公开(公告)号：US09570430B2

公开(公告)日：2017-02-14

申请号：US14709924

申请日：2015-05-12

申请人： GLOBALFOUNDRIES, Inc.

发明人： Frank Kuechenmeister ,  Christian Klewer ,  Jens Oswald

IPC分类号： H01L25/00 ,  H01L23/00 ,  H01L25/065 ,  H01L23/31

CPC分类号： H01L25/50 ,  H01L23/3114 ,  H01L23/3192 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L25/0657 ,  H01L2224/03009 ,  H01L2224/0346 ,  H01L2224/0347 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05572 ,  H01L2224/0603 ,  H01L2224/06051 ,  H01L2224/08147 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/32225 ,  H01L2224/48097 ,  H01L2224/48227 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81002 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2224/85002 ,  H01L2224/92127 ,  H01L2224/94 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2224/11 ,  H01L2224/03 ,  H01L2224/05599 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Articles including bonded metal structures and methods of preparing the same are provided herein. In an embodiment, a method of preparing an article that includes bonded metal structures includes providing a first substrate. A first metal structure and a second metal structure are formed on the first substrate. The first metal structure and the second metal structure each include an exposed contact surface. A bond mask is formed over the contact surface of the first metal structure. A second substrate is bonded to the first substrate through the exposed contact surface of the second metal structure. The bond mask remains disposed over the exposed contact surface of the second metal structure during bonding of the second substrate to the first substrate. A wire is bonded to the exposed contact surface of the first metal structure.

摘要翻译： 本文提供了包含粘结金属结构的物质及其制备方法。 在一个实施方案中，制备包含粘合金属结构的制品的方法包括提供第一基底。 在第一基板上形成第一金属结构和第二金属结构。 第一金属结构和第二金属结构各自包括暴露的接触表面。 在第一金属结构的接触表面上形成接合掩模。 第二衬底通过第二金属结构的暴露的接触表面结合到第一衬底。 在第二衬底与第一衬底接合期间，接合掩模保持设置在第二金属结构的暴露的接触表面上。 线接合到第一金属结构的暴露的接触表面。

公开(公告)号：US20150294930A1

公开(公告)日：2015-10-15

申请号：US14667860

申请日：2015-03-25

申请人： NXP B.V.

发明人： Yi Zhu

IPC分类号： H01L23/495 ,  H01L29/78

CPC分类号： H01L23/49589 ,  H01L23/4952 ,  H01L23/64 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L29/7817 ,  H01L2223/6611 ,  H01L2223/6655 ,  H01L2224/05599 ,  H01L2224/45124 ,  H01L2224/48096 ,  H01L2224/48097 ,  H01L2224/48195 ,  H01L2224/48247 ,  H01L2224/4909 ,  H01L2224/49109 ,  H01L2224/49175 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/19107 ,  H03F1/565 ,  H03F3/193 ,  H03F2200/387 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device including an RF power transistor in a semiconductor package is described. The semiconductor device comprises a gate lead frame, a drain lead frame, a die including a power transistor having a gate and a drain and a flange. A gate impedance matching network is connected between the gate lead frame and the gate. A drain impedance matching network is connected between the drain lead frame and the drain and includes a drain lead frame bond wire between the drain lead frame and the drain. A first conducting element is connected between the die and the flange and is arranged to provide a current path along which a return current can flow in use to lower an inductance associated with the drain lead frame bond wire.

摘要翻译： 描述了包括半导体封装中的RF功率晶体管的半导体器件。 半导体器件包括栅极引线框架，漏极引线框架，包括具有栅极和漏极的功率晶体管和法兰的管芯。 栅极阻抗匹配网络连接在栅极引线框架和栅极之间。 漏极阻抗匹配网络连接在漏极引线框架和漏极之间，并且在漏极引线框架和漏极之间包括漏极引线框架接合线。 第一导电元件连接在模具和凸缘之间，并且被布置成提供电流路径，在使用时，返回电流可以流过该电流路径以降低与漏极​​引线框架接合线相关联的电感。

公开(公告)号：US20130049231A1

公开(公告)日：2013-02-28

申请号：US13590472

申请日：2012-08-21

申请人： Kosuke MIYOSHI ,  Kinya SAKODA ,  Toshikuni SHINOHARA

发明人： Kosuke MIYOSHI ,  Kinya SAKODA ,  Toshikuni SHINOHARA

IPC分类号： H01L23/48 ,  H01L21/56

CPC分类号： H01L24/48 ,  H01L23/3107 ,  H01L23/4952 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/05554 ,  H01L2224/29101 ,  H01L2224/29339 ,  H01L2224/29386 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48097 ,  H01L2224/48247 ,  H01L2224/48456 ,  H01L2224/4846 ,  H01L2224/48465 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85181 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2224/85986 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/20752 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A semiconductor device includes a semiconductor chip, a die pad including an obverse surface on which the semiconductor chip is bonded, a lead spaced apart from the die pad, a bonding wire electrically connecting the semiconductor chip and the lead to each other, and a resin package that seals the semiconductor chip and the bonding wire. The bonding wire includes a first bond portion press-bonded to the semiconductor chip by ball bonding, a second bond portion press bonded to the lead by stitch bonding, a landing portion extending from the second bond portion toward the die pad and formed in contact with an obverse surface of the lead, and a loop extending obliquely upward from the landing portion toward the semiconductor chip.

摘要翻译： 半导体器件包括：半导体芯片，包括半导体芯片接合的正面的管芯焊盘，与管芯焊盘间隔开的引线，将半导体芯片和引线彼此电连接的接合线，以及树脂 密封半导体芯片和接合线的封装。 接合线包括通过球接接合压接到半导体芯片的第一接合部，通过缝合接合而与接合引线接合的第二接合部，从第二接合部延伸到管芯焊盘而形成为与 引线的正面，以及从着陆部朝向半导体芯片向斜上方延伸的环。

公开(公告)号：US20070246841A1

公开(公告)日：2007-10-25

申请号：US11785380

申请日：2007-04-17

申请人： Saiki Yamamoto ,  Ikuya Nii ,  Hiroaki Ukawa

发明人： Saiki Yamamoto ,  Ikuya Nii ,  Hiroaki Ukawa

IPC分类号： H01L23/52

CPC分类号： H01L33/486 ,  B29C45/14639 ,  H01L23/49861 ,  H01L24/45 ,  H01L24/48 ,  H01L25/167 ,  H01L31/0203 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/48091 ,  H01L2224/48097 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48997 ,  H01L2224/73265 ,  H01L2224/85951 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

摘要： The present invention provides a semiconductor device capable of preventing an adhesive for die bonding from flowing to wire bonding area. The semiconductor device of the present invention comprises a semiconductor element 28 having a pair of electrodes, a housing 12 having the recess 14 for accommodating the semiconductor element 28, a first lead electrode 18 and the second lead electrode 20 which are exposed on the bottom of the recess 14, an adhesive layer 30 for die bonding between the semiconductor element 28 and the first lead electrode 18, and electrically conductive wires 32 for wire bonding between one electrode of the pair of electrodes of the semiconductor element and the first lead electrode 18 and between the other electrode and the second lead electrode 20, wherein the housing 12 has the wall 26 formed to extend across the bottom surface of the recess 14 so as to divide the surface of the first lead electrode 18 into a die bonding area 22 and a wire bonding area 24, and the first lead electrode 18 has the notch 36 which is formed by cutting off a portion of an edge of the first lead electrode 18 and located at least just below the wall 26, while the wall 26 and the bottom portion 40 of the housing 12 are connected to each other through the notch 36.

摘要翻译： 本发明提供一种半导体器件，其能够防止芯片接合用粘合剂流向引线接合区域。 本发明的半导体器件包括具有一对电极的半导体元件28，具有用于容纳半导体元件28的凹部14的壳体12，暴露在半导体元件28的底部的第一引线电极18和第二引线电极20 凹部14，用于半导体元件28和第一引线电极18之间的晶片接合的粘合层30，以及用于在半导体元件的一对电极的一个电极和第一引线电极18之间引线接合的导电线32，以及 在另一个电极和第二引线电极20之间，其中壳体12具有形成为延伸穿过凹部14的底表面的壁26，以便将第一引线电极18的表面分成芯片粘合区域22和 引线接合区域24，并且第一引线电极18具有切口36，其通过切除第一引线电极18的边缘的一部分而形成，并且位于 至少在壁26的下方，壳体12的壁26和底部40通过凹口36相互连接。

公开(公告)号：US07045905B2

公开(公告)日：2006-05-16

申请号：US10870912

申请日：2004-06-21

申请人： Shintaro Nakashima

发明人： Shintaro Nakashima

IPC分类号： H01L23/28

CPC分类号： H01L33/62 ,  H01L23/49562 ,  H01L23/49861 ,  H01L24/48 ,  H01L24/49 ,  H01L25/167 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/48091 ,  H01L2224/48097 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01057 ,  H01L2924/01063 ,  H01L2924/01066 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/07802 ,  H01L2924/12035 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2224/45099 ,  H01L2924/207 ,  H01L2224/48095

摘要： A molded package comprises at least a first metal member, a second metal member, and a third metal member. Each member includes an end portion inserted into a mold member where a recess is formed and another end portion protruding from an outer wall of the mold member. A portion of each main surface of the metal members is exposed from the mold member in the bottom of the recess. A portion of each main surface can be also divided into at least two bonding regions by a wall portion comprising part of the mold member. A semiconductor device of the present invention comprises the molded package, a semiconductor component, and an encapsulating member covering the semiconductor component, and has a high reliability.

公开(公告)号：US09357635B2

公开(公告)日：2016-05-31

申请号：US14981056

申请日：2015-12-28

申请人： STMicroelectronics, Inc. ,  STMicroelectronics S.r.l. ,  STMicroelectronics Asia Pacific Pte Ltd

发明人： Simon Dodd ,  Joe Scheffelin ,  Dana Gruenbacher ,  Roberto Brioschi ,  Teck Khim Neo ,  Dave Hunt ,  Faiz Sherman

IPC分类号： B41J2/14 ,  B41J2/175 ,  B05B1/14 ,  B32B38/04 ,  B32B38/14 ,  B32B37/00 ,  H05K1/02 ,  H05K1/09 ,  H05K3/30

CPC分类号： B41J2/1623 ,  B05B1/14 ,  B05B11/0054 ,  B05B15/40 ,  B41J2/14024 ,  B41J2/14145 ,  B41J2/1433 ,  B41J2/162 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L41/1132 ,  H01L2224/2732 ,  H01L2224/29011 ,  H01L2224/29013 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48096 ,  H01L2224/48097 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/19106 ,  H05K1/0272 ,  H05K1/09 ,  H05K1/181 ,  H05K3/305 ,  H05K2201/10083 ,  H05K2201/10515 ,  H05K2201/10545 ,  Y02P70/613 ,  Y10T156/1089 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/45099 ,  H01L2924/00

摘要： Embodiments are directed to microfluidic refill cartridges and methods of assembling same. The microfluidic refill cartridges include a microfluidic delivery member that includes a filter for filtering fluid passed therethrough. The filter may be configured to block particles above a threshold size to prevent blockage in the nozzles. For instances, particles having a dimension that is larger than the diameter of the nozzles can block or reduce fluid flow through the nozzle.

摘要翻译： 实施例涉及微流体补充盒及其组装方法。 微流体补充盒包括微流体递送构件，其包括用于过滤通过其中的流体的过滤器。 过滤器可以被配置为阻挡高于阈值尺寸的颗粒以防止喷嘴中的堵塞。 例如，具有大于喷嘴直径的尺寸的颗粒可阻挡或减少通过喷嘴的流体流动。

公开(公告)号：US20160107446A1

公开(公告)日：2016-04-21

申请号：US14981056

申请日：2015-12-28

申请人： STMicroelectronics, Inc. ,  STMicroelectronics S.r.l. ,  STMicroelectronics Asia Pacific Pte Ltd

发明人： Simon Dodd ,  Joe Scheffelin ,  Dana Gruenbacher ,  Roberto Brioschi ,  Teck Khim Neo ,  Dave Hunt ,  Faiz Sherman

IPC分类号： B41J2/16

CPC分类号： B41J2/1623 ,  B05B1/14 ,  B05B11/0054 ,  B05B15/40 ,  B41J2/14024 ,  B41J2/14145 ,  B41J2/1433 ,  B41J2/162 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L41/1132 ,  H01L2224/2732 ,  H01L2224/29011 ,  H01L2224/29013 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48096 ,  H01L2224/48097 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/19106 ,  H05K1/0272 ,  H05K1/09 ,  H05K1/181 ,  H05K3/305 ,  H05K2201/10083 ,  H05K2201/10515 ,  H05K2201/10545 ,  Y02P70/613 ,  Y10T156/1089 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/45099 ,  H01L2924/00

摘要： Embodiments are directed to microfluidic refill cartridges and methods of assembling same. The microfluidic refill cartridges include a microfluidic delivery member that includes a filter for filtering fluid passed therethrough. The filter may be configured to block particles above a threshold size to prevent blockage in the nozzles. For instances, particles having a dimension that is larger than the diameter of the nozzles can block or reduce fluid flow through the nozzle.

公开(公告)号：US20110186340A1

公开(公告)日：2011-08-04

申请号：US12991843

申请日：2010-07-21

申请人： Masafumi Kuramoto ,  Satoru Ogawa ,  Miki Niwa ,  Katsuaki Suganuma ,  Keun-Soo Kim

发明人： Masafumi Kuramoto ,  Satoru Ogawa ,  Miki Niwa ,  Katsuaki Suganuma ,  Keun-Soo Kim

IPC分类号： H05K1/18 ,  H01B1/22

CPC分类号： H01B1/22 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48097 ,  H01L2224/48247 ,  H01L2224/48997 ,  H01L2224/73265 ,  H01L2224/83439 ,  H01L2224/8384 ,  H01L2224/85205 ,  H01L2224/85951 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01058 ,  H01L2924/01063 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2924/00012 ,  H01L2224/48455

摘要： The object of the present invention is to provide a method for producing a conductive material that has a low electric resistivity and that is obtained using an inexpensive and stable conductive material composition. A conductive material having a low electric resistivity can be obtained by a method including the step of heating a conductive material composition that contains at least one of a full-cured or semi-cured thermosetting resin and a thermoplastic resin, as well as silver particles. Such a conductive material is a conductive material that includes fused silver particles, and thermosetting resin fine particles that have an average particle diameter of 0.1 μm to 10 μm both inclusive and are dispersed in the fused silver particles. Further, in such a conductive material is a conductive material that includes fused silver particles, and a thermoplastic resin welded among the fused silver particles.

摘要翻译： 本发明的目的是提供一种具有低电阻率且使用廉价且稳定的导电材料组合物获得的导电材料的制造方法。 可以通过包括加热含有全固化或半固化的热固性树脂和热塑性树脂中的至少一种的导电材料组合物以及银颗粒的方法来获得具有低电阻率的导电材料。 这种导电材料是包含熔融银颗粒的导电材料和平均粒径为0.1μm至10μm的热固性树脂细颗粒，并且分散在熔融银颗粒中。 此外，这种导电材料是包含熔融银颗粒的导电材料和在熔融银颗粒之间焊接的热塑性树脂。

公开(公告)号：US20100213502A1

公开(公告)日：2010-08-26

申请号：US12710593

申请日：2010-02-23

申请人： Tsutomu KASHIWAGI ,  Takahiro Hongo

发明人： Tsutomu KASHIWAGI ,  Takahiro Hongo

IPC分类号： H01L33/00

CPC分类号： H01L33/56 ,  C08G77/045 ,  C08G77/12 ,  C08G77/20 ,  C08G77/80 ,  C08L83/04 ,  H01L23/296 ,  H01L24/48 ,  H01L25/167 ,  H01L2224/05599 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48097 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48997 ,  H01L2224/85399 ,  H01L2224/85951 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/3025 ,  C08L83/00 ,  H01L2924/00 ,  H01L2224/48095 ,  H01L2224/48455 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012 ,  H01L2224/45099

摘要： An optical semiconductor device encapsulated with a silicone resin that suffers no discoloration of the lead and exhibits excellent thermal shock resistance. The optical semiconductor device includes an optical semiconductor element and a cured product of a silicone resin composition that encapsulates the optical semiconductor element, wherein the amount of (ΦSiO3/2) units (wherein Φ represents a phenyl group) within the cured product, determined by solid 29Si-DD/MAS analysis, is within a range from 0.13 mol/100 g to 0.37 mol/100 g.

摘要翻译： 封装有硅树脂的光学半导体器件，其不会引起铅的变色并且具有优异的耐热冲击性。 光半导体装置包括光半导体元件和封装光半导体元件的有机硅树脂组合物的固化物，固化物中的（ΦSiO3/ 2）单元（其中，Φ表示苯基）的量由 固体29Si-DD / MAS分析在0.13mol / 100g至0.37mol / 100g的范围内。

公开(公告)号：US20060175716A1

公开(公告)日：2006-08-10

申请号：US11386775

申请日：2006-03-23

申请人： Shintaro Nakashima

发明人： Shintaro Nakashima

IPC分类号： H01L33/00 ,  H01L31/0203 ,  H01L23/28

CPC分类号： H01L33/62 ,  H01L23/49562 ,  H01L23/49861 ,  H01L24/48 ,  H01L24/49 ,  H01L25/167 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/48091 ,  H01L2224/48097 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01057 ,  H01L2924/01063 ,  H01L2924/01066 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/07802 ,  H01L2924/12035 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2224/45099 ,  H01L2924/207 ,  H01L2224/48095

摘要： A molded package comprises at least a first metal member, a second metal member, and a third metal member. Each member includes an end portion inserted into a mold member where a recess is formed and another end portion protruding from an outer wall of the mold member. A portion of each main surface of the metal members is exposed from the mold member in the bottom of the recess. A portion of each main surface can be also divided into at least two bonding regions by a wall portion comprising part of the mold member. A semiconductor device of the present invention comprises the molded package, a semiconductor component, and an encapsulating member covering the semiconductor component, and has a high reliability.

摘要翻译： 模制包装包括至少第一金属构件，第二金属构件和第三金属构件。 每个构件包括插入到其中形成有凹部的模具构件中的端部和从模具构件的外壁突出的另一端部。 金属构件的每个主表面的一部分从凹部的底部中的模具构件露出。 每个主表面的一部分也可以通过包括模具部件的一部分的壁部分分成至少两个结合区域。 本发明的半导体器件包括模制封装，半导体元件和覆盖半导体元件的封装元件，并且具有高可靠性。