公开(公告)号：US20150037575A1

公开(公告)日：2015-02-05

申请号：US14387407

申请日：2013-02-21

Applicant: SHOWA DENKO K.K.

Inventor： Yoichiro Sakaguchi ,  Kentarou Takahashi ,  Keisuke Mameda

IPC: C09D163/00 ,  C09J5/06 ,  C08K3/28 ,  C09D133/14 ,  C08K3/38

CPC classification number: C09D163/00 ,  C08K3/22 ,  C08K3/28 ,  C08K3/38 ,  C08K3/40 ,  C08K2003/2227 ,  C08K2003/2241 ,  C08K2003/282 ,  C08K2003/385 ,  C09D133/00 ,  C09D133/14 ,  C09J5/06 ,  H01L23/24 ,  H01L23/295 ,  H01L23/3107 ,  H01L23/36 ,  H01L23/3737 ,  H01L23/4334 ,  H01L23/49551 ,  H01L23/49575 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48096 ,  H01L2224/48106 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19107 ,  H05K7/20481 ,  Y10T156/10 ,  Y10T428/2848 ,  Y10T428/31511 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The present invention relates to a curable heat radiation composition which includes two types of fillers with different compressive breaking strengths (except when the two types of fillers are the same substance) and a thermosetting resin, the compressive breaking strength ratio of the two types of fillers [compressive breaking strength of a filler (A) with a higher compressive breaking strength/compressive breaking strength of a filler (B) with a lower compressive breaking strength] being 5 to 1,500, the compressive breaking strength of the filler (A) being 100 to 1,500 MPa, and the compressive breaking strength of the filler (B) being 1.0 to 20 MPa, an adhesive sheet using the composition and a method for producing the same. An aluminum nitride is preferable as the filler (A) and hexagonal boron nitride agglomerated particles are preferable as the filler (B).

Abstract translation: 本发明涉及一种可固化散热组合物，其包括具有不同压缩断裂强度的两种类型的填料（除了两种类型的填料是相同的物质之外）和热固性树脂，两种填料的抗压断裂强度比 [压缩断裂强度较低的填料（B）的抗压断裂强度/压缩断裂强度较高的填料（A）的压缩断裂强度为5〜1500，填料（A）的抗压强度为100 至1500MPa，填料（B）的压缩断裂强度为1.0〜20MPa，使用该组合物的粘合片及其制造方法。 作为填料（A），优选氮化铝，作为填料（B），优选六方氮化硼凝聚粒子。

公开(公告)号：US10717896B2

公开(公告)日：2020-07-21

申请号：US15627532

申请日：2017-06-20

Applicant: SHOWA DENKO K.K.

Inventor： Yoichiro Sakaguchi ,  Kentarou Takahashi ,  Keisuke Mameda

IPC: C08K3/38 ,  C09D163/00 ,  H01L23/373 ,  H01L23/495 ,  C08K3/22 ,  H05K7/20 ,  H01L23/36 ,  H01L23/433 ,  H01L23/24 ,  H01L23/29 ,  C08K3/28 ,  C09D133/14 ,  C09J5/06 ,  C08K3/40 ,  C09D133/00 ,  H01L23/31 ,  H01L23/00

Abstract: The present invention relates to a curable heat radiation composition which includes two types of fillers with different compressive breaking strengths (except when the two types of fillers are the same substance) and a thermosetting resin, the compressive breaking strength ratio of the two types of fillers [compressive breaking strength of a filler (A) with a higher compressive breaking strength/compressive breaking strength of a filler (B) with a lower compressive breaking strength] being 5 to 1,500, the compressive breaking strength of the filler (A) being 100 to 1,500 MPa, and the compressive breaking strength of the filler (B) being 1.0 to 20 MPa, an adhesive sheet using the composition and a method for producing the same. An aluminum nitride is preferable as the filler (A) and hexagonal boron nitride agglomerated particles are preferable as the filler (B).

公开(公告)号：US10766229B2

公开(公告)日：2020-09-08

申请号：US16608973

申请日：2018-10-04

Applicant: SHOWA DENKO K.K.

Inventor： Kentarou Takahashi ,  Hiroto Kouka ,  Yasuhiro Nakagawa

IPC: B32B15/095 ,  H01M2/02 ,  B32B7/12 ,  B32B15/20 ,  C09J175/04 ,  B32B27/40

Abstract: The present invention provides an adhesive for laminating a metal foil and a resin film, including: (A) 1% to 20% by mass of polyurethane which has at least one functional group selected from the group consisting of a hydroxy group, an acryloyl group, and a carboxy group; (B) 30% to 90% by mass of a monomer which does not has an active hydrogen and has two or more ethylenically unsaturated bonds; (C) 1% to 55% by mass of an aliphatic monomer which has one ethylenically unsaturated bond; (D) 1% to 15% by mass of a polyisocyanate compound; and (E) 0.5% to 5% by mass of a photoinitiator. The (B) has a cyclic structure, and the (C) has a linear hydrocarbon group, a branched hydrocarbon group, or a cycloalkyl group.