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公开(公告)号：US09867298B2
公开(公告)日：2018-01-09
申请号：US13960175
申请日：2013-08-06
发明人： Chang-Youn Hwang , Hak-Ju Kim , Yong-Geon Lee
IPC分类号： B05D5/12 , H05K5/02 , B32B9/04 , C23C14/00 , C23C14/08 , C23C14/10 , C23C14/30 , C23C28/00 , B32B17/06 , B32B27/40 , B32B15/04 , B32B18/00 , B32B3/00 , B32B27/06
CPC分类号： H05K5/02 , B32B3/00 , B32B9/04 , B32B15/04 , B32B17/06 , B32B18/00 , B32B27/06 , B32B27/40 , C23C14/0015 , C23C14/081 , C23C14/083 , C23C14/10 , C23C14/30 , C23C28/00 , C23C28/42 , C23C28/44
摘要： A case frame used in various devices and a method of manufacturing the case frame are provided. The method includes forming the case frame in a shape corresponding to a product to which the case frame is applied, forming a first painting layer with a color of a material applied to a surface of the formed case frame, depositing a transparent oxide deposition layer having a refractive index on an upper portion of the first painting layer, and forming a second painting layer on an upper portion of the transparent oxide deposition layer. Accordingly, the case frame can have an excellent texture by reproducing a brightness and a color anisotropy on the basis of a viewing angle by adding only a simple manufacturing process, thereby being able to improve quality of an electronic device in general and to promote a user's desire for purchasing the device.
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公开(公告)号：US20140268525A1
公开(公告)日：2014-09-18
申请号：US14210191
申请日：2014-03-13
发明人： Chang-Youn Hwang , Won-Tae Kim , Hak-Ju Kim , Jong-Chul Choi
CPC分类号： H05K5/0243 , B05D3/144 , B05D5/067 , B29C45/0053 , B29C2045/0079 , G06F1/1626 , H05K5/0017
摘要： A case for an electronic device includes an injection preform having a recess on at least one portion of a surface thereof, a deposition layer deposited on a surface of the injection preform, and a paint layer formed on the deposition layer. The deposition layer may directly contact a surface of the injection preform. A method of manufacturing a case includes injection-molding an injection preform having a recess on a surface thereof, forming a deposition layer directly contacting a surface of the injection preform, and forming a paint layer on the deposition layer.
摘要翻译： 电子设备的壳体包括在其表面的至少一部分上具有凹部的注射预成型件，沉积在注射成型体的表面上的沉积层和形成在沉积层上的涂料层。 沉积层可以直接接触注射预成型件的表面。 制造壳体的方法包括在其表面上注射成型具有凹部的注射成型体，形成与注射成型体的表面直接接触的沉积层，并在沉积层上形成涂料层。
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公开(公告)号：US09306268B2
公开(公告)日：2016-04-05
申请号：US14176580
申请日：2014-02-10
发明人： Chang-Youn Hwang , Hak-Ju Kim , Hee-Cheul Moon , Jong-Chul Choi
CPC分类号： H01Q1/243 , G06F1/1626 , G06F1/1656 , G06F1/1698 , H01Q1/36 , H01Q1/40 , H01Q1/42 , H01Q7/00 , H01Q13/18 , Y10T29/49155
摘要： An electronic device and a method for manufacturing an outer housing of the electronic device are provided. The electronic device includes an outer housing including a portion including a base including a non-conductive material and a plurality of islands formed on or above the base, wherein the plurality of islands include metallic materials, wherein the plurality of islands are spaced apart from each other, and wherein the plurality of islands form a two-dimensional (2D) pattern. The method includes injection-molding a base and forming a plurality of islands on or above the base, wherein the plurality of islands include metallic materials, and wherein the plurality of islands are spaced apart from each other to form a 2D pattern.
摘要翻译： 提供一种用于制造电子设备的外壳的电子设备和方法。 电子设备包括外壳，其包括包括非导电材料的基座和形成在基座上或上方的多个岛的部分，其中多个岛包括金属材料，其中多个岛与每个岛间隔开 其他，并且其中所述多个岛形成二维（2D）图案。 该方法包括：注射成型基底并在基底上或上方形成多个岛，其中多个岛包括金属材料，并且其中多个岛彼此间隔开以形成2D图案。
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公开(公告)号：US09699926B2
公开(公告)日：2017-07-04
申请号：US14210191
申请日：2014-03-13
发明人： Chang-Youn Hwang , Won-Tae Kim , Hak-Ju Kim , Jong-Chul Choi
CPC分类号： H05K5/0243 , B05D3/144 , B05D5/067 , B29C45/0053 , B29C2045/0079 , G06F1/1626 , H05K5/0017
摘要： A case for an electronic device includes an injection preform having a recess on at least one portion of a surface thereof, a deposition layer deposited on a surface of the injection preform, and a paint layer formed on the deposition layer. The deposition layer may directly contact a surface of the injection preform. A method of manufacturing a case includes injection-molding an injection preform having a recess on a surface thereof, forming a deposition layer directly contacting a surface of the injection preform, and forming a paint layer on the deposition layer.
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