公开(公告)号：US20250062211A1

公开(公告)日：2025-02-20

申请号：US18596324

申请日：2024-03-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： JAE-MIN JUNG ,  NARAE SHIN ,  JEONG-KYU HA

IPC: H01L23/498

Abstract: A driving circuit mounting film according to an embodiment includes: a base film that has a first surface and a second surface facing each other with a thickness therebetween; a driving circuit portion that is on the first surface of the base film; a plurality of first signal lines that are on a first side region on one side of the driving circuit portion along a first direction; and a plurality of second signal lines that are on a second side region on the opposite side of the driving circuit portion along the first direction. A first width of the first side region and a second width of the second side region are different from each other, and the first signal line includes a first portion on the first surface of the base film and a second portion on the second surface of the base film.

公开(公告)号：US20220068771A1

公开(公告)日：2022-03-03

申请号：US17230662

申请日：2021-04-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： MINKI KIM ,  DUCKGYU KIM ,  JAE-MIN JUNG ,  JEONG-KYU HA ,  SANG-UK HAN

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/00 ,  H01L23/367

Abstract: Disclosed is a semiconductor package comprising a semiconductor chip, a first chip pad on a bottom surface of the semiconductor chip and adjacent to a first lateral surface in a first direction of the semiconductor chip, the first lateral surface separated from the first chip pad from a plan view in a first direction, and a first lead frame coupled to the first chip pad. The first lead frame includes a first segment on a bottom surface of the first chip pad and extending from the first chip pad in a second direction opposite to the first direction and away from the first lateral surface of the semiconductor chip, and a second segment which connects to a first end of the first segment and then extends along the first direction to extend beyond the first lateral surface of the semiconductor chip after passing one side of the first chip pad, when viewed in the plan view.

公开(公告)号：US20190189551A1

公开(公告)日：2019-06-20

申请号：US16056651

申请日：2018-08-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： JEONG-KYU HA

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L23/49838 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/563 ,  H01L23/3185 ,  H01L23/49822 ,  H01L23/4985 ,  H01L24/16 ,  H01L2224/16227

Abstract: A semiconductor package includes a substrate having a top surface on which a semiconductor chip is mounted and a bottom surface opposite the top surface, an upper metal pattern including an upper connection region to which an external electrical device is connected and a chip connection region to which the semiconductor chip is connected, a lower metal pattern including a lower connection region to which other external electrical device is connected, and an intermediate metal pattern electrically connecting the upper and lower metal patterns. The upper metal pattern provides at least three groups of inner leads. The lower metal pattern provides at least three groups of outer leads. A module, such as that of a display device, may include the semiconductor package.

公开(公告)号：US20230176108A1

公开(公告)日：2023-06-08

申请号：US17816619

申请日：2022-08-01

Applicant: SAMSUNG ELECTRONICS CO.,LTD.

Inventor： SEUNGHYUN CHO ,  KWANJAI LEE ,  JAE-MIN JUNG ,  JEONG-KYU HA ,  SANG-UK HAN

IPC: G01R31/26 ,  G01R31/27 ,  H01L23/538 ,  H01L25/065 ,  H01L23/31

CPC classification number: G01R31/2644 ,  G01R31/27 ,  H01L23/5387 ,  H01L25/0657 ,  H01L23/3171 ,  H01L2225/06596

Abstract: A semiconductor package includes a base film having a first mount section, a first folding section, a second folding section, and a second mount section. A first semiconductor chip is disposed on the first mount section of the base film. A second semiconductor chip is disposed on the second mount section of the base film. Test pads are disposed on the first or second folding sections of the base film and is connected to each of the first and second semiconductor chips. Connection pads are disposed on the first or second mount sections of the base film and are connected to each of the first and second semiconductor chips. The first and second folding sections vertically overlap each other. The test pads are interposed between and buried by the first and second folding sections.

公开(公告)号：US20160162091A1

公开(公告)日：2016-06-09

申请号：US15040190

申请日：2016-02-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： JEONG-KYU HA ,  KWAN-JAi LEE ,  JAE-MIN JUNG ,  KYONG-SOON CHO ,  NA-RAE SHIN ,  KYOUNG-SUK YANG ,  PA-LAN LEE ,  SO-YOUNG LIM

IPC: G06F3/041 ,  G06F1/16

Abstract: A chip on film package includes a flexible base film having a first surface and a second surface opposite to each other that includes at least one through hole therein, a plurality of wirings disposed on the first surface and the second surface of the base film, respectively, that include a first lead and a second lead connected to each other through the at least one through hole, and a display panel driving chip and a touch panel sensor chip, each mounted on any one of the first surface and the second surface of the base film, wherein at least one of the display panel driving panel and the touch panel sensor chip is electrically connected to the first and second leads.

Abstract translation: 薄膜封装上的芯片包括柔性基膜，其具有彼此相对的第一表面和第二表面，所述第一表面和第二表面在其中包括至少一个通孔，分别设置在基膜的第一表面和第二表面上的多个布线 ，其包括通过所述至少一个通孔彼此连接的第一引线和第二引线，以及显示面板驱动芯片和触摸面板传感器芯片，每个安装在所述第一引线和所述第二表面中的任何一个上 其中所述显示面板驱动面板和所述触摸面板传感器芯片中的至少一个电连接到所述第一和第二引线。

公开(公告)号：US20140300849A1

公开(公告)日：2014-10-09

申请号：US14202167

申请日：2014-03-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： JAE-MIN JUNG ,  KYONG-SOON CHO ,  JEONG-KYU HA

IPC: H01L23/522 ,  H01L27/32 ,  G02F1/1345

CPC classification number: H01L27/3276 ,  G02F1/13452 ,  H01L23/4985 ,  H01L2224/16225 ,  H01L2924/12044 ,  H01L2924/00

Abstract: Provided are a chip-on-film (COF) package and a device assembly including the same. The device assembly includes a COF package including a film substrate on which a plurality of film-through wires are formed. The device assembly includes a panel unit including a panel substrate on which a plurality of panel-through wires are formed. The panel unit is disposed on the COF package. One end of the panel unit is electrically connected to a first end of the COF package. The device assembly includes a control unit disposed below the panel unit. One end of the control unit is electrically connected to a second end of the COF package.

Abstract translation: 提供了片上胶片（COF）包装和包括其的装置组件。 装置组件包括COF封装，其包括其上形成有多个胶片通孔的膜基板。 所述装置组件包括面板单元，所述面板单元包括其上形成有多个通孔导线的面板基板。 面板单元设置在COF包装上。 面板单元的一端电连接到COF封装的第一端。 设备组件包括设置在面板单元下方的控制单元。 控制单元的一端电连接到COF封装的第二端。