THREE-DIMENSIONAL STORAGE DEVICE USING WAFER-TO-WAFER BONDING

    公开(公告)号:US20230038363A1

    公开(公告)日:2023-02-09

    申请号:US17848844

    申请日:2022-06-24

    Abstract: Provided is a three-dimensional storage device using wafer-to-wafer bonding. A storage device includes a first chip including a first substrate and a peripheral circuit region including a first control logic circuit configured to control operation modes of the non-volatile memory device and a second chip including a second substrate and three-dimensional arrays of non-volatile memory cells. The second chip may be vertically stacked on the first chip so that a first surface of the first substrate faces a first surface of the second substrate, and a second control logic circuit is configured to control operation conditions of the non-volatile memory device and is arranged on a second surface of the second substrate, the second surface of the second substrate being opposite to the first surface of the second substrate of the second chip.

    SEMICONDUCTOR DEVICE
    3.
    发明公开

    公开(公告)号:US20230189528A1

    公开(公告)日:2023-06-15

    申请号:US17896546

    申请日:2022-08-26

    CPC classification number: H01L27/11573 H01L27/1157 H01L27/11582

    Abstract: A semiconductor device may include a plurality of gate electrode layers stacked in a first direction perpendicular to an upper surface of a substrate, a plurality of channel structures penetrating through the plurality of gate electrode layers and extending in the first direction, a plurality of first isolation structures extending in a second direction parallel to the upper surface of the substrate and dividing the plurality of gate electrode layers into a plurality of blocks, and a plurality of second isolation structures extending in the second direction within each of the plurality of blocks. Each of the plurality of first isolation structures may include only a first vertical insulating layer, and at least one of the plurality of second isolation structures may include a second vertical insulating layer and a conductive layer.

    THREE-DIMENSIONAL (3D) STORAGE DEVICE USING WAFER-TO-WAFER BONDING

    公开(公告)号:US20230060469A1

    公开(公告)日:2023-03-02

    申请号:US17854287

    申请日:2022-06-30

    Abstract: A three-dimensional (3D) storage device using wafer-to-wafer bonding is disclosed. In the storage device, a first chip including a peripheral circuit region including a first control logic circuit configured to control operation modes of a nonvolatile memory (NVM) device is wafer-bonded with a second chip including 3D arrays of NVM cells, and a memory controller includes a third chip including a control circuit region. The control circuit region of the third chip includes a second control logic circuit associated with operation conditions of the NVM device, and the second control logic circuit includes a serializer/deserializer (SERDES) interface configured to share random access memory (RAM) in the memory controller and transmit and receive data to and from the NVM device.

    STORAGE DEVICE AND METHOD OF OPERATING STORAGE DEVICE

    公开(公告)号:US20230207017A1

    公开(公告)日:2023-06-29

    申请号:US17810894

    申请日:2022-07-06

    CPC classification number: G11C16/102 G11C16/28 G11C16/3495 G11C16/08 G11C16/32

    Abstract: A storage device includes a nonvolatile memory device and a storage controller to control operation of the nonvolatile memory device. The storage controller assigns a program operation associated with data to be programmed, to one of a first program operation or a second program operation, controls the nonvolatile memory device to perform the first program operation on first memory blocks and to perform the second program operation on at least one second memory block, and controls the nonvolatile memory to select one of the first program operation on a third memory block in an erase state or the second program operation on the second memory block, and to perform the selected program operation after the first program operation on the first memory blocks is completed.

    MEMORY SYSTEM FOR PERFORMING RECOVERY OPERATION, MEMORY DEVICE, AND METHOD OF OPERATING THE SAME

    公开(公告)号:US20230153202A1

    公开(公告)日:2023-05-18

    申请号:US17965091

    申请日:2022-10-13

    CPC classification number: G06F11/1068 G06F11/076 G06F11/0793

    Abstract: A method of operating a memory system that comprises a memory device including a plurality of memory blocks and a memory controller, includes detecting a first memory block having a degradation count greater than or equal to a first reference value by the memory controller. A first command for the first memory block is transmitted to the memory device by the memory controller. A first voltage is applied to all of a plurality of word lines connected to the first memory block and a second voltage to a bit line connected to the first memory block in response to the first command by the memory device. The first voltage is greater than a voltage applied to turn on memory cells connected to all of the plurality of word lines. The second voltage is greater than a voltage applied to the bit line during program, read or erase operations.

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