NONVOLATILE, ELECTRICALLY NON-PROGRAMMABLE MEMORY DEVICE AND MANUFACTORY PROCESS THEREOF

    公开(公告)号:US20190130970A1

    公开(公告)日:2019-05-02

    申请号:US16169763

    申请日:2018-10-24

    Abstract: The ROM device has a memory array including memory cells formed by an access element and a data storage element; a high voltage column decoder stage; a high voltage row decoder stage; an analog stage; and a writing stage, wherein the data storage elements are electrically non-programmable and non-modifiable. The memory array is formed by memory cells having a first logic state and by memory cells having a second logic state. The data storage element of the memory cells having the first logic state is formed by a continuous conductive path uninterruptedly connecting the access transistor to the respective bit line, the data storage element of the memory cells having the second logic state is formed by a region of dielectric material insulating the access transistor from the respective bit line.

    Transformed non-reprogrammable memory array devices and methods of manufacture

    公开(公告)号:US10755777B2

    公开(公告)日:2020-08-25

    申请号:US16169763

    申请日:2018-10-24

    Abstract: The ROM device has a memory array including memory cells formed by an access element and a data storage element; a high voltage column decoder stage; a high voltage row decoder stage; an analog stage; and a writing stage, wherein the data storage elements are electrically non-programmable and non-modifiable. The memory array is formed by memory cells having a first logic state and by memory cells having a second logic state. The data storage element of the memory cells having the first logic state is formed by a continuous conductive path uninterruptedly connecting the access transistor to the respective bit line, the data storage element of the memory cells having the second logic state is formed by a region of dielectric material insulating the access transistor from the respective bit line.

    Sense amplifier for non-volatile memory devices and related methods

    公开(公告)号:US10068643B2

    公开(公告)日:2018-09-04

    申请号:US15422290

    申请日:2017-02-01

    Abstract: A memory device includes an array of phase-change memory (PCM) cells and complementary PCM cells. A column decoder is coupled to the array of PCM cells and complementary PCM cells, and a sense amplifier is coupled to the column decoder. The sense amplifier includes a current integrator configured to receive first and second currents of a given PCM cell and complementary PCM cell, respectively. A current-to-voltage converter is coupled to the current integrator and is configured to receive the first and second currents, and to provide first and second voltages of the given PCM cell and complementary PCM cell to first and second nodes, respectively. A logic circuit is coupled to the first and second nodes and is configured to disable the column decoder and to discharge the bitline and complementary bitline voltages in response to the first and second voltages.

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