to the feed line, and passing through the through-hole; and a chip patch antenna electrically connected to the feed via. The chip patch antenna includes: a patch antenna pattern electrically connected to the feed via; an upper coupling pattern disposed above the patch antenna pattern; edge coupling patterns surrounding a portion of the patch antenna pattern; upper edge coupling patterns surrounding a portion of the upper coupling pattern; and a dielectric layer disposed in a first region between the patch antenna pattern and the upper coupling pattern, and in a second region between the edge coupling patterns and the upper edge coupling patterns, and having a dielectric constant higher than that of the insulating layer.

    ANTENNA MODULE AND DUAL-BAND ANTENNA APPARATUS
    10.
    发明申请
    ANTENNA MODULE AND DUAL-BAND ANTENNA APPARATUS 审中-公开

    公开(公告)号：US20190198995A1

    公开(公告)日：2019-06-27

    申请号：US15993821

    申请日：2018-05-31

    Applicant: Samsung Electro-Mechanics Co., Ltd.

    Inventor： Jeong Ki RYOO ,  Sang Hyun KIM ,  Seung Goo JANG ,  Thomas A. KIM ,  Hong In KIM ,  Nam Ki KIM

    IPC: H01Q5/35 ,  H01Q1/38 ,  H01Q1/24 ,  H01Q9/42

    Abstract: An antenna module includes a connection member including at least one wiring layer and at least one insulating layer; an IC disposed on a first surface of the connection member and electrically connected to at least one wiring layer of the connection member; and an antenna package disposed on a second surface of the connection member and including first antenna members and feed vias, wherein the connection member includes a feed line having a first end electrically connected to a corresponding wire of at least one wiring layer of the connection member; a second antenna member electrically connected to a second end of the feed line and configured to transmit or receive a radio frequency (RF) signal; and a ground member spaced apart from the feed line in a direction toward the first surface or the second surface of the connection member.

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