Semiconductor memory device having three-dimensional cross point array
    1.
    发明授权
    Semiconductor memory device having three-dimensional cross point array 有权
    具有三维交叉点阵列的半导体存储器件

    公开(公告)号:US09184218B2

    公开(公告)日:2015-11-10

    申请号:US14506005

    申请日:2014-10-03

    Abstract: A semiconductor memory device includes pillars extending upright on a substrate in a direction perpendicular to the substrate, a stack disposed on the substrate and constituted by a first interlayer insulating layer, a first conductive layer, a second interlayer insulating layer, and a second conductive layer, a variable resistance layer interposed between the pillars and the first conductive layer, and an insulating layer interposed between the first pillars and the second conductive layer.

    Abstract translation: 半导体存储器件包括在垂直于衬底的方向上在衬底上直立延伸的柱,设置在衬底上并由第一层间绝缘层,第一导电层,第二层间绝缘层和第二导电层 插入在所述柱和所述第一导电层之间的可变电阻层以及插在所述第一柱和所述第二导电层之间的绝缘层。

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