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公开(公告)号：US12107195B2
公开(公告)日：2024-10-01
申请号：US18098030
申请日：2023-01-17
发明人： Chi Hyun In , Jun Yong Park , Kyu Ho Lee , Dae Woong Suh , Jong Hyeon Chae , Chang Hoon Kim , Sung Hyun Lee
CPC分类号： H01L33/486 , H01L33/20 , H01L33/44 , H01L33/505 , H01L33/62 , H01L2224/16 , H01L2933/0033
摘要： A light emitting diode, including a first type semiconductor layer, an active layer, and a second type semiconductor layer; an ohmic contact layer disposed on the second type semiconductor layer; a first insulating layer disposed on the semiconductor structure and including a first opening overlapping the first type semiconductor layer and a second opening overlapping the ohmic contact layer; a first connection wiring disposed on the first insulating layer, the first connection wiring having a first portion and a second portion; and a second connection wiring disposed on the first insulating layer and spaced apart from the first connection wiring, the second connection wiring electrically connected to the second type semiconductor layer through the second opening. The second connection wiring surrounds at least a portion of the first portion of the first connection wiring in a plan view.
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公开(公告)号：US20200350469A1
公开(公告)日：2020-11-05
申请号：US16935030
申请日：2020-07-21
发明人： Chi Hyun In , Jun Yong Park , Kyu Ho Lee , Dae Woong Suh , Jong Hyeon Chae , Chang Hoon Kim , Sung Hyun Lee
IPC分类号： H01L33/48
摘要： Disclosed herein are a light emitting diode package and a method of manufacturing the same. The light emitting diode package includes: a substrate, a light-emitting layer disposed on a surface of the substrate and including a first type semiconductor layer, an active layer, and a second type semiconductor layer, a first bump disposed on the first type semiconductor layer and a second bump disposed the second type semiconductor layer, a protective layer covering at least the light-emitting layer, and a first bump pad and a second bump pad disposed on the protective layer and connected to the first bump and the second bump, respectively.
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公开(公告)号：US20230378406A1
公开(公告)日：2023-11-23
申请号：US18229624
申请日：2023-08-02
发明人： Jong Min JANG , Sung Hyun Lee , Chang Yeon Kim
CPC分类号： H01L33/58 , H01L25/0753 , H01L27/15 , H01L33/38 , H01L33/62 , H01L33/44 , H01L2933/0066 , H01L2933/0016 , H01L2933/0025
摘要： A display apparatus including a circuit board, a plurality of light emitting devices mounted on the circuit board, a transparent substrate disposed on the light emitting devices, and a light absorbing layer disposed between the transparent substrate and the light emitting devices, in which the light absorbing layer covers upper regions of the light emitting devices and a region between the light emitting devices.
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公开(公告)号：US11563152B2
公开(公告)日：2023-01-24
申请号：US16935030
申请日：2020-07-21
发明人： Chi Hyun In , Jun Yong Park , Kyu Ho Lee , Dae Woong Suh , Jong Hyeon Chae , Chang Hoon Kim , Sung Hyun Lee
摘要： Disclosed herein are a light emitting diode package and a method of manufacturing the same. The light emitting diode package includes: a substrate, a light-emitting layer disposed on a surface of the substrate and including a first type semiconductor layer, an active layer, and a second type semiconductor layer, a first bump disposed on the first type semiconductor layer and a second bump disposed the second type semiconductor layer, a protective layer covering at least the light-emitting layer, and a first bump pad and a second bump pad disposed on the protective layer and connected to the first bump and the second bump, respectively.
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公开(公告)号：US09356167B2
公开(公告)日：2016-05-31
申请号：US14584732
申请日：2014-12-29
发明人： Ki Yon Park , Hwa Mok Kim , Kyu Ho Lee , Sung Hyun Lee , Hyung Kyu Kim
IPC分类号： H01L31/0328 , H01L31/0336 , H01L31/072 , H01L31/109 , H01L31/0304 , H01L31/11 , H01L31/108 , H01L31/18
CPC分类号： H01L31/03048 , H01L31/022408 , H01L31/03044 , H01L31/108 , H01L31/11 , H01L31/1848 , H01L31/1852 , H01L31/1856 , Y02E10/544
摘要： An ultraviolet (UV) photo-detecting device, including: a first nitride layer; a secondary light absorption layer disposed on the first nitride layer; a primary light absorption layer disposed on the secondary light absorption layer; and a Schottky junction layer disposed on the primary light absorption layer. The secondary light absorption layer includes a nitride layer having lower band-gap energy than the primary light absorption layer.
摘要翻译： 一种紫外线（UV）光检测装置，包括：第一氮化物层; 设置在所述第一氮化物层上的次级光吸收层; 设置在次光吸收层上的初级光吸收层; 以及设置在初级光吸收层上的肖特基结层。 二次光吸收层包括具有比初级光吸收层低的带隙能量的氮化物层。
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公开(公告)号：US11757073B2
公开(公告)日：2023-09-12
申请号：US17133608
申请日：2020-12-23
发明人： Jong Min Jang , Sung Hyun Lee , Chang Yeon Kim
CPC分类号： H01L33/58 , H01L25/0753 , H01L27/15 , H01L33/38 , H01L33/44 , H01L33/62 , H01L2933/0016 , H01L2933/0025 , H01L2933/0066
摘要： A display apparatus including a circuit board, a plurality of light emitting devices mounted on the circuit board, a transparent substrate disposed on the light emitting devices, and a light absorbing layer disposed between the transparent substrate and the light emitting devices, in which the light absorbing layer covers upper regions of the light emitting devices and a region between the light emitting devices.
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公开(公告)号：US10727376B2
公开(公告)日：2020-07-28
申请号：US16125769
申请日：2018-09-10
发明人： Chi Hyun In , Jun Yong Park , Kyu Ho Lee , Dae Woong Suh , Jong Hyeon Chae , Chang Hoon Kim , Sung Hyun Lee
摘要： Disclosed herein are a light emitting diode package and a method of manufacturing the same. The light emitting diode package includes: a substrate, a light-emitting layer disposed on a surface of the substrate and including a first type semiconductor layer, an active layer, and a second type semiconductor layer, a first bump disposed on the first type semiconductor layer and a second bump disposed the second type semiconductor layer, a protective layer covering at least the light-emitting layer, and a first bump pad and a second bump pad disposed on the protective layer and connected to the first bump and the second bump, respectively.
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公开(公告)号：US11688840B2
公开(公告)日：2023-06-27
申请号：US17133623
申请日：2020-12-23
发明人： Jong Min Jang , Sung Hyun Lee , Chang Yeon Kim
CPC分类号： H01L33/62 , H01L27/156 , H01L33/382 , H01L33/40 , H01L33/486
摘要： A light emitting device including a first light emitting stack, a second light emitting stack disposed under the first light emitting stack, a third light emitting stack disposed under the second light emitting stack, first, second, third, and fourth connection electrodes disposed over the first light emitting stack, and electrically connected to the first, second, and third light emitting stacks, and bonding metal layers disposed on upper surfaces of the first, second, third, and fourth connection electrodes, in which each of the first, second, third, and fourth connection electrodes includes a groove on an upper surface thereof, and the bonding metal layers cover the grooves of the first, second, third, and fourth connection electrodes, respectively.
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公开(公告)号：US20230155072A1
公开(公告)日：2023-05-18
申请号：US18098030
申请日：2023-01-17
发明人： Chi Hyun In , Jun Yong Park , Kyu Ho Lee , Dae Woong Suh , Jong Hyeon Chae , Chang Hoon Kim , Sung Hyun Lee
IPC分类号： H01L33/48
CPC分类号： H01L33/486 , H01L33/20
摘要： A light emitting diode, including a first type semiconductor layer, an active layer, and a second type semiconductor layer; an ohmic contact layer disposed on the second type semiconductor layer; a first insulating layer disposed on the semiconductor structure and including a first opening overlapping the first type semiconductor layer and a second opening overlapping the ohmic contact layer; a first connection wiring disposed on the first insulating layer, the first connection wiring having a first portion and a second portion; and a second connection wiring disposed on the first insulating layer and spaced apart from the first connection wiring, the second connection wiring electrically connected to the second type semiconductor layer through the second opening. The second connection wiring surrounds at least a portion of the first portion of the first connection wiring in a plan view.
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公开(公告)号：US09786805B2
公开(公告)日：2017-10-10
申请号：US15168159
申请日：2016-05-30
发明人： Ki Yon Park , Hwa Mok Kim , Kyu Ho Lee , Sung Hyun Lee , Hyung Kyu Kim
IPC分类号： H01L31/0328 , H01L31/0336 , H01L31/072 , H01L31/109 , H01L31/09 , H01L31/108 , H01L31/0304 , H01L31/18 , H01L31/0224
CPC分类号： H01L31/09 , H01L31/022408 , H01L31/03044 , H01L31/03048 , H01L31/108 , H01L31/1848 , H01L31/1852 , H01L31/1856 , Y02E10/544
摘要： An ultraviolet (UV) photo-detecting device, including: a substrate; a first nitride layer disposed on the substrate; a second nitride layer disposed between the first nitride layer and the substrate; a light absorption layer disposed on the first nitride layer; and a Schottky junction layer disposed on the light absorption layer.
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