公开(公告)号：US08786065B2

公开(公告)日：2014-07-22

申请号：US13667540

申请日：2012-11-02

申请人： Shinko Electric Industries Co., Ltd.

发明人： Yasuyuki Kimura ,  Tadashi Arai ,  Tsuyoshi Kobayashi ,  Toshiyuki Okabe

IPC分类号： H01L23/495 ,  H01L33/64 ,  H01L23/00 ,  H01L25/075

CPC分类号： H01L33/642 ,  H01L24/45 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/01047 ,  H01L2924/07802 ,  H01L2924/12035 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A substrate includes a first lead frame, a second lead frame, and a resin layer. The first lead frame includes a heat sink and a plurality of electrodes for external connection. The second lead frame is laminated on the first lead frame and includes a plurality of wirings for mounting light emitting elements. The resin layer is filled between the first lead frame and the second lead frame. The plurality of wirings are arranged above the heat sink. The plurality of electrodes and part of the plurality of wirings are joined with each other.

摘要翻译： 基板包括第一引线框架，第二引线框架和树脂层。 第一引线框架包括散热器和用于外部连接的多个电极。 第二引线框架层叠在第一引线框架上并且包括用于安装发光元件的多个布线。 树脂层填充在第一引线框架和第二引线框架之间。 多个布线布置在散热器的上方。 多个电极和多个布线中的一部分彼此接合。

公开(公告)号：US08928130B2

公开(公告)日：2015-01-06

申请号：US13848225

申请日：2013-03-21

申请人： Shinko Electric Industries Co., Ltd.

发明人： Toshio Kobayashi ,  Hiroshi Shimizu ,  Toshiyuki Okabe ,  Yasuyuki Kimura ,  Kazutaka Kobayashi

IPC分类号： H01L23/495 ,  H01L23/36 ,  H01L23/498 ,  H01L21/48 ,  H01L23/00 ,  H01L25/065

CPC分类号： H01L23/49586 ,  H01L21/4828 ,  H01L23/36 ,  H01L23/49548 ,  H01L23/49568 ,  H01L23/49861 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0655 ,  H01L33/62 ,  H01L33/644 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13144 ,  H01L2224/16238 ,  H01L2224/16245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48248 ,  H01L2224/4911 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/3025 ,  H01L2933/0066 ,  H01L2924/01079 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/207

摘要： A lead frame includes a plurality of leads defined by an opening extending in a thickness direction. An insulating resin layer fills the opening to entirely cover side surfaces of each lead and to support the leads. A first surface of each lead is exposed from a first surface of the insulating resin layer.

摘要翻译： 引线框架包括由沿厚度方向延伸的开口限定的多个引线。 绝缘树脂层填充开口以完全覆盖每个引线的侧表面并支撑引线。 每个引线的第一表面从绝缘树脂层的第一表面露出。

公开(公告)号：US20130256854A1

公开(公告)日：2013-10-03

申请号：US13848225

申请日：2013-03-21

申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.

发明人： Toshio Kobayashi ,  Hiroshi Shimizu ,  Toshiyuki Okabe ,  Yasuyuki Kimura ,  Kazutaka Kobayashi

IPC分类号： H01L23/495

CPC分类号： H01L23/49586 ,  H01L21/4828 ,  H01L23/36 ,  H01L23/49548 ,  H01L23/49568 ,  H01L23/49861 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0655 ,  H01L33/62 ,  H01L33/644 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13144 ,  H01L2224/16238 ,  H01L2224/16245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48248 ,  H01L2224/4911 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/3025 ,  H01L2933/0066 ,  H01L2924/01079 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/207

摘要： A lead frame includes a plurality of leads defined by an opening extending in a thickness direction. An insulating resin layer fills the opening to entirely cover side surfaces of each lead and to support the leads. A first surface of each lead is exposed from a first surface of the insulating resin layer.

摘要翻译： 引线框架包括由沿厚度方向延伸的开口限定的多个引线。 绝缘树脂层填充开口以完全覆盖每个引线的侧表面并支撑引线。 每个引线的第一表面从绝缘树脂层的第一表面露出。

公开(公告)号：US08890295B2

公开(公告)日：2014-11-18

申请号：US13864402

申请日：2013-04-17

申请人： Shinko Electric Industries Co., Ltd.

发明人： Toshiyuki Okabe ,  Tsuyoshi Kobayashi ,  Toshio Kobayashi ,  Yasuyuki Kimura

IPC分类号： H01L33/38 ,  H01L33/48 ,  H01L33/64 ,  H01L33/62

CPC分类号： H01L33/38 ,  H01L33/486 ,  H01L33/62 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2933/0075 ,  H01L2924/00014 ,  H01L2924/00

摘要： A package for mounting a light emitting element includes a housing and a flat plate-shaped electrode. The electrode is exposed from a lower surface of the housing. An upper surface of the electrode includes a mounting area on which the light emitting element is mounted. An insulator is arranged on the upper surface of the electrode. An element connector is connected to the insulator. A tubular reflective portion extends from the element connector to a height corresponding to the upper surface of the housing. A terminal is arranged on the side surface of the housing and connected to the reflective portion. A recess accommodates the light emitting element. The recess is formed in an upper portion of the housing, and the recess is formed by the upper surface of the electrode, the element connector, and the reflective portion.

摘要翻译： 用于安装发光元件的封装包括壳体和平板状电极。 电极从外壳的下表面露出。 电极的上表面包括安装有发光元件的安装区域。 绝缘体布置在电极的上表面上。 元件连接器连接到绝缘体。 管状反射部分从元件连接器延伸到与壳体的上表面相对应的高度。 端子布置在壳体的侧表面上并连接到反射部分。 凹部容纳发光元件。 凹部形成在壳体的上部，凹部由电极的上表面，元件连接器和反射部分形成。

公开(公告)号：US11810840B2

公开(公告)日：2023-11-07

申请号：US17444779

申请日：2021-08-10

申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.

发明人： Toshiyuki Okabe

IPC分类号： H01L23/495 ,  H01L23/00 ,  H01L25/065 ,  H01L23/538 ,  H01L23/498

CPC分类号： H01L23/49531 ,  H01L23/49575 ,  H01L23/49816 ,  H01L23/5386 ,  H01L24/32 ,  H01L24/48 ,  H01L25/0657 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2924/186

摘要： A semiconductor device includes a lead frame having a first principal surface which includes a recess, and a second principal surface opposite to the first principal surface, a relay board, disposed in the recess, and having a third principal surface, and a fourth principal surface opposite to the third principal surface, wherein the fourth principal surface opposes a bottom surface of the recess, a first semiconductor chip disposed on the third principal surface, a first conductive material connecting the lead frame and the relay board, and a second conductive material connecting the relay board and the first semiconductor chip. A distance between the second principal surface and the third principal surface is less than or equal to a distance between the second principal surface and the first principal surface.

公开(公告)号：US20130277701A1

公开(公告)日：2013-10-24

申请号：US13864402

申请日：2013-04-17

申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.

发明人： Toshiyuki Okabe ,  Tsuyoshi Kobayashi ,  Toshio Kobayashi ,  Yasuyuki Kimura

IPC分类号： H01L33/38 ,  H01L33/64

CPC分类号： H01L33/38 ,  H01L33/486 ,  H01L33/62 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2933/0075 ,  H01L2924/00014 ,  H01L2924/00

摘要： A package for mounting a light emitting element includes a housing and a flat plate-shaped electrode. The electrode is exposed from a lower surface of the housing. An upper surface of the electrode includes a mounting area on which the light emitting element is mounted. An insulator is arranged on the upper surface of the electrode. An element connector is connected to the insulator. A tubular reflective portion extends from the element connector to a height corresponding to the upper surface of the housing. A terminal is arranged on the side surface of the housing and connected to the reflective portion. A recess accommodates the light emitting element. The recess is formed in an upper portion of the housing, and the recess is formed by the upper surface of the electrode, the element connector, and the reflective portion.

摘要翻译： 用于安装发光元件的封装包括壳体和平板状电极。 电极从外壳的下表面露出。 电极的上表面包括安装有发光元件的安装区域。 绝缘体布置在电极的上表面上。 元件连接器连接到绝缘体。 管状反射部分从元件连接器延伸到对应于壳体的上表面的高度。 端子布置在壳体的侧表面上并连接到反射部分。 凹部容纳发光元件。 凹部形成在壳体的上部，凹部由电极的上表面，元件连接器和反射部分形成。