公开(公告)号：US20150249075A1

公开(公告)日：2015-09-03

申请号：US14714421

申请日：2015-05-18

Applicant: SK hynix Inc.

Inventor： In Chul HWANG ,  Jae Myun KIM ,  Seung Jee KIM ,  Jin Su LEE

IPC: H01L25/00 ,  H01L23/00 ,  H01L21/768 ,  H01L25/065

CPC classification number: H01L25/50 ,  H01L21/76898 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/80 ,  H01L24/81 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/08145 ,  H01L2224/13025 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/48227 ,  H01L2224/80006 ,  H01L2224/80896 ,  H01L2224/81191 ,  H01L2224/9202 ,  H01L2224/9222 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06558 ,  H01L2225/06565 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/00 ,  H01L2224/80 ,  H01L2224/11 ,  H01L2224/81

Abstract: Dual-layered structural semiconductor chips are provided. The semiconductor chip includes a first semiconductor chip and a second semiconductor chip bonded to the first semiconductor chip. The first semiconductor chip includes a first substrate having a first bottom surface. The second semiconductor chip includes a second substrate having a second bottom surface. The first bottom surface directly contacts the second bottom surface. The related packages and the related methods are also provided.

Abstract translation: 提供双层结构半导体芯片。 半导体芯片包括接合到第一半导体芯片的第一半导体芯片和第二半导体芯片。 第一半导体芯片包括具有第一底表面的第一基板。 第二半导体芯片包括具有第二底面的第二基板。 第一底面直接接触第二底面。 还提供了相关包和相关方法。

公开(公告)号：US20130147060A1

公开(公告)日：2013-06-13

申请号：US13756831

申请日：2013-02-01

Applicant: SK HYNIX INC.

Inventor： Jae Myun KIM ,  Seung Jee KIM ,  Ki Bum KIM

IPC: H01L23/48

CPC classification number: H01L25/0657 ,  H01L24/16 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/13099 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/48227 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/85399 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2924/00011 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: A semiconductor package includes a substrate, a first semiconductor chip module attached to the substrate, a conductive connection member attached to the first semiconductor chip module, and a second semiconductor chip module attached to the conductive connection member. The first and second semiconductor chip modules are formed to have step like shapes and extend laterally in opposite directions so as to define a zigzag arrangement together.

Abstract translation: 半导体封装包括衬底，附着到衬底的第一半导体芯片模块，附接到第一半导体芯片模块的导电连接构件和附接到导电连接构件的第二半导体芯片模块。 第一和第二半导体芯片模块形成为具有阶梯状形状并且沿相反方向横向延伸，以便将Z字形布置在一起。