APPARATUS FOR TRANSFERRING SUBSTRATE
    2.
    发明申请
    APPARATUS FOR TRANSFERRING SUBSTRATE 有权
    用于传送基板的装置

    公开(公告)号:US20150188399A1

    公开(公告)日:2015-07-02

    申请号:US14505712

    申请日:2014-10-03

    Abstract: Disclosed is an apparatus for transferring substrates capable of stably transferring substrates by using magnetic levitation. The apparatus includes a substrate stage including a substrate loading unit, a first guide block disposed at a first end of the substrate stage and including a first magnet generator, a second guide block disposed at a second end of the substrate stage and including a second magnet generator, a first guide rail accommodating the first magnet generator and including a third magnet generator, and a second guide rail accommodating the second magnet generator and including a fourth magnet generator. The first magnet generator and the third magnet generator exert repulsive force on each other, and the second magnet generator and the fourth magnet generator exert repulsive force on each other.

    Abstract translation: 公开了一种通过磁悬浮转移能够稳定地转移衬底的衬底的装置。 该装置包括:衬底台,包括衬底装载单元,设置在衬底台的第一端处的第一引导块,并且包括第一磁体发生器,设置在衬底台的第二端处的第二引导块,并且包括第二磁体 发电机,容纳所述第一磁体发生器并包括第三磁体发生器的第一导轨和容纳所述第二磁体发生器并包括第四磁体发生器的第二导轨。 第一磁体发生器和第三磁体发生器相互施加排斥力,第二磁体发生器和第四磁体发生器相互施加排斥力。

    SPUTTERING DEVICE AND GAS SUPPLY PIPE FOR SPUTTERING DEVICE
    3.
    发明申请
    SPUTTERING DEVICE AND GAS SUPPLY PIPE FOR SPUTTERING DEVICE 有权
    用于喷射装置的喷射装置和气体供应管

    公开(公告)号:US20150200077A1

    公开(公告)日:2015-07-16

    申请号:US14536317

    申请日:2014-11-07

    CPC classification number: H01J37/3244 H01J37/34 H01J37/3405

    Abstract: A sputtering device and a gas supply pipe for a sputter device are disclosed. In one aspect, the sputtering device includes a chamber, a stage located in the chamber and configured to receive a substrate thereon, and a plurality of gas supply pipes arranged substantially parallel to each other. The gas supply pipes have a plurality of gas supply holes and the gas supply pipes are configured to supply gas into the chamber. The sputtering device further includes at least one exhaust pump placed at a side of the chamber, wherein the exhaust pump is substantially symmetrically arranged with respect to a center axis of the side of the chamber.

    Abstract translation: 公开了用于溅射装置的溅射装置和气体供应管。 在一个方面中,溅射装置包括一个室,一个位于室内并被构造成在其上容纳衬底的台阶,以及基本上彼此平行布置的多个气体供应管。 气体供给管具有多个气体供给孔,气体供给管构成为向室供给气体。 溅射装置还包括放置在腔室一侧的至少一个排气泵,其中排气泵相对于腔室侧面的中心轴线基本对称地布置。

    Apparatus for transferring substrate
    4.
    发明授权
    Apparatus for transferring substrate 有权
    用于转移衬底的装置

    公开(公告)号:US09246377B2

    公开(公告)日:2016-01-26

    申请号:US14505712

    申请日:2014-10-03

    Abstract: Disclosed is an apparatus for transferring substrates capable of stably transferring substrates by using magnetic levitation. The apparatus includes a substrate stage including a substrate loading unit, a first guide block disposed at a first end of the substrate stage and including a first magnet generator, a second guide block disposed at a second end of the substrate stage and including a second magnet generator, a first guide rail accommodating the first magnet generator and including a third magnet generator, and a second guide rail accommodating the second magnet generator and including a fourth magnet generator. The first magnet generator and the third magnet generator exert repulsive force on each other, and the second magnet generator and the fourth magnet generator exert repulsive force on each other.

    Abstract translation: 公开了一种通过磁悬浮转移能够稳定地转移衬底的衬底的装置。 该装置包括:衬底台,包括衬底装载单元,设置在衬底台的第一端处的第一引导块,并且包括第一磁体发生器,设置在衬底台的第二端处的第二引导块,并且包括第二磁体 发电机,容纳所述第一磁体发生器并包括第三磁体发生器的第一导轨和容纳所述第二磁体发生器并包括第四磁体发生器的第二导轨。 第一磁体发生器和第三磁体发生器相互施加排斥力,第二磁体发生器和第四磁体发生器相互施加排斥力。

    Sputtering device and gas supply pipe for sputtering device
    6.
    发明授权
    Sputtering device and gas supply pipe for sputtering device 有权
    用于溅射装置的溅射装置和气体供应管

    公开(公告)号:US09530622B2

    公开(公告)日:2016-12-27

    申请号:US14536317

    申请日:2014-11-07

    CPC classification number: H01J37/3244 H01J37/34 H01J37/3405

    Abstract: A sputtering device and a gas supply pipe for a sputter device are disclosed. In one aspect, the sputtering device includes a chamber, a stage located in the chamber and configured to receive a substrate thereon, and a plurality of gas supply pipes arranged substantially parallel to each other. The gas supply pipes have a plurality of gas supply holes and the gas supply pipes are configured to supply gas into the chamber. The sputtering device further includes at least one exhaust pump placed at a side of the chamber, wherein the exhaust pump is substantially symmetrically arranged with respect to a center axis of the side of the chamber.

    Abstract translation: 公开了用于溅射装置的溅射装置和气体供应管。 在一个方面中,溅射装置包括一个室,一个位于室内并被构造成在其上容纳衬底的台阶,以及基本上彼此平行布置的多个气体供应管。 气体供给管具有多个气体供给孔,气体供给管构成为向室供给气体。 溅射装置还包括放置在腔室一侧的至少一个排气泵,其中排气泵相对于腔室侧面的中心轴线基本对称地布置。

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