公开(公告)号：US10134680B2

公开(公告)日：2018-11-20

申请号：US15676288

申请日：2017-08-14

申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.

发明人： Takaharu Yamano ,  Hajime Iizuka ,  Hideaki Sakaguchi ,  Toshio Kobayashi ,  Tadashi Arai ,  Tsuyoshi Kobayashi ,  Tetsuya Koyama ,  Kiyoaki Iida ,  Tomoaki Mashima ,  Koichi Tanaka ,  Yuji Kunimoto ,  Takashi Yanagisawa

IPC分类号： H02B1/00 ,  H01L23/538 ,  H01L23/00 ,  H01L23/552 ,  H01L21/683 ,  H01L21/56 ,  H05K1/18 ,  H01L25/16 ,  H01L25/10 ,  H01L21/48 ,  H01L23/498 ,  H01L23/31 ,  H05K3/46 ,  H05K3/20

摘要： An electronic part embedded substrate is disclosed. The electronic part embedded substrate includes a first substrate, a second substrate, an electronic part, an electrically connecting member, and a sealing member. A method of producing an electronic part embedded substrate is also disclosed. The method includes mounting an electronic part onto a first substrate, laminating a second substrate on the first substrate through an electrically connecting member; and filling a space between the first substrate and the second substrate with a sealing member to seal the electronic part.

公开(公告)号：US09451702B2

公开(公告)日：2016-09-20

申请号：US14321030

申请日：2014-07-01

申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.

发明人： Takaharu Yamano ,  Hajime Iizuka ,  Hideaki Sakaguchi ,  Toshio Kobayashi ,  Tadashi Arai ,  Tsuyoshi Kobayashi ,  Tetsuya Koyama ,  Kiyoaki Iida ,  Tomoaki Mashima ,  Koichi Tanaka ,  Yuji Kunimoto ,  Takashi Yanagisawa

IPC分类号： H05K1/18 ,  H01L21/683 ,  H01L23/552 ,  H01L23/00 ,  H01L25/10 ,  H01L25/16 ,  H01L21/56 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538 ,  H05K3/20 ,  H05K3/46

CPC分类号： H01L23/5389 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/56 ,  H01L21/563 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/552 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L25/105 ,  H01L25/16 ,  H01L25/162 ,  H01L2221/68345 ,  H01L2224/0401 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81005 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/85 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/207 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K1/185 ,  H05K1/186 ,  H05K3/20 ,  H05K3/4614 ,  H05K3/462 ,  H05K3/4644 ,  H05K2201/10007 ,  H05K2201/10378 ,  H05K2201/10674 ,  H05K2201/10977 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  H01L2924/00

摘要： An electronic part embedded substrate is disclosed. The electronic part embedded substrate includes a first substrate, a second substrate, an electronic part, an electrically connecting member, and a sealing member. A method of producing an electronic part embedded substrate is also disclosed. The method includes mounting an electronic part onto a first substrate, laminating a second substrate on the first substrate through an electrically connecting member; and filling a space between the first substrate and the second substrate with a sealing member to seal the electronic part.

摘要翻译： 公开了一种电子部件嵌入式基板。 电子部件嵌入式基板包括第一基板，第二基板，电子部件，电连接部件和密封部件。 还公开了一种制造电子部件嵌入式基板的方法。 该方法包括将电子部件安装到第一基板上，通过电连接部件将第二基板层压在第一基板上; 以及用密封构件填充第一基板和第二基板之间的空间以密封电子部件。

公开(公告)号：US10201917B2

公开(公告)日：2019-02-12

申请号：US15880011

申请日：2018-01-25

申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.

发明人： Kentaro Kaneko ,  Tsuyoshi Kobayashi ,  Yoshio Furuhata ,  Shigeri Nakamura

IPC分类号： H01L23/495 ,  B29C37/02 ,  H01L23/50 ,  H01L21/48 ,  H01L21/67 ,  H01L23/492

摘要： A lead frame includes an outer frame. The outer frame includes: one surface; another surface that is opposite to the one surface; a side surface between the one surface and the other surface; a recess that is formed to extend from the one surface to the side surface; and a notch step portion that is formed to extend from the other surface to the side surface.

公开(公告)号：US08786065B2

公开(公告)日：2014-07-22

申请号：US13667540

申请日：2012-11-02

申请人： Shinko Electric Industries Co., Ltd.

发明人： Yasuyuki Kimura ,  Tadashi Arai ,  Tsuyoshi Kobayashi ,  Toshiyuki Okabe

IPC分类号： H01L23/495 ,  H01L33/64 ,  H01L23/00 ,  H01L25/075

CPC分类号： H01L33/642 ,  H01L24/45 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/01047 ,  H01L2924/07802 ,  H01L2924/12035 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A substrate includes a first lead frame, a second lead frame, and a resin layer. The first lead frame includes a heat sink and a plurality of electrodes for external connection. The second lead frame is laminated on the first lead frame and includes a plurality of wirings for mounting light emitting elements. The resin layer is filled between the first lead frame and the second lead frame. The plurality of wirings are arranged above the heat sink. The plurality of electrodes and part of the plurality of wirings are joined with each other.

摘要翻译： 基板包括第一引线框架，第二引线框架和树脂层。 第一引线框架包括散热器和用于外部连接的多个电极。 第二引线框架层叠在第一引线框架上并且包括用于安装发光元件的多个布线。 树脂层填充在第一引线框架和第二引线框架之间。 多个布线布置在散热器的上方。 多个电极和多个布线中的一部分彼此接合。

公开(公告)号：US08890295B2

公开(公告)日：2014-11-18

申请号：US13864402

申请日：2013-04-17

申请人： Shinko Electric Industries Co., Ltd.

发明人： Toshiyuki Okabe ,  Tsuyoshi Kobayashi ,  Toshio Kobayashi ,  Yasuyuki Kimura

IPC分类号： H01L33/38 ,  H01L33/48 ,  H01L33/64 ,  H01L33/62

CPC分类号： H01L33/38 ,  H01L33/486 ,  H01L33/62 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2933/0075 ,  H01L2924/00014 ,  H01L2924/00

摘要： A package for mounting a light emitting element includes a housing and a flat plate-shaped electrode. The electrode is exposed from a lower surface of the housing. An upper surface of the electrode includes a mounting area on which the light emitting element is mounted. An insulator is arranged on the upper surface of the electrode. An element connector is connected to the insulator. A tubular reflective portion extends from the element connector to a height corresponding to the upper surface of the housing. A terminal is arranged on the side surface of the housing and connected to the reflective portion. A recess accommodates the light emitting element. The recess is formed in an upper portion of the housing, and the recess is formed by the upper surface of the electrode, the element connector, and the reflective portion.

摘要翻译： 用于安装发光元件的封装包括壳体和平板状电极。 电极从外壳的下表面露出。 电极的上表面包括安装有发光元件的安装区域。 绝缘体布置在电极的上表面上。 元件连接器连接到绝缘体。 管状反射部分从元件连接器延伸到与壳体的上表面相对应的高度。 端子布置在壳体的侧表面上并连接到反射部分。 凹部容纳发光元件。 凹部形成在壳体的上部，凹部由电极的上表面，元件连接器和反射部分形成。

公开(公告)号：US20180236696A1

公开(公告)日：2018-08-23

申请号：US15880011

申请日：2018-01-25

申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.

发明人： Kentaro Kaneko ,  Tsuyoshi Kobayashi ,  Yoshio Furuhata ,  Shigeri Nakamura

IPC分类号： B29C37/02 ,  H01L23/50 ,  H01L23/495 ,  H01L23/492 ,  H01L21/48 ,  H01L21/67

CPC分类号： B29C37/02 ,  H01L21/4828 ,  H01L21/4842 ,  H01L21/6708 ,  H01L23/4924 ,  H01L23/49513 ,  H01L23/49534 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/50 ,  H01L2224/48247

摘要： A lead frame includes an outer frame. The outer frame includes: one surface; another surface that is opposite to the one surface; a side surface between the one surface and the other surface; a recess that is formed to extend from the one surface to the side surface; and a notch step portion that is formed to extend from the other surface to the side surface.

公开(公告)号：US09768122B2

公开(公告)日：2017-09-19

申请号：US15241482

申请日：2016-08-19

申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.

发明人： Takaharu Yamano ,  Hajime Iizuka ,  Hideaki Sakaguchi ,  Toshio Kobayashi ,  Tadashi Arai ,  Tsuyoshi Kobayashi ,  Tetsuya Koyama ,  Kiyoaki Iida ,  Tomoaki Mashima ,  Koichi Tanaka ,  Yuji Kunimoto ,  Takashi Yanagisawa

IPC分类号： H05K1/16 ,  H01L23/538 ,  H01L21/683 ,  H01L23/552 ,  H01L23/00 ,  H01L25/10 ,  H01L25/16 ,  H05K1/18 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/498 ,  H05K3/20 ,  H05K3/46

CPC分类号： H01L23/5389 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/56 ,  H01L21/563 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/552 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L25/105 ,  H01L25/16 ,  H01L25/162 ,  H01L2221/68345 ,  H01L2224/0401 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81005 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/85 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/207 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K1/185 ,  H05K1/186 ,  H05K3/20 ,  H05K3/4614 ,  H05K3/462 ,  H05K3/4644 ,  H05K2201/10007 ,  H05K2201/10378 ,  H05K2201/10674 ,  H05K2201/10977 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  H01L2924/00

摘要： An electronic part embedded substrate is disclosed. The electronic part embedded substrate includes a first substrate, a second substrate, an electronic part, an electrically connecting member, and a sealing member. A method of producing an electronic part embedded substrate is also disclosed. The method includes mounting an electronic part onto a first substrate, laminating a second substrate on the first substrate through an electrically connecting member; and filling a space between the first substrate and the second substrate with a sealing member to seal the electronic part.

公开(公告)号：US20170162520A1

公开(公告)日：2017-06-08

申请号：US15365281

申请日：2016-11-30

申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.

发明人： Kentaro Kaneko ,  Yoji Asahi ,  Tsuyoshi Kobayashi ,  Koji Watanabe ,  Kenichi Komatsu ,  Toru Maruyama ,  Konosuke Kobayashi ,  Koji Ato

IPC分类号： H01L23/00 ,  H01L21/56 ,  H01L21/48 ,  H01L23/495 ,  H01L23/31

CPC分类号： H01L21/4828 ,  H01L21/4832 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49582 ,  H01L2224/48247

摘要： A lead frame includes a terminal part having a first side surface formed in a concave curve shape on a lower side from an upper end of the terminal part, and a second side surface formed in a concave curve shape on a lower side from a lower end of the first side surface. The concave curve shape of each of the first and second side surfaces has a depth in a surface direction of the terminal part. A boundary part of the first side surface and the second side surface becomes a protrusion protruding outward. The depth of the concave curve shape of the second side surface is larger than that of the first side surface. A distance between an upper end and a lower end of the second side surface is longer than a distance between an upper end and the lower end of the first side surface.

公开(公告)号：US20130277701A1

公开(公告)日：2013-10-24

申请号：US13864402

申请日：2013-04-17

申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.

发明人： Toshiyuki Okabe ,  Tsuyoshi Kobayashi ,  Toshio Kobayashi ,  Yasuyuki Kimura

IPC分类号： H01L33/38 ,  H01L33/64

CPC分类号： H01L33/38 ,  H01L33/486 ,  H01L33/62 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2933/0075 ,  H01L2924/00014 ,  H01L2924/00

摘要： A package for mounting a light emitting element includes a housing and a flat plate-shaped electrode. The electrode is exposed from a lower surface of the housing. An upper surface of the electrode includes a mounting area on which the light emitting element is mounted. An insulator is arranged on the upper surface of the electrode. An element connector is connected to the insulator. A tubular reflective portion extends from the element connector to a height corresponding to the upper surface of the housing. A terminal is arranged on the side surface of the housing and connected to the reflective portion. A recess accommodates the light emitting element. The recess is formed in an upper portion of the housing, and the recess is formed by the upper surface of the electrode, the element connector, and the reflective portion.

摘要翻译： 用于安装发光元件的封装包括壳体和平板状电极。 电极从外壳的下表面露出。 电极的上表面包括安装有发光元件的安装区域。 绝缘体布置在电极的上表面上。 元件连接器连接到绝缘体。 管状反射部分从元件连接器延伸到对应于壳体的上表面的高度。 端子布置在壳体的侧表面上并连接到反射部分。 凹部容纳发光元件。 凹部形成在壳体的上部，凹部由电极的上表面，元件连接器和反射部分形成。