公开(公告)号：US20180309187A1

公开(公告)日：2018-10-25

申请号：US16017611

申请日：2018-06-25

Applicant: STMicroelectronics (Grenoble 2) SAS ,  STMicroelectronics (Alps) SAS

Inventor： David Auchere ,  Laurent Marechal ,  Yvon Imbs ,  Laurent Schwarz

IPC: H01Q1/22 ,  H01L23/31 ,  H01L21/56 ,  H01L23/498 ,  H01L21/48 ,  H01L23/66 ,  H01L21/3105

Abstract: An electronic device includes a support plate having a mounting face and an electrical connection network. An integrated circuit chip is mounted on the mounting face and linked to the electrical connection network. An encapsulation block embeds the integrated circuit chip. An additional element made of an electrically conductive material is at least partly embedded within the encapsulation block. The additional conductive element has a main portion extending parallel to the support plate and has a secondary portion that is linked electrically to the integrated circuit chip. An opening is formed in the encapsulation block, and the secondary portion extends into that opening to make the electrical link. The additional conductive element may be an antenna.

公开(公告)号：US10522899B2

公开(公告)日：2019-12-31

申请号：US16017611

申请日：2018-06-25

Applicant: STMicroelectronics (Grenoble 2) SAS ,  STMicroelectronics (Alps) SAS

Inventor： David Auchere ,  Laurent Marechal ,  Yvon Imbs ,  Laurent Schwarz

IPC: H01Q1/22 ,  H01L23/31 ,  H01L21/56 ,  H01L23/66 ,  H01L21/3105 ,  H01L21/48 ,  H01L23/498

Abstract: An electronic device includes a support plate having a mounting face and an electrical connection network. An integrated circuit chip is mounted on the mounting face and linked to the electrical connection network. An encapsulation block embeds the integrated circuit chip. An additional element made of an electrically conductive material is at least partly embedded within the encapsulation block. The additional conductive element has a main portion extending parallel to the support plate and has a secondary portion that is linked electrically to the integrated circuit chip. An opening is formed in the encapsulation block, and the secondary portion extends into that opening to make the electrical link. The additional conductive element may be an antenna.

公开(公告)号：US09754853B2

公开(公告)日：2017-09-05

申请号：US15050216

申请日：2016-02-22

Applicant: STMicroelectronics (Grenoble 2) SAS ,  STMicroelectronics (Alps) SAS

Inventor： David Auchere ,  Laurent Marechal ,  Laurent Schwarz ,  Yvon Imbs

IPC: H01L23/48 ,  H01L23/31 ,  H01L23/64 ,  H01L23/66 ,  H01L23/00 ,  H01Q1/22 ,  H01L21/48 ,  H01L21/52 ,  H01L21/56 ,  H01L23/13 ,  H01L23/498

CPC classification number: H01Q1/38 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/4889 ,  H01L21/52 ,  H01L21/56 ,  H01L23/13 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/315 ,  H01L23/481 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/645 ,  H01L23/66 ,  H01L24/81 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2924/15311 ,  H01L2924/1815 ,  H01Q1/2283

Abstract: An electronic device includes a support board having a mounting face and an integrated circuit chip mounted on the mounting face. An encapsulation block embeds the integrated circuit chip, the encapsulation block extending above the integrated circuit chip and around the integrated circuit chip on the mounting face of the support board. The encapsulation block includes a front face with a hole passing through the encapsulation block to uncovering at least part of an electrical contact. A layer made of an electrically conducting material fills the hole to make electrical connection to the electrical contact and further extends over the front face of the encapsulation block.

公开(公告)号：US20170062298A1

公开(公告)日：2017-03-02

申请号：US15050216

申请日：2016-02-22

Applicant: STMicroelectronics (Grenoble 2) SAS ,  STMicroelectronics (Alps) SAS

Inventor： David Auchere ,  Laurent Marechal ,  Laurent Schwarz ,  Yvon Imbs

IPC: H01L23/31 ,  H01L21/56 ,  H01L21/48 ,  H01L21/52 ,  H01L23/13 ,  H01L23/498

CPC classification number: H01Q1/38 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/4889 ,  H01L21/52 ,  H01L21/56 ,  H01L23/13 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/315 ,  H01L23/481 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/645 ,  H01L23/66 ,  H01L24/81 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2924/15311 ,  H01L2924/1815 ,  H01Q1/2283

Abstract: An electronic device includes a support board having a mounting face and an integrated circuit chip mounted on the mounting face. An encapsulation block embeds the integrated circuit chip, the encapsulation block extending above the integrated circuit chip and around the integrated circuit chip on the mounting face of the support board. The encapsulation block includes a front face with a hole passing through the encapsulation block to uncovering at least part of an electrical contact. A layer made of an electrically conducting material fills the hole to make electrical connection to the electrical contact and further extends over the front face of the encapsulation block.

Abstract translation: 电子设备包括具有安装面的支撑板和安装在安装面上的集成电路芯片。 封装块嵌入集成电路芯片，封装块在集成电路芯片上方延伸，并围绕集成电路芯片在支撑板的安装面上。 封装块包括具有穿过封装块的孔的前表面以露出至少一部分电触点。 由导电材料制成的层填充孔以与电接触电连接并且进一步在封装块的前表面上延伸。

公开(公告)号：US20150016081A1

公开(公告)日：2015-01-15

申请号：US14330176

申请日：2014-07-14

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： David Auchere ,  Laurent Marechal

IPC: H01L23/50 ,  H05K3/42 ,  H01L23/64

CPC classification number: H05K3/42 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/645 ,  H01L2224/16225 ,  H01L2924/15311 ,  Y10T29/4913

Abstract: An electronic device may include a substrate, and an integrated circuit over the substrate. The substrate may be provided with an electrical connection network including electrical links for linking the integrated circuit to another electrical device. Some of the electrical links may include an impedance-compensating inductor.

Abstract translation: 电子设备可以包括衬底，以及在衬底上的集成电路。 衬底可以设置有包括用于将集成电路连接到另一电气设备的电连接的电连接网络。 一些电连接可以包括阻抗补偿电感器。

公开(公告)号：US11482487B2

公开(公告)日：2022-10-25

申请号：US17064119

申请日：2020-10-06

Applicant: STMicroelectronics (Grenoble 2) SAS ,  STMicroelectronics (Alps) SAS

Inventor： David Auchere ,  Claire Laporte ,  Deborah Cogoni ,  Laurent Schwartz

IPC: H01L23/50 ,  H01L23/31

Abstract: An electronic device includes a carrier substrate with an electronic IC chip mounted on top of the carrier substrate. An encapsulation block on top of the front face of the carrier substrate embeds the IC chip. The encapsulation block has a through-void for positioning and confinement that extends through the encapsulation block to the top of the carrier substrate. At least one electronic component is positioned within the through-void and mounted to the top of the carrier substrate. Solder bumps or pads are located within the through-void to electrically connect the at least one electronic component to the carrier substrate.

公开(公告)号：US10811349B2

公开(公告)日：2020-10-20

申请号：US16110121

申请日：2018-08-23

Applicant: STMicroelectronics (Grenoble 2) SAS ,  STMicroelectronics (Alps) SAS

Inventor： David Auchere ,  Laurent Schwarz ,  Deborah Cogoni ,  Eric Saugier

IPC: H01L23/498 ,  H01L23/538 ,  H01L23/00 ,  H05K1/18 ,  H01L23/31 ,  H01L23/13 ,  H01L21/56 ,  H01L21/78

Abstract: An electronic device includes a support wafer, an electronic chip and an encapsulating block for the electronic chip above the support wafer. The support wafer is provided with a first network of electrical connections and a second network of electrical connections formed solely by tracks. First electrical connection elements are interposed between first front electrical contacts of the electronic chip and rear electrical contacts of the first network. Second electrical connection elements are interposed between second front electrical contacts of the electronic chip and internal electrical contact zones of the tracks of the second network. The first network includes front external electrical contacts and the tracks exhibiting external electrical contact zones.

公开(公告)号：US10224306B2

公开(公告)日：2019-03-05

申请号：US15602278

申请日：2017-05-23

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： David Auchere ,  Asma Hajji ,  Fabien Quercia ,  Jerome Lopez

IPC: H01L23/552 ,  H01L23/00 ,  H01L23/31

Abstract: An electrical connection wire connects an electrical connection pad of an electrical chip and an electrical connection pad of a carrier substrate to which the electronic chip is mounted. A dielectric layer surrounds at least the bonding wire. The dielectric layer may be a dielectric sheath or a hardened liquid dielectric material. A dielectric material may also cover at least a portion of the electrical chip and carrier substrate. A liquid electrically conductive material is deposited and hardened to form a local conductive shield surrounding the dielectric layer at the bonding wire.

公开(公告)号：US10062961B2

公开(公告)日：2018-08-28

申请号：US15667259

申请日：2017-08-02

Applicant: STMicroelectronics (Alps) SAS ,  STMicroelectronics (Grenoble 2) SAS

Inventor： David Auchere ,  Laurent Marechal ,  Laurent Schwarz ,  Yvon Imbs

IPC: H01L21/00 ,  H01Q1/38 ,  H01L21/48 ,  H01L23/66 ,  H01L23/48 ,  H01L23/498 ,  H01L23/31 ,  H01Q1/22

CPC classification number: H01Q1/38 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/4889 ,  H01L21/52 ,  H01L21/56 ,  H01L23/13 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/315 ,  H01L23/481 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/645 ,  H01L23/66 ,  H01L24/16 ,  H01L24/81 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2924/15311 ,  H01L2924/1815 ,  H01Q1/2283

Abstract: An electronic device includes a support board having a mounting face and an integrated circuit chip mounted on the mounting face. An encapsulation block embeds the integrated circuit chip, the encapsulation block extending above the integrated circuit chip and around the integrated circuit chip on the mounting face of the support board. The encapsulation block includes a front face with a hole passing through the encapsulation block to uncovering at least part of an electrical contact. A layer made of an electrically conducting material fills the hole to make electrical connection to the electrical contact and further extends over the front face of the encapsulation block.

公开(公告)号：US20180122770A1

公开(公告)日：2018-05-03

申请号：US15602278

申请日：2017-05-23

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： David Auchere ,  Asma Hajji ,  Fabien Quercia ,  Jerome Lopez

IPC: H01L23/00 ,  H01L23/552 ,  H01L23/31

CPC classification number: H01L24/85 ,  H01L23/3157 ,  H01L23/552 ,  H01L24/48 ,  H01L2224/48992 ,  H01L2224/48997 ,  H01L2224/8592

Abstract: An electrical connection wire connects an electrical connection pad of an electrical chip and an electrical connection pad of a carrier substrate to which the electronic chip is mounted. A dielectric layer surrounds at least the bonding wire. The dielectric layer may be a dielectric sheath or a hardened liquid dielectric material. A dielectric material may also cover at least a portion of the electrical chip and carrier substrate. A liquid electrically conductive material is deposited and hardened to form a local conductive shield surrounding the dielectric layer at the bonding wire.