公开(公告)号：US11245951B2

公开(公告)日：2022-02-08

申请号：US16959340

申请日：2018-12-19

Applicant: SAMSUNG ELECTRONICS CO., LTD

Inventor： Sungmin Lim ,  Changwon Choi ,  Sumin Kim ,  Younghyun Kim ,  Youngin Park ,  Hanjin Park ,  Seockyoung Shim ,  Taehoon Lee

IPC: G06F3/0483 ,  H04N21/431 ,  G06F3/0482 ,  H04N21/4782

Abstract: The disclosure provides a display device and a content providing method thereof. The content providing method of the display device includes: displaying a list including a plurality of web pages pre-selected by a user; and displaying, in case that a user command for selecting one of the plurality of web pages is input, a reconstructed content obtained by reconstructing the selected web page based on a type of the selected web page.

公开(公告)号：US20200310738A1

公开(公告)日：2020-10-01

申请号：US16588128

申请日：2019-09-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Taehoon Lee

IPC: G06F3/14 ,  G09G5/38 ,  G06F3/0484

Abstract: A display apparatus and a controlling method thereof are provided. The display apparatus includes: a display; a communicator including circuitry configured to communicate with an electronic apparatus; a processor configured to execute instructions to: identify whether blank regions are included in an image for mirroring based on the image for mirroring being received from the electronic apparatus through the communicator, and control to display, on the display, an image of a remaining region excluding the blank regions in the received image based on the blank regions being identified in the received image in a state in which the display is oriented in a predetermined direction.

公开(公告)号：US20240404936A1

公开(公告)日：2024-12-05

申请号：US18417921

申请日：2024-01-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Gyujin Choi ,  Dahee Kim ,  Jae-Ean Lee ,  Taehoon Lee

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/48 ,  H01L23/528 ,  H01L25/065

Abstract: A stacked structure includes a lower substrate and a first semiconductor chip stacked on an upper surface of the lower substrate, the lower substrate includes a lower conductor pattern disposed on the upper surface of the lower substrate, the first semiconductor chip may have first and second surfaces facing each other, the second surface of the first semiconductor chip may face the upper surface of the lower substrate, and the first semiconductor chip may include a first conductor pattern disposed on the second surface. The first conductor pattern may be aligned with the lower conductor pattern in a first direction perpendicular to the upper surface of the lower substrate, and the first conductor pattern may be spaced apart from the lower conductor pattern in the first direction.

公开(公告)号：US11054916B2

公开(公告)日：2021-07-06

申请号：US16588411

申请日：2019-09-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Taehoon Lee

IPC: G09G5/00 ,  G06F3/03 ,  G02F1/1333 ,  G06T3/60 ,  G06F1/16

Abstract: A display apparatus and a controlling method thereof are provided. The display apparatus includes: a display panel; at least one sensor configured to detect a distance to an external object; a driver configured to rotate the display panel while a front surface of the display panel maintains a facing direction; and a processor configured to: based on an event for rotating the display panel occurring, control the driver to rotate the display panel, and based on detecting, via the at least one sensor, the object within a predetermined distance in a rotating direction of the display panel while the display panel rotates, control the driver to stop rotating the display panel, wherein the predetermined distance has different values according to a rotating angle by which the display panel has rotated from a position of the display panel before the event occurred.

公开(公告)号：US20200344517A1

公开(公告)日：2020-10-29

申请号：US16961129

申请日：2018-12-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngin Park ,  Sungmin Lim ,  Sumin Kim ,  Younghyun Kim ,  Hanjin Park ,  Seockyoung Shim ,  Taehoon Lee ,  Changwon Choi

IPC: H04N21/431 ,  H04N21/475 ,  H04N21/41

Abstract: The present disclosure relates to an electronic device and a control method thereof. The electronic device according to the present disclosure comprises: a display; a communication unit; and a processor configured to receive information on an idle screen generated on the basis of category information on a plurality of contents selected by a user through the communication unit, and to control the display to display the idle screen on the basis of information on the received idle screen, wherein the idle screen includes a plurality of elements corresponding to a plurality of categories in which a plurality of contents are classified.

公开(公告)号：US10719008B2

公开(公告)日：2020-07-21

申请号：US15625049

申请日：2017-06-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hwanseok Seo ,  SeongSue Kim ,  Taehoon Lee ,  Roman Chalykh

IPC: G03F1/22 ,  G03F1/24 ,  G03F1/26 ,  G03F1/52

Abstract: A phase-shift mask for extreme ultraviolet (EUV) lithography may be provided. The phase-shift mask may include a substrate, a reflection layer on the substrate, and phase-shift patterns including at least one metal nitride on the reflection layer. The at least one metal nitride may include at least one of TaN, TiN, ZrN, HfN, CrN, VN, NbN, MoN, WN, AlN, GaN, ScN, and YN.

公开(公告)号：US20200209732A1

公开(公告)日：2020-07-02

申请号：US16814580

申请日：2020-03-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hwanseok SEO ,  SeongSue Kim ,  Taehoon Lee ,  Roman Chalykh

IPC: G03F1/26 ,  G03F1/22 ,  G03F1/52 ,  G03F1/24

Abstract: A phase-shift mask for extreme ultraviolet (EUV) lithography may be provided. The phase-shift mask may include a substrate, a reflection layer on the substrate, and phase-shift patterns including at least one metal nitride on the reflection layer. The at least one metal nitride may include at least one of TaN, TiN, ZrN, HfN, CrN, VN, NbN, MoN, WN, AlN, GaN, ScN, and YN.

公开(公告)号：USD852791S1

公开(公告)日：2019-07-02

申请号：US29625274

申请日：2017-11-08

Applicant: Samsung Electronics Co., Ltd.

Designer： Jungjoo Sohn ,  Kyungho Jeong ,  Taehoon Lee

公开(公告)号：US20240387486A1

公开(公告)日：2024-11-21

申请号：US18584905

申请日：2024-02-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dahee Kim ,  Hongwon Kim ,  Jae-Ean Lee ,  Taehoon Lee ,  Gyujin Choi

IPC: H01L25/16 ,  H01L23/00 ,  H01L23/31 ,  H01L23/48 ,  H01L23/498

Abstract: An example semiconductor package includes a substrate, a first semiconductor chip mounted on the substrate, a mold layer on the substrate to cover the first semiconductor chip, and outer terminals positioned below the substrate. The substrate includes a first interconnection layer, a second interconnection layer on the first interconnection layer, a passive device mounted on a bottom surface of the second interconnection layer, and a connection member at a side of the passive device and between the first interconnection layer and the second interconnection layer to connect the first interconnection layer to the second interconnection layer. The outer terminals are coupled to a bottom surface of the first interconnection layer, the passive device includes a first pad on a top surface of the passive device, and an interconnection pattern of the second interconnection layer contacts the first pad.

公开(公告)号：US20240347487A1

公开(公告)日：2024-10-17

申请号：US18368640

申请日：2023-09-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jaeean Lee ,  Dahee Kim ,  Taehoon Lee ,  Gyujin Choi

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/498

CPC classification number: H01L24/05 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/49833 ,  H01L24/06 ,  H01L24/08 ,  H01L23/49838 ,  H01L24/03 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/03462 ,  H01L2224/05548 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/0601 ,  H01L2224/08225 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48225 ,  H01L2224/73265 ,  H01L2924/1815

Abstract: An upper redistribution wiring layer of a semiconductor package includes a protective layer provided on at least one upper insulating layer and having an opening that exposes at least a portion of an uppermost redistribution wiring among second redistribution wirings, and a bonding pad provided on the uppermost redistribution wiring through the opening. The bonding pad includes a first plating pattern formed on the uppermost redistribution wiring, the first plating pattern including a via pattern provided in the opening and a pad pattern formed on the via pattern to be exposed from the opening, a second plating pattern on the second plating pattern, and a third plating pattern on the second plating pattern.