-
公开(公告)号：US20240213059A1
公开(公告)日：2024-06-27
申请号：US18524726
申请日：2023-11-30
Applicant: SEMES CO., LTD.
Inventor： Hee Man AHN , Sung Hun EOM , Gyeong Won SONG , Jae Seung YU
IPC: H01L21/67 , G03F7/00 , H01L21/673
CPC classification number: H01L21/67225 , G03F7/70033 , H01L21/67023 , H01L21/67098 , H01L21/6732
Abstract: Disclosed are a substrate processing apparatus and method in which in a heat-treatment process such as a baking process, a surrounding humidity environment may be precisely controlled based on photoresist for extreme ultraviolet (EUV) applied on the substrate. The substrate processing apparatus includes a housing having a treatment space defined therein; a support unit for supporting, thereon, a substrate received in the treatment space; and a gas supply unit configured to alternately supply a first gas and a second gas into the treatment space in response to photoresist (PR) for extreme ultraviolet (EUV) applied onto the substrate.
-
公开(公告)号：US20240385524A1
公开(公告)日：2024-11-21
申请号：US18664981
申请日：2024-05-15
Applicant: SEMES CO., LTD.
Inventor： Hee Man AHN , Gyeong Won SONG , Jae Seung YU , Sol AN , Sung Hun EOM
Abstract: Disclosed are an apparatus and a method for treating a substrate, and more particularly, an apparatus and a method for heat treating a substrate. The apparatus includes: a heating unit provided in the inner space, and providing a treatment space in which a heating process of the substrate is performed; a transfer plate positioned within the inner space, and movable between an inner position for loading the substrate into the treatment space or for unloading the substrate from the treatment space and an outer position provided outside the heating unit; and a gas injection unit positioned within the inner space, and for injecting atmosphere gas toward the substrate at the outer position.
-
3.发明公开公开(公告)号：US20240231246A9
公开(公告)日：2024-07-11
申请号：US18377300
申请日：2023-10-05
Applicant: SEMES CO., LTD.
Inventor： Minhee CHO , Hee Man AHN , Gyeong Won SONG , Jumi LEE , Chun Woo PARK , Byung Hwi KIM
IPC: G03F7/00
CPC classification number: G03F7/70875
Abstract: A substrate treatment apparatus according to an aspect of the present invention includes: a support plate that supports a substrate and is provided with a heater member for heating the substrate; and a cooling unit for forcedly cooling the support plate, wherein the cooling unit includes: a cooling housing to provide a cooling space; a plurality of gas feed nozzles that is arranged in the cooling housing and supplies cooling gas toward the heater member; and a plurality of gas feed lines that is directly connected to the gas feed nozzles and supplies the cooling gas transferred from the outside to the gas feed nozzles.
-
公开(公告)号：US20230408200A1
公开(公告)日：2023-12-21
申请号：US18143273
申请日：2023-05-04
Applicant: SEMES CO., LTD.
Inventor： Ju Mi LEE , Gyeong Won SONG , Min Hee CHO , Byung Hwi KIM , Chun Woo PARK , Hee Man AHN
CPC classification number: F27D9/00 , G03F7/40 , F27D2009/0078
Abstract: The substrate processing apparatus of the present invention comprises a hot plate for heating a substrate; and a cooling unit for cooling the hot plate; wherein the cooling unit includes a support plate having a space formed between the support plate and the hot plate, and a plurality of nozzles installed on the support plate and for supplying cooling gas to a bottom surface of the hot plate, wherein an outdoor air inlet passage provided in a through structure is provide in the support plate, wherein a portion of the outdoor air inlet passage forms a first region, through which a cable passes, and the remaining portion forms a second region, through which the cable does not pass and outdoor air introduces.
-
Patent Agency Ranking
公开(公告)号：US20250062125A1
公开(公告)日：2025-02-20
申请号：US18792771
申请日：2024-08-02
Applicant: SEMES CO., LTD.
Inventor： Gyeong Won SONG , Hee Man AHN , Sung Hun EOM , Jae Seung YU , Gu Won SEON
IPC: H01L21/033 , H01L21/324 , H01L21/67
Abstract: Disclosed is a substrate processing method including: a substrate loading operation of loading a substrate into a processing space provided by a body; a heating operation of placing the substrate, which has been loaded into the processing space, on a heating chuck and heating the substrate; and an atmosphere changing operation of changing an atmosphere of the processing space, in which the atmosphere changing operation includes: a gas discharging operation of injecting atmosphere changing gas in a state where the substrate is located closer to a baffle than in the heating operation, in which the baffle is provided on a top side of the heating chuck to face the heating chuck and injects the atmosphere changing gas; and a substrate lowering operation of lowering and placing the substrate onto the heating chuck while maintaining the injection of the atmosphere changing gas.
-
公开(公告)号：US20240222165A1
公开(公告)日：2024-07-04
申请号：US18539634
申请日：2023-12-14
Applicant: SEMES CO., LTD.
Inventor： Hee Man AHN , Gyeong Won SONG , Min Hee CHO , Ju Mi LEE , Byung Hwi KIM , Chun Woo PARK
IPC: H01L21/67 , H01L21/677
CPC classification number: H01L21/67225 , H01L21/67017 , H01L21/67051 , H01L21/67098 , H01L21/67742
Abstract: The inventive concept provides a substrate treating apparatus which is cool a support plate having a heater faster than a conventional substrate treating apparatus. The substrate treating apparatus includes a housing providing a treating space therein; and a support unit configured to support a substrate at the treating space. The support unit includes a heater member provided at the support plate to heat the substrate and a cooling unit configured to cool the heater member. The cooling unit includes a first gas supply nozzle positioned under an edge of the heater member for supplying a cooling gas to a center direction of a bottom surface of the heater member and a second gas supply nozzle positioned under a center of the heater member for supplying the cooling gas in an edge direction of the bottom surface of the heater member.
-
7.发明公开公开(公告)号：US20240134292A1
公开(公告)日：2024-04-25
申请号：US18377300
申请日：2023-10-04
Applicant: SEMES CO., LTD.
Inventor： Minhee CHO , Hee Man AHN , Gyeong Won SONG , Jumi LEE , Chun Woo PARK , Byung Hwi KIM
IPC: G03F7/00
CPC classification number: G03F7/70875
Abstract: A substrate treatment apparatus according to an aspect of the present invention includes: a support plate that supports a substrate and is provided with a heater member for heating the substrate; and a cooling unit for forcedly cooling the support plate, wherein the cooling unit includes: a cooling housing to provide a cooling space; a plurality of gas feed nozzles that is arranged in the cooling housing and supplies cooling gas toward the heater member; and a plurality of gas feed lines that is directly connected to the gas feed nozzles and supplies the cooling gas transferred from the outside to the gas feed nozzles.
-
公开(公告)号：US20230063639A1
公开(公告)日：2023-03-02
申请号：US17898459
申请日：2022-08-29
Applicant: SEMES CO., LTD.
Inventor： Gyeong Won SONG , Jae Seong LEE , Chun Woo PARK
IPC: B05D3/02
Abstract: Provided is a heat treatment unit, including: a chamber providing a substrate processing apparatus including: a process chamber in which an upper chamber and a lower chamber are in contact with each other to form a treatment space defined by the upper chamber and the lower chamber; a heating plate positioned in the treatment space to heat a substrate; a lift pin for placing the substrate on the heating plate or for moving the substrate placed on the heating plate to be spaced apart from the heating plate; a driving member connected to the upper chamber or the lower chamber to vertically drive the upper chamber or the lower chamber; an exhaust member connected to a central region of the upper chamber to exhaust the treatment space; and an airflow blocking member provided on an upper surface of the heating plate and formed to surround an edge of the substrate so as to block a surrounding airflow from approaching the edge of the substrate.
-
公开(公告)号：US20220075270A1
公开(公告)日：2022-03-10
申请号：US17469366
申请日：2021-09-08
Applicant: Semes Co., Ltd
Inventor： Jun Ho KIM , Sang Hoon LEE , Jong Seok SEO , Ho Jin JANG , Gyeong Won SONG
Abstract: The inventive concept provides a bake unit. The bake unit comprising: a housing having an upper cover and a lower frame, the upper cover and the lower cover in combination providing a treatment space for heat treatment of a substrate; a heater provided in the treatment space for heating a substrate placed thereon; a heater cup configured to surround the heater; and a first purge gas supply unit for providing a first purge gas flow to block inflow of outer air through a gap between the lower frame and the heater cup.
-
-
-
-
-
-
-
-
Search Results
9
records
(took 0.017 seconds)
