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1.发明授权Semiconductor integrated device with mechanically decoupled active area and related manufacturing process 有权半导体集成器件具有机械解耦有源区和相关制造工艺公开(公告)号：US09184138B2
公开(公告)日：2015-11-10
申请号：US13719103
申请日：2012-12-18
CPC分类号： H01L23/562 , H01L21/56 , H01L23/16 , H01L23/3107 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/1461 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor integrated device is provided with: a die having a body of semiconductor material with a front surface, and an active area arranged at the front surface; and a package having a support element carrying the die at a back surface of the body, and a coating material covering the die. The body includes a mechanical decoupling region, which mechanically decouples the active area from mechanical stresses induced by the package; the mechanical decoupling region is a trench arrangement within the body, which releases the active area from an external frame of the body, designed to absorb the mechanical stresses induced by the package.
摘要翻译： 半导体集成器件具有：具有前表面的半导体材料体的主体和配置在前表面的有源区域; 以及具有在主体的背面承载模具的支撑元件和覆盖模具的包覆材料的包装。 机体包括机械解耦区域，机械解耦有源区域与由包装引起的机械应力; 机械解耦区域是主体内的沟槽布置，其从主体的外框架释放活动区域，设计成吸收由包装引起的机械应力。
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2.发明申请SEMICONDUCTOR INTEGRATED DEVICE WITH MECHANICALLY DECOUPLED ACTIVE AREA AND RELATED MANUFACTURING PROCESS 有权具有机械解除活动区域的半导体集成器件及相关制造工艺公开(公告)号：US20130168840A1
公开(公告)日：2013-07-04
申请号：US13719103
申请日：2012-12-18
CPC分类号： H01L23/562 , H01L21/56 , H01L23/16 , H01L23/3107 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/1461 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor integrated device is provided with: a die having a body of semiconductor material with a front surface, and an active area arranged at the front surface; and a package having a support element carrying the die at a back surface of the body, and a coating material covering the die. The body includes a mechanical decoupling region, which mechanically decouples the active area from mechanical stresses induced by the package; the mechanical decoupling region is a trench arrangement within the body, which releases the active area from an external frame of the body, designed to absorb the mechanical stresses induced by the package.
摘要翻译： 半导体集成器件具有：具有前表面的半导体材料体的主体和配置在前表面的有源区域; 以及具有在主体的背面承载模具的支撑元件和覆盖模具的包覆材料的包装。 机体包括机械解耦区域，机械解耦有源区域与由包装引起的机械应力; 机械解耦区域是主体内的沟槽布置，其从主体的外框架释放活动区域，设计成吸收由包装引起的机械应力。
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3.发明授权公开(公告)号：US09388038B2
公开(公告)日：2016-07-12
申请号：US14265116
申请日：2014-04-29
发明人： Roberto Campedelli , Raffaella Pezzuto , Stefano Losa , Marco Mantovani , Mikel Azpeitia Urquia
CPC分类号： B81B7/0006 , B81B3/0086 , B81B7/007 , B81B2201/0235 , B81B2201/0242 , B81B2207/07 , B81B2207/097 , B81C1/00476 , H01L29/84
摘要： A MEMS device formed by a body; a cavity, extending above the body; mobile and fixed structures extending above the cavity and physically connected to the body via anchoring regions; and electrical-connection regions, extending between the body and the anchoring regions and electrically connected to the mobile and fixed structures. The electrical-connection regions are formed by a conductive multilayer including a first semiconductor material layer, a composite layer of a binary compound of the semiconductor material and of a transition metal, and a second semiconductor material layer.
摘要翻译： 由身体形成的MEMS器件; 一个在身体上方延伸的空腔; 移动和固定结构延伸到腔体之上并通过锚定区域物理地连接到身体; 以及电连接区域，其在主体和锚定区域之间延伸并且电连接到移动和固定结构。 电连接区域由包括第一半导体材料层，半导体材料的二元化合物和过渡金属的复合层和第二半导体材料层的导电多层形成。
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4.发明申请公开(公告)号：US20140231938A1
公开(公告)日：2014-08-21
申请号：US14265116
申请日：2014-04-29
发明人： Roberto Campedelli , Raffaella Pezzuto , Stefano Losa , Marco Mantovani , Mikel Azpeitia Urquia
CPC分类号： B81B7/0006 , B81B3/0086 , B81B7/007 , B81B2201/0235 , B81B2201/0242 , B81B2207/07 , B81B2207/097 , B81C1/00476 , H01L29/84
摘要： A MEMS device formed by a body; a cavity, extending above the body; mobile and fixed structures extending above the cavity and physically connected to the body via anchoring regions; and electrical-connection regions, extending between the body and the anchoring regions and electrically connected to the mobile and fixed structures. The electrical-connection regions are formed by a conductive multilayer including a first semiconductor material layer, a composite layer of a binary compound of the semiconductor material and of a transition metal, and a second semiconductor material layer.
摘要翻译： 由身体形成的MEMS器件; 一个在身体上方延伸的空腔; 移动和固定结构延伸到腔体之上并通过锚定区域物理地连接到身体; 以及电连接区域，其在主体和锚定区域之间延伸并且电连接到移动和固定结构。 电连接区域由包括第一半导体材料层，半导体材料的二元化合物和过渡金属的复合层的导电多层和第二半导体材料层形成。
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5.发明申请PROCESS FOR MANUFACTURING AN INTEGRATED MEMBRANE OF NOZZLES IN MEMS TECHNOLOGY FOR A SPRAY DEVICE AND SPRAY DEVICE USING SUCH MEMBRANE 审中-公开在使用这种膜的喷雾装置和喷射装置的MEMS技术中制造喷嘴的集成膜的方法公开(公告)号：US20140202453A1
公开(公告)日：2014-07-24
申请号：US14225285
申请日：2014-03-25
IPC分类号： A61M15/00
CPC分类号： A61M15/009 , B05B1/14 , B05B17/0638 , B05D7/00 , B81B2201/058 , B81B2203/0127 , B81C1/00087 , Y10T29/49401
摘要： A process for manufacturing a membrane of nozzles of a spray device, comprising the steps of laying a substrate, forming a membrane layer on the substrate, forming a plurality of nozzles in the membrane layer, forming a plurality of supply channels in the substrate, each supply channel being substantially aligned in a vertical direction to a respective nozzle of the plurality of nozzles and in direct communication with the respective nozzle.
摘要翻译： 一种喷雾装置的喷嘴膜的制造方法，其特征在于，包括以下步骤：在所述基材上形成膜层，在所述膜层上形成膜层，在所述膜层中形成多个喷嘴，在所述基材中形成多个供给流路， 供应通道在垂直方向上基本上对准多个喷嘴中的相应喷嘴并与相应喷嘴直接连通。
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6.发明授权Process for manufacturing an integrated membrane of nozzles in MEMS technology for a spray device and spray device using such membrane 有权用于制造用于喷雾装置的MEMS技术中的喷嘴集成膜的方法和使用这种膜的喷涂装置的方法公开(公告)号：US08721910B2
公开(公告)日：2014-05-13
申请号：US13754510
申请日：2013-01-30
IPC分类号： B44C1/22
CPC分类号： A61M15/009 , B05B1/14 , B05B17/0638 , B05D7/00 , B81B2201/058 , B81B2203/0127 , B81C1/00087 , Y10T29/49401
摘要： A process for manufacturing a membrane of nozzles of a spray device, comprising the steps of laying a substrate, forming a membrane layer on the substrate, forming a plurality of nozzles in the membrane layer, forming a plurality of supply channels in the substrate, each supply channel being substantially aligned in a vertical direction to a respective nozzle of the plurality of nozzles and in direct communication with the respective nozzle.
摘要翻译： 一种喷雾装置的喷嘴膜的制造方法，其特征在于，包括以下步骤：在所述基材上形成膜层，在所述膜层上形成膜层，在所述膜层中形成多个喷嘴，在所述基材中形成多个供给流路， 供应通道在垂直方向上基本上对准多个喷嘴中的相应喷嘴并与相应喷嘴直接连通。
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7.发明授权Process for manufacturing an integrated membrane of nozzles in MEMS technology for a spray device and spray device using such membrane 有权用于制造用于喷雾装置的MEMS技术中的喷嘴集成膜的方法和使用这种膜的喷涂装置的方法公开(公告)号：US09486593B2
公开(公告)日：2016-11-08
申请号：US14225285
申请日：2014-03-25
CPC分类号： A61M15/009 , B05B1/14 , B05B17/0638 , B05D7/00 , B81B2201/058 , B81B2203/0127 , B81C1/00087 , Y10T29/49401
摘要： A process for manufacturing a membrane of nozzles of a spray device, comprising the steps of laying a substrate, forming a membrane layer on the substrate, forming a plurality of nozzles in the membrane layer, forming a plurality of supply channels in the substrate, each supply channel being substantially aligned in a vertical direction to a respective nozzle of the plurality of nozzles and in direct communication with the respective nozzle.
摘要翻译： 一种喷雾装置的喷嘴膜的制造方法，其特征在于，包括以下步骤：在所述基材上形成膜层，在所述膜层上形成膜层，在所述膜层中形成多个喷嘴，在所述基材中形成多个供给流路， 供应通道在垂直方向上基本上对准多个喷嘴中的相应喷嘴并与相应喷嘴直接连通。
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