SUBSTRATE POLISHING APPARATUS
    5.
    发明申请

    公开(公告)号:US20190389027A1

    公开(公告)日:2019-12-26

    申请号:US16411141

    申请日:2019-05-14

    IPC分类号: B24B29/02 B24B41/047

    摘要: A substrate polishing apparatus including a stage configured to load a substrate, the stage having a flat surface, which is parallel to a first direction and a second direction, and on which the substrate is loaded, a pressing unit configured to exert a pressure on the substrate in a third direction, a rotary unit configured to revolve the pressing unit around a central axis parallel to the third direction, when viewed in a plan view, a plurality of polishing pads provided between the pressing unit and the substrate to be in contact with the substrate, and a nozzle part configured to supply a slurry onto the substrate. The polishing pads may be spaced apart from each other in a direction and may have a rectangular shape in the plan view.

    WINDOW MOLDING APPARATUS AND METHOD OF MOLDING WINDOW USING THE SAME

    公开(公告)号:US20180281251A1

    公开(公告)日:2018-10-04

    申请号:US15863085

    申请日:2018-01-05

    摘要: A window molding apparatus includes an upper mold, a lower mold under the upper mold, and a side mold under the upper mold and adjacent to at least one side of the lower mold. The upper mold includes a first surface, the lower mold includes a second surface having a portion facing the first surface, and the side mold includes a third surface. The first surface includes a first flat surface and a first bent surface extending from the first flat surface, the second surface includes a second flat surface facing the first flat surface and a second bent surface extending from the second flat surface, and the third surface includes a third bent surface contacting one end of the first bent surface and facing the second bent surface.