公开(公告)号：US09448401B2

公开(公告)日：2016-09-20

申请号：US14073307

申请日：2013-11-06

Applicant: SILEX Microsystems AB

Inventor： Thorbjorn Ebefors ,  Edvard Kalvesten ,  Peter Agren ,  Niklas Svedin

IPC: G02B26/08 ,  B81B7/00 ,  H01L21/768 ,  H01L23/48 ,  G02B6/35

CPC classification number: G02B26/0833 ,  B81B7/0006 ,  B81B7/007 ,  B81B2207/092 ,  B81B2207/095 ,  G02B6/3518 ,  G02B6/3584 ,  G02B26/0841 ,  H01L21/76898 ,  H01L23/481 ,  H01L2924/0002 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A layered micro-electronic and/or micro-mechanic structure comprises at least three alternating electrically conductive layers with insulating layers between the conductive layers. There is also provided a via in a first outer layer, said via comprising an insulated conductive connection made of wafer native material through the layer, an electrically conductive plug extending through the other layers and into said via in the first outer layer in order to provide conductivity through the layers, and an insulating enclosure surrounding said conductive plug in at least one selected layer of said other layers for insulating said plug from the material in said selected layer. It also relates to micro-electronic and/or micro-mechanic device comprising a movable member provided above a cavity such that it is movable in at least one direction. The device has a layered structure according to the invention. Methods of making such a layered MEMS structure is also provided.

Abstract translation: 分层微电子和/或微机械结构包括在导电层之间具有绝缘层的至少三个交替导电层。 还提供了在第一外层中的通孔，所述通孔包括由穿过该层的晶片天然材料制成的绝缘导电连接，在第一外层中延伸穿过其它层并进入所述通孔的导电插塞，以便提供 通过层的导电性，以及围绕所述其它层的至少一个所选层的所述导电插塞的绝缘外壳，用于使所述插塞与所述选定层中的材料绝缘。 它还涉及微电子和/或微机械装置，其包括设置在空腔上方的可动构件，使得其可在至少一个方向上移动。 该装置具有根据本发明的分层结构。 还提供了制造这种分层MEMS结构的方法。

公开(公告)号：US09718674B2

公开(公告)日：2017-08-01

申请号：US14914015

申请日：2014-08-26

Applicant: SILEX MICROSYSTEMS AB

Inventor： Edvard Kalvesten ,  Thorbjorn Ebefors ,  Niklas Svedin

IPC: H01L23/08 ,  B81B7/00 ,  H01L21/50 ,  B81C1/00 ,  H01L23/00

CPC classification number: B81B7/007 ,  B81B2201/01 ,  B81B2201/0264 ,  B81B2201/0271 ,  B81B2203/0118 ,  B81B2203/0127 ,  B81B2207/095 ,  B81C1/00301 ,  B81C2201/0153 ,  B81C2201/036 ,  B81C2203/0109 ,  B81C2203/0145 ,  H01L21/50 ,  H01L23/08 ,  H01L24/94 ,  H01L2924/16235

Abstract: A device includes a base substrate (700) with a micro component (702) attached thereto. Suitably it is provided with routing elements (704) for conducting signals to and from the component (702). It also includes spacer members (706) which also can act as conducting structures for routing signals vertically. There is a capping structure (708) of a glass material, provided above the base substrate (700), bonded via the spacer members (706), preferably by eutectic bonding, wherein the capping structure (708) includes vias (710) including metal for providing electrical connection through the capping structure. The vias can be made by a stamping/pressing method entailing pressing needles under heating to soften the glass and applying pressure, to a predetermined depth in the glass. However, other methods are possible, e-g- drilling, etching, blasting.

公开(公告)号：US20140346657A1

公开(公告)日：2014-11-27

申请号：US14365235

申请日：2012-12-17

Applicant: SILEX MICROSYSTEMS AB

Inventor： Thorbjorn Ebefors ,  Niklas Svedin

IPC: B81C1/00 ,  B81B7/00

CPC classification number: B81C1/00285 ,  B81B7/0038 ,  B81C1/00293 ,  B81C2203/0136 ,  B81C2203/0145

Abstract: A method for sealing cavities in micro-electronic/-mechanical system (MEMS) devices to provide a controlled atmosphere within the sealed cavity includes providing a semiconductor substrate on which a template is provided on a localized area of the substrate. The template defines the interior shape of the cavity. Holes are made so as to enable venting of the cavity to provide a desired atmosphere to enter into the cavity through the hole. Finally, a sealing material is provided in the hole to seal the cavity. The sealing can be made by compression and/or melting of the sealing material.

Abstract translation: 一种用于在微电子/机械系统（MEMS）装置中密封空腔以在密封空腔内提供受控气氛的方法包括提供其上在基板的局部区域上提供模板的半导体衬底。 模板定义了腔的内部形状。 孔被制成以便能够排出空腔以提供期望的气氛以通过孔进入空腔。 最后，在孔中设置密封材料以密封空腔。 密封可以通过密封材料的压缩和/或熔化来制造。

公开(公告)号：US09511999B2

公开(公告)日：2016-12-06

申请号：US14365235

申请日：2012-12-17

Applicant: SILEX MICROSYSTEMS AB

Inventor： Thorbjorn Ebefors ,  Niklas Svedin

IPC: H01L21/76 ,  B81C1/00 ,  B81B7/00

CPC classification number: B81C1/00285 ,  B81B7/0038 ,  B81C1/00293 ,  B81C2203/0136 ,  B81C2203/0145

Abstract: A method for sealing cavities in micro-electronic/-mechanical system (MEMS) devices to provide a controlled atmosphere within the sealed cavity includes providing a semiconductor substrate on which a template is provided on a localized area of the substrate. The template defines the interior shape of the cavity. Holes are made so as to enable venting of the cavity to provide a desired atmosphere to enter into the cavity through the hole. Finally, a sealing material is provided in the hole to seal the cavity. The sealing can be made by compression and/or melting of the sealing material.

Abstract translation: 一种用于在微电子/机械系统（MEMS）装置中密封空腔以在密封空腔内提供受控气氛的方法包括提供其上在基板的局部区域上提供模板的半导体衬底。 模板定义了腔的内部形状。 孔被制成以便能够排出空腔以提供期望的气氛以通过孔进入空腔。 最后，在孔中设置密封材料以密封空腔。 密封可以通过密封材料的压缩和/或熔化来制造。

公开(公告)号：US20140063580A1

公开(公告)日：2014-03-06

申请号：US14073307

申请日：2013-11-06

Applicant: SILEX Microsystems AB

Inventor： Thorbjorn Ebefors ,  Edvard Kalvesten ,  Peter Agren ,  Niklas Svedin

IPC: G02B26/08

CPC classification number: G02B26/0833 ,  B81B7/0006 ,  B81B7/007 ,  B81B2207/092 ,  B81B2207/095 ,  G02B6/3518 ,  G02B6/3584 ,  G02B26/0841 ,  H01L21/76898 ,  H01L23/481 ,  H01L2924/0002 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A layered micro-electronic and/or micro-mechanic structure comprises at least three alternating electrically conductive layers with insulating layers between the conductive layers. There is also provided a via in a first outer layer, said via comprising an insulated conductive connection made of wafer native material through the layer, an electrically conductive plug extending through the other layers and into said via in the first outer layer in order to provide conductivity through the layers, and an insulating enclosure surrounding said conductive plug in at least one selected layer of said other layers for insulating said plug from the material in said selected layer. It also relates to micro-electronic and/or micro- mechanic device comprising a movable member provided above a cavity such that it is movable in at least one direction. The device has a layered structure according to the invention. Methods of making such a layered MEMS structure is also provided.

Abstract translation: 分层微电子和/或微机械结构包括在导电层之间具有绝缘层的至少三个交替导电层。 还提供了在第一外层中的通孔，所述通孔包括由穿过该层的晶片天然材料制成的绝缘导电连接，在第一外层中延伸穿过其它层并进入所述通孔的导电插塞，以便提供 通过层的导电性，以及围绕所述其它层的至少一个所选层的所述导电插塞的绝缘外壳，用于使所述插塞与所述选定层中的材料绝缘。 它还涉及微电子和/或微机械装置，其包括设置在空腔上方的可动构件，使得其可在至少一个方向上移动。 该装置具有根据本发明的分层结构。 还提供了制造这种分层MEMS结构的方法。