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公开(公告)号：US20210203815A1
公开(公告)日：2021-07-01
申请号：US17071366
申请日：2020-10-15
发明人： Sung Han KIM , Han KIM , Young Bok YOON , Seok Hwan KIM , Tae Ho YUN , Kyung Ho LEE , Jong Gil WON , Chul Kyu KIM , Jong Man KIM
摘要： An optical assembly includes: a camera module; at least one actuator configured to move the camera module; and a connection substrate having one end connected to the camera module such that at least a portion of the connection substrate is configured to move along with movement of the camera module. The connection substrate includes a rigidity reduction portion reducing rigidity of the connection substrate in a portion of the substrate in which distortion or warpage occurs according to the movement of the camera module.
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公开(公告)号：US20170330814A1
公开(公告)日：2017-11-16
申请号：US15667738
申请日：2017-08-03
发明人： Seung On KANG , Woo Sung HAN , Young Gwan KO , Chul Kyu KIM , Han KIM
IPC分类号： H01L23/31 , H01L23/498 , H01L21/56 , H01L23/522 , H01L21/48
CPC分类号： H01L23/3128 , H01L21/4857 , H01L21/56 , H01L23/16 , H01L23/295 , H01L23/36 , H01L23/3677 , H01L23/49816 , H01L23/5226 , H01L23/5389 , H01L23/552 , H01L24/19 , H01L24/20 , H01L24/96 , H01L24/97 , H01L2224/04105 , H01L2224/12105 , H01L2924/1431 , H01L2924/1432 , H01L2924/1433 , H01L2924/14335 , H01L2924/1436 , H01L2924/1438 , H01L2924/145 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/3025 , H01L2924/3511
摘要： An electronic component package includes a frame having a cavity, an electronic component disposed in the cavity of the frame, a first metal layer disposed on an inner wall of the cavity of the frame, an encapsulant encapsulating the electronic component, and a redistribution layer disposed below the frame and the electronic component.
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公开(公告)号：US20170004921A1
公开(公告)日：2017-01-05
申请号：US15200371
申请日：2016-07-01
发明人： Chul Kyu KIM , Han KIM , Kyung Hyun PARK , Ki Won CHANG , Jung Wook SEO , Jae Suk SUNG
CPC分类号： H02J50/10 , H01F27/22 , H01F38/14 , H01F2038/143
摘要： A coil device comprises a first coil, a second coil, a first conductor, and a first film. The second coil is disposed inside an inner boundary line of the first coil. The first conductor is disposed between the inner boundary line of the first coil and an outer boundary line of the second coil to dissipate heat. The first film is disposed on upper surfaces of the first coil, the second coil, and the first conductor.
摘要翻译： 线圈装置包括第一线圈，第二线圈，第一导体和第一薄膜。 第二线圈设置在第一线圈的内边界线的内侧。 第一导体设置在第一线圈的内边界线和第二线圈的外边界线之间以散热。 第一膜设置在第一线圈，第二线圈和第一导体的上表面上。
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公开(公告)号：US20200168591A1
公开(公告)日：2020-05-28
申请号：US16454907
申请日：2019-06-27
发明人： Chul Kyu KIM , Dae Hyun PARK , Jung Ho SHIM , Jae Hyun LIM , Mi Ja HAN , Sang Jong LEE , Han KIM
IPC分类号： H01L25/16 , H01L23/00 , H01L23/31 , H01L23/522 , H01L23/528
摘要： A semiconductor package includes a frame having a through-hole, and a first semiconductor chip disposed in the through-hole of the frame and having an active surface on which a connection pad is disposed, an inactive surface opposing the active surface, and a side surface connecting the active and inactive surfaces. A first encapsulant covers at least a portion of each of the inactive surface and the side surface of the first semiconductor chip. A connection structure has a first surface having disposed thereon the active surface of the first semiconductor chip, and includes a redistribution layer electrically connected to the connection pad of the first semiconductor chip. A first passive component is disposed on a second surface of the connection structure opposing the first surface, the first passive component being electrically connected to the redistribution layer and having a thickness greater than a thickness of the first semiconductor chip.
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公开(公告)号：US20160336249A1
公开(公告)日：2016-11-17
申请号：US15140775
申请日：2016-04-28
发明人： Seung On KANG , Woo Sung HAN , Young Gwan KO , Chul Kyu KIM , Han KIM
IPC分类号： H01L23/31 , H01L21/48 , H01L21/56 , H01L23/498 , H01L21/52
CPC分类号： H01L23/3128 , H01L21/4857 , H01L21/56 , H01L23/16 , H01L23/295 , H01L23/36 , H01L23/3677 , H01L23/49816 , H01L23/5226 , H01L23/5389 , H01L23/552 , H01L24/19 , H01L24/20 , H01L24/96 , H01L24/97 , H01L2224/04105 , H01L2224/12105 , H01L2924/1431 , H01L2924/1432 , H01L2924/1433 , H01L2924/14335 , H01L2924/1436 , H01L2924/1438 , H01L2924/145 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/3025 , H01L2924/3511
摘要： An electronic component package includes a frame having a cavity, an electronic component disposed in the cavity of the frame, a first metal layer disposed on an inner wall of the cavity of the frame, an encapsulant encapsulating the electronic component, and a redistribution layer disposed below the frame and the electronic component.
摘要翻译： 电子部件封装包括具有空腔的框架，设置在框架的空腔中的电子部件，设置在框架的空腔的内壁上的第一金属层，封装电子部件的密封剂和设置在电子部件的再分布层 在框架和电子部件下方。
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公开(公告)号：US20220170805A1
公开(公告)日：2022-06-02
申请号：US17217325
申请日：2021-03-30
发明人： Jong Man KIM , Se Yeon HWANG , Kyung Ho LEE , Seok Hwan KIM , Chul Kyu KIM , Han KIM
摘要： A force sensing device includes a support member including: a sensor support portion to which a force sensor is coupled on one surface of the support member; and a frame coupling portion extending from the sensor support portion. The force sensing device further includes: a frame disposed to face another surface of the support member, and disposed to be spaced apart from the support member; and at least one spacing member disposed between the support member and the frame, and spacing the support member apart from the frame. The force sensor is not disposed in the frame coupling portion. The spacing member is disposed between the frame coupling portion and the frame.
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公开(公告)号：US20220086315A1
公开(公告)日：2022-03-17
申请号：US17243676
申请日：2021-04-29
发明人： Tae Ho YUN , Sang Jong LEE , Kyung Ho LEE , Chul Kyu KIM , Han KIM
摘要： A camera module is provided. The camera module includes a lens module having at least one lens; a housing, configured to accommodate the lens module; and a driving unit, disposed between the lens module and the housing, and including a magnet portion and a coil portion, wherein the coil portion is disposed to surround the magnet portion.
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公开(公告)号：US20200168558A1
公开(公告)日：2020-05-28
申请号：US16433439
申请日：2019-06-06
发明人： Yoon Seok SEO , Dae Hyun PARK , Sang Jong LEE , Chul Kyu KIM , Jae Hyun LIM
IPC分类号： H01L23/552 , H01L23/538 , H01L23/28
摘要： A semiconductor package includes: a frame having a first surface and a second surface opposing each other, and including a through-hole and a wiring structure connected to the first surface and the second surface; a connection structure disposed on the first surface of the frame and including a redistribution layer; a semiconductor chip disposed in the through-hole and including connection pads connected to the redistribution layer; an encapsulant encapsulating the semiconductor chip and covering the second surface of the frame; and a plurality of electrical connection metal members disposed on the second surface of the frame and connected to the wiring structure. The wiring structure includes a shielding wiring structure surrounding the through-hole, and the plurality of electrical connection metal members include a plurality of grounding electrical connection metal members connected to the shielding wiring structure.
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