公开(公告)号：US09748193B2

公开(公告)日：2017-08-29

申请号：US14698444

申请日：2015-04-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Young-ja Kim ,  Jun-young Ko

IPC: H05K3/34 ,  H05K1/11 ,  H01L23/00 ,  H01L23/498

CPC classification number: H01L24/17 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/16 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16013 ,  H01L2224/16058 ,  H01L2224/16105 ,  H01L2224/16113 ,  H01L2224/16237 ,  H01L2224/16238 ,  H01L2224/17051 ,  H01L2224/17104 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81194 ,  H01L2924/13091 ,  H01L2924/15311 ,  H05K1/111 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/09227 ,  H05K2201/0989 ,  H05K2201/09909 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/014

Abstract: A printed circuit board (PCB) includes: a base substrate including a top surface including an electronic device mounting region; chip connection pads that are provided on the electronic device mounting region; a conductive pattern group that is provided on the top surface of the base substrate and includes an extended conductive pattern extending between two adjacent chip connection pads from among the chip connection pads, the extended conductive pattern being spaced apart from each of the two adjacent chip connection pads; and a solder resist layer that covers a part of the extended conductive pattern and is spaced apart from the chip connection pads.

公开(公告)号：US20130223001A1

公开(公告)日：2013-08-29

申请号：US13685076

申请日：2012-11-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hwang-bok Ryu ,  Jun-young Ko ,  Young-ja Kim ,  Dae-young Jeong

IPC: H05K7/06 ,  G06F1/16

CPC classification number: H05K7/06 ,  G06F1/16 ,  G06F1/185 ,  H05K1/114 ,  H05K3/366 ,  H05K3/421 ,  H05K3/4652 ,  H05K2201/0338 ,  H05K2201/09727 ,  H05K2201/09736 ,  H05K2201/10159 ,  H05K2201/10189

Abstract: A printed circuit board (PCB) comprises an internal wiring layer, an insulating layer on the internal wiring layer, a via hole extending through the insulating layer, and an external wiring layer on the insulating layer. The internal wiring layer comprises at least one metal wiring layer. The via hole exposes the internal wiring layer. The external wiring layer is electrically connected to the internal wiring layer. The external wiring layer includes a mounting area on which a semiconductor chip is disposed and a non-mounting area on which a semiconductor chip is not disposed. A thickness of the mounting area is less than a thickness of the non-mounting area.

Abstract translation: 印刷电路板（PCB）包括内部布线层，内部布线层上的绝缘层，延伸穿过绝缘层的通孔以及绝缘层上的外部布线层。 内部布线层包括至少一个金属布线层。 通孔露出内部布线层。 外部布线层电连接到内部布线层。 外部布线层包括其上设置有半导体芯片的安装区域和不设置半导体芯片的非安装区域。 安装面积的厚度小于非安装区域的厚度。