Abstract:
A non-volatile memory device includes a memory cell array including a plurality of cell strings, each of the plurality of cell strings includes a gate-induced drain leakage (GIDL) transistor and a memory cell group, and a control logic to apply a voltage to each of the plurality of cell strings. The control logic performs a first erase operation of erasing the memory cell groups of each of the plurality of cell strings, a first verification operation of detecting erase results of the memory cell groups of each of the plurality of cell strings, and a program operation of programming the GIDL transistors of some of the plurality of cell strings.
Abstract:
Disclosed is a memory system including a memory device and a memory controller. The memory device includes a package of a first memory chip configured to receive input/output signals through first input/output pads and a second memory chip having second input/output pads connected to the first input/output pads by a mapping connection. The memory controller configured to provide the input/output signals to the memory device. The second memory chip is configured to receive input/output signals different from the input/output signals provided by the memory controller to the first memory chip due to the mapping connection. The first and second memory chips are configured to selectively ignore the input/output signals provided by the memory controller based on the mapping connection.
Abstract:
A non-volatile memory device comprises a memory cell region including a first metal pad, a peripheral circuit region including a second metal pad and vertically connected to the memory cell region by the first metal pad and the second metal pad, a memory cell array in the memory cell region including a plurality of memory cells, each of the memory cells being connected to a plurality of word lines in the memory cell region and a plurality of bit lines in the memory cell region, and a control logic circuit in the peripheral circuit region configured to control voltages to be applied to the plurality of word lines and the plurality of bit lines.
Abstract:
A non-volatile memory device includes a memory cell array including a plurality of cell strings, each of the plurality of cell strings includes a gate-induced drain leakage (GIDL) transistor and a memory cell group, and a control logic to apply a voltage to each of the plurality of cell strings. The control logic performs a first erase operation of erasing the memory cell groups of each of the plurality of cell strings, a first verification operation of detecting erase results of the memory cell groups of each of the plurality of cell strings, and a program operation of programming the GIDL transistors of some of the plurality of cell strings.
Abstract:
A method for programming a non-volatile memory device is provided. The method comprises applying a program word line voltage with a voltage level changed stepwise to a selected word line connected to a plurality of memory cells, and applying a program bit line voltage to a first bit line of a plurality of bit lines connected to a plurality of first memory cells, while the program word line voltage is applied to the selected word line. The program bit line voltage transitions from a first voltage level to one of a program inhibit voltage level, a program voltage level, and a second voltage level. The first and second voltage levels are between the program inhibit voltage level and program voltage level.
Abstract:
Disclosed are a program method and a nonvolatile memory device. The method includes receiving program data to be programmed in memory cells; reading the memory cells to judge an erase state and at least one program state; performing a state read operation in which the at least one program state is read using a plurality of state read voltages; and programming the program data in the memory cells using a plurality of verification voltages having different levels according to a result of the state read operation. Also disclosed are methods using a plurality of verification voltages selected based on factors which may affect a threshold voltage shift or other characteristic representing the data of a memory cell after programming.
Abstract:
A nonvolatile memory device includes a semiconductor substrate including a page buffer region, a memory cell array, bitlines, first vertical conduction paths, and second vertical conduction paths. The memory cell array is formed in a memory cell region above the semiconductor substrate and includes memory cells. The bitlines extend in a column direction above the memory cell array. Each of bitlines is cut into each of first bitline segments and each of second bitline segments. The first vertical conduction paths extend in a vertical direction and penetrate a column-directional central region of the memory cell region. The first vertical conduction paths connect the first bitline segments and the page buffer region. The second vertical conduction paths extend in the vertical direction and penetrate the column-directional central region. The second vertical conduction paths connect the second bitline segments and the page buffer region.
Abstract:
The present disclosure relates to a 5G or pre-5G communication system that will be provided to support a higher data transmission rate beyond a 4G communication system such as LTE. Disclosed is an interference measurement method and device in a flexible duplex system. The method comprises the steps of: determining whether uplink (UL) grant for allocating UL transmission has been received from a base station in a first subframe; when the UL grant has not been received, measuring inter-cell interference for an uplink interference measurement resource (IMR) in at least one second subframe determined by the first subframe; and when the UL grant has been received, measuring inter-cell interference for the uplink interference measurement resource (IMR) in at least one third subframe before a subframe that is indicated by the UL grant.