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1.
公开(公告)号:US12057191B1
公开(公告)日:2024-08-06
申请号:US18133247
申请日:2023-04-11
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Ji-Yeon Shin , Daehoon Na , Jonghwa Kim
IPC: G11C7/10 , G11C7/22 , H01L25/065 , H01L25/10 , H01L25/18
CPC classification number: G11C7/22 , H01L25/0652 , H01L25/105 , H01L25/18 , H01L2225/06506 , H01L2225/06562 , H01L2225/06586
Abstract: A memory package includes; a first memory chip including first memory pads, and a buffer chip including first buffer pads respectively connected with the first memory pads and second buffer pads connected with an external device. The buffer chip respectively communicates signals received via the second buffer pads to the first buffer pads in response to a swap enable signal having a disabled state, and the buffer chip swaps signals received via the second buffer pads to generate first swapped signals, and respectively communicates the first swapped signals to the first buffer pads in response to the swap enable signal having an enabled state.
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公开(公告)号:US11315614B2
公开(公告)日:2022-04-26
申请号:US17150307
申请日:2021-01-15
Applicant: Samsung Electronics Co., Ltd.
Inventor: Daehoon Na , Jeongdon Ihm , Jangwoo Lee , Byunghoon Jeong
Abstract: A memory system includes a memory device including a plurality of non-volatile memories and an interface circuit connected to each of the plurality of non-volatile memories, and a memory controller connected to the interface circuit and configured to transmit/receive data according to a first clock, wherein the interface circuit is configured to divide the first clock into a second clock, according to the number of the plurality of non-volatile memories, and transmit/receive data to/from each of the plurality of non-volatile memories, according to the second clock.
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公开(公告)号:US11199975B2
公开(公告)日:2021-12-14
申请号:US16861802
申请日:2020-04-29
Applicant: Samsung Electronics Co., Ltd.
Inventor: Daehoon Na , Jangwoo Lee , Jeongdon Ihm
Abstract: An interface circuit of a memory device including a plurality of memory dies including a plurality of registers corresponding to the plurality of memory dies, respectively, the plurality of registers each configured to store command information related to a data operation command, a demultiplexer circuit configured to provide input command information to a selected register from among the plurality of registers according to at least one of a first address or a first chip selection signal, the input command information being received from outside the interface circuit, and a multiplexer circuit configured to receive output command information from the selected register from among the plurality of registers and output the output command information according to at least one of a second address or a second chip selection signal may be provided.
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公开(公告)号:US12008268B2
公开(公告)日:2024-06-11
申请号:US17867008
申请日:2022-07-18
Applicant: Samsung Electronics Co., Ltd.
Inventor: Daehoon Na , Jeongdon Ihm , Jangwoo Lee , Byunghoon Jeong
CPC classification number: G06F3/0659 , G06F1/06 , G06F3/0611 , G06F3/0656 , G06F3/0679 , G11C16/10 , G11C16/26 , G11C16/32 , G11C16/0483
Abstract: A memory system includes a memory device including a plurality of non-volatile memories and an interface circuit connected to each of the plurality of non-volatile memories, and a memory controller connected to the interface circuit and configured to transmit/receive data according to a first clock, wherein the interface circuit is configured to divide the first clock into a second clock, according to the number of the plurality of non-volatile memories, and transmit/receive data to/from each of the plurality of non-volatile memories, according to the second clock.
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5.
公开(公告)号:US11960728B2
公开(公告)日:2024-04-16
申请号:US17536506
申请日:2021-11-29
Applicant: Samsung Electronics Co., Ltd.
Inventor: Daehoon Na , Jangwoo Lee , Jeongdon Ihm
IPC: G06F3/06
CPC classification number: G06F3/0613 , G06F3/0659 , G06F3/0679
Abstract: An interface circuit of a memory device including a plurality of memory dies including a plurality of registers corresponding to the plurality of memory dies, respectively, the plurality of registers each configured to store command information related to a data operation command, a demultiplexer circuit configured to provide input command information to a selected register from among the plurality of registers according to at least one of a first address or a first chip selection signal, the input command information being received from outside the interface circuit, and a multiplexer circuit configured to receive output command information from the selected register from among the plurality of registers and output the output command information according to at least one of a second address or a second chip selection signal may be provided.
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6.
公开(公告)号:US11651805B2
公开(公告)日:2023-05-16
申请号:US17243870
申请日:2021-04-29
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Ji-Yeon Shin , Daehoon Na , Jonghwa Kim
IPC: G11C7/00 , G11C7/22 , H01L25/065 , H01L25/10 , H01L25/18
CPC classification number: G11C7/22 , H01L25/0652 , H01L25/105 , H01L25/18 , H01L2225/06506 , H01L2225/06562 , H01L2225/06586
Abstract: A memory package includes; a first memory chip including first memory pads, and a buffer chip including first buffer pads respectively connected with the first memory pads and second buffer pads connected with an external device. The buffer chip respectively communicates signals received via the second buffer pads to the first buffer pads in response to a swap enable signal having a disabled state, and the buffer chip swaps signals received via the second buffer pads to generate first swapped signals, and respectively communicates the first swapped signals to the first buffer pads in response to the swap enable signal having an enabled state.
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公开(公告)号:US11869860B2
公开(公告)日:2024-01-09
申请号:US17479194
申请日:2021-09-20
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Hyunsuk Kang , Daehoon Na , Chiweon Yoon
IPC: G11C7/10 , H01L23/00 , H01L25/065 , H01L25/18 , G11C5/02
CPC classification number: H01L24/08 , H01L25/0657 , H01L25/18 , G11C5/025 , H01L2224/08145 , H01L2225/06506 , H01L2225/06562
Abstract: A storage device includes a controller including first and second pins and configured to output a multi-level chip enable signal through the second pin, and a memory device. The memory device includes third and fourth pins respectively connected to the first and second pins, and a plurality of memory chips commonly connected to the fourth pin. The plurality of memory chips respectively include a plurality of resistors connected to one another in a daisy-chain structure between the third pin and a first voltage terminal. The plurality of memory chips are configured to respectively generate a plurality of reference voltage periods that divide between a voltage level of the third pin and a voltage level of the first voltage terminal based on the plurality of resistors.
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公开(公告)号:US20220236917A1
公开(公告)日:2022-07-28
申请号:US17479194
申请日:2021-09-20
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Hyunsuk Kang , Daehoon Na , Chiweon Yoon
IPC: G06F3/06 , H01L25/065 , H01L25/18 , H01L23/00
Abstract: A storage device includes a controller including first and second pins and configured to output a multi-level chip enable signal through the second pin, and a memory device. The memory device includes third and fourth pins respectively connected to the first and second pins, and a plurality of memory chips commonly connected to the fourth pin. The plurality of memory chips respectively include a plurality of resistors connected to one another in a daisy-chain structure between the third pin and a first voltage terminal. The plurality of memory chips are configured to respectively generate a plurality of reference voltage periods that divide between a voltage level of the third pin and a voltage level of the first voltage terminal based on the plurality of resistors.
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公开(公告)号:US09897650B2
公开(公告)日:2018-02-20
申请号:US14957987
申请日:2015-12-03
Applicant: Samsung Electronics Co., Ltd.
Inventor: Daehoon Na , ChaeHoon Kim , HyunJin Kim , Jangwoo Lee , Jeongdon Ihm
IPC: G01R31/28 , G01R31/3177 , G01R31/317
CPC classification number: G01R31/31716 , G01R31/2884 , G01R31/3177
Abstract: An integrated circuit including first pads and second pads, a first receiver circuit and a first driver circuit respectively connected to the first pad, a second receiver circuit and a second driver circuit respectively connected to the second pad, and a first loopback circuit having a first input terminal electrically connected to the first receiver circuit, a first output terminal electrically connected to the first driver circuit, a second output terminal electrically connected to the second driver circuit, and a second input terminal electrically connected to the second receiver circuit may be provided. At a normal mode, the first loopback circuit electrically connects the first input terminal to the second output terminal and electrically connects the second input terminal to the first output terminal. At a test mode, the first loopback circuit electrically connects the first input terminal to the first output terminal.
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公开(公告)号:US09748956B2
公开(公告)日:2017-08-29
申请号:US14960748
申请日:2015-12-07
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jangwoo Lee , HyunJin Kim , Daehoon Na , Jeongdon Ihm
IPC: H03K17/16 , H03K19/003 , H03K19/0175 , G11C7/04 , G11C7/10 , G11C29/02 , G11C16/04
CPC classification number: H03K19/017545 , G11C7/04 , G11C7/1069 , G11C7/1096 , G11C16/0483 , G11C29/022 , G11C29/028 , G11C2207/105 , G11C2207/108
Abstract: An integrated circuit includes an input/output pad, a driver circuit connected to the input/output pad, and a receiver circuit connected to the input/output pad, and a code generator. The driver circuit is configured to output an output signal to an external device through the input/output pad. The receiver circuit is configured to receive an input signal from the external device through the input/output pad. The code generator is configured to generate a termination code of the external device in response to a signal output from the receiver circuit.
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