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    OPTICAL MEMBER AND DISPLAY DEVICE INCLUDING THE SAME
    2.
    发明申请
    OPTICAL MEMBER AND DISPLAY DEVICE INCLUDING THE SAME 审中-公开

    公开(公告)号：US20200057185A1

    公开(公告)日：2020-02-20

    申请号：US16661266

    申请日：2019-10-23

    Applicant: Samsung Display Co. Ltd.

    Inventor： Seong Yong Hwang ,  Jin Ho Park ,  Tae Gil Kang ,  Hyuk Hwan Kim ,  Sang Won Lee ,  Jae Jin Choi

    IPC: F21V8/00 ,  G02F1/1335 ,  G02B5/02

    Abstract: An optical member includes a light guide plate, a first low refractive layer, a wavelength conversion layer, and a passivation layer. The first low refractive layer is disposed on the light guide plate. A refractive index of the first low refractive layer is smaller than a refractive index of the light guide plate. The wavelength conversion layer is disposed on the first low refractive layer. The passivation layer is disposed on the wavelength conversion layer. The passivation layer covers a side surface of the wavelength conversion layer and a side surface of the first low refractive layer on at least one side.

    Display device and manufacturing method of the same
    3.
    发明授权
    Display device and manufacturing method of the same 有权

    公开(公告)号：US10971691B2

    公开(公告)日：2021-04-06

    申请号：US16231852

    申请日：2018-12-24

    Applicant: Samsung Display Co., Ltd.

    Inventor： Sang Chul Byun ,  Hyuk Hwan Kim ,  Seok Hyun Nam

    IPC: H01L33/58 ,  H01L51/50 ,  H01L51/56 ,  H01L25/075 ,  H01L27/32 ,  H01L51/52 ,  H01L33/50 ,  H01L33/62 ,  H01L33/38

    Abstract: A display device comprises: a light emitting array including a plurality of light emitting elements on a substrate and an insulating pattern disposed between the light emitting elements; a color conversion array including a plurality of sub-color conversion parts corresponding to the respective light emitting elements; and a printed circuit board having a first contact electrode connected to each of the light emitting elements, the printed circuit board driving the light emitting elements, wherein the plurality of sub-color conversion parts include first to third sub-color conversion parts that convert the light provided from corresponding light emitting elements into lights of first to third colors and emitting the converted lights, wherein each of the plurality of light emitting elements is electrically insulated from an adjacent light emitting elements.

    Light source module and display apparatus having the same
    5.
    发明授权
    Light source module and display apparatus having the same 有权
    光源模块及其显示装置

    公开(公告)号：US08604686B2

    公开(公告)日：2013-12-10

    申请号：US13633587

    申请日：2012-10-02

    Applicant: Samsung Display Co., Ltd.

    Inventor： Hyun Jin Kim ,  Seok Hyun Nam ,  Dong Chin Lee ,  Hyuk Hwan Kim ,  Min Jeong Wang

    IPC: H01L33/00 ,  G09G3/36

    CPC classification number: C09K11/592 ,  C09K11/595 ,  G02F1/133603

    Abstract: A light source module includes first and second light sources. The first light source includes a blue light-emitting body emitting blue light and a red fluorescent material disposed around the blue light-emitting body emitting red light by virtue of being excited by the blue light. The second light source is disposed adjacent to the first light source, and includes a green light-emitting body emitting green light. The blue and green light-emitting materials may include a light-emitting diode (LED) chip including substantially the same material. Accordingly, since a variation of light efficiency of the light source module with respect to temperature is small, a color feedback system may be omitted, and color reproducibility may be high.

    Abstract translation: 光源模块包括第一和第二光源。 第一光源包括发射蓝光的蓝色发光体和蓝色发光体周围红色荧光材料，蓝色发光体被蓝色光激发而发出红色光。 第二光源与第一光源相邻设置，并且包括发出绿光的绿色发光体。 蓝色和绿色发光材料可以包括基本上相同材料的发光二极管（LED）芯片。 因此，由于光源模块相对于温度的光效率的变化小，因此可以省略颜色反馈系统，并且颜色再现性可能高。

    Display device and manufacturing method of the same
    7.
    发明授权
    Display device and manufacturing method of the same 有权

    公开(公告)号：US10199593B2

    公开(公告)日：2019-02-05

    申请号：US15858151

    申请日：2017-12-29

    Applicant: SAMSUNG DISPLAY CO., LTD.

    Inventor： Sang Chul Byun ,  Hyuk Hwan Kim ,  Seok Hyun Nam

    IPC: H01L33/58 ,  H01L51/50 ,  H01L51/56 ,  H01L27/32 ,  H01L51/52 ,  H01L33/50 ,  H01L33/62 ,  H01L33/38

    Abstract: A display device comprises: a light emitting array including a plurality of light emitting elements on a substrate and an insulating pattern disposed between the light emitting elements; a color conversion array including a plurality of sub-color conversion parts corresponding to the respective light emitting elements; and a printed circuit board having a first contact electrode connected to each of the light emitting elements, the printed circuit board driving the light emitting elements, wherein the plurality of sub-color conversion parts include first to third sub-color conversion parts that convert the light provided from corresponding light emitting elements into lights of first to third colors and emitting the converted lights, wherein each of the plurality of light emitting elements is electrically insulated from an adjacent light emitting elements.

    Light source unit and backlight assembly having the same
    8.
    发明授权
    Light source unit and backlight assembly having the same 有权
    光源单元和背光组件具有相同的光源

    公开(公告)号：US09520386B2

    公开(公告)日：2016-12-13

    申请号：US14262438

    申请日：2014-04-25

    Applicant: Samsung Display Co., Ltd.

    Inventor： Si Joon Song ,  Hyuk Hwan Kim ,  Seok Hyun Nam ,  Byoung Dae Ye ,  Young Keun Lee

    IPC: F21S4/00 ,  F21V21/00 ,  H01L25/16 ,  F21V8/00

    CPC classification number: H01L25/167 ,  G02B6/0073 ,  G02B6/0083 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

    Abstract: A method of protecting an LED chip from damage by ESD and EMI when the LED chip is housed in a light-emitting diode(s) housing package (LED package) and the LED package is mounted on a printed circuit board is provided. The method comprises a step of not including an ESD and EMI suppressing Zener diode within the combination of the printed circuit board and the LED package and of providing within the combination of the printed circuit board and the LED package a first conductive member and a spaced apart second conductive member which are electrically connected to the LED chip and which have defined between them at least one insulative ESD and/or EMI suppressing region which breaks down in its insulative properties when subjected to voltages of absolute magnitudes greater than a predetermined threshold voltage.

    Abstract translation: 提供了当LED芯片被容纳在发光二极管壳体封装（LED封装）中并且LED封装安装在印刷电路板上时，保护LED芯片免受ESD和EMI损坏的方法。 该方法包括在印刷电路板和LED封装的组合中不包括ESD和EMI抑制齐纳二极管的步骤，并且在印刷电路板和LED封装的组合内提供第一导电构件和间隔开的步骤 第二导电构件，其电连接到LED芯片，并且在它们之间限定至少一个绝缘ESD和/或EMI抑制区域，当经受大于预定阈值电压的绝对值的电压时，其绝缘性能分解。

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