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    SEMICONDUCTOR PACKAGE
    1.
    发明申请
    SEMICONDUCTOR PACKAGE 有权

    公开(公告)号：US20220068829A1

    公开(公告)日：2022-03-03

    申请号：US17199703

    申请日：2021-03-12

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Sang Cheon PARK ,  Young Min LEE ,  Dae-Woo KIM ,  Hyuek Jae LEE

    IPC: H01L23/544 ,  H01L23/538 ,  H01L25/065

    Abstract: A semiconductor package includes a substrate including a first semiconductor chip including a first wiring structure, a first bonding pad, and a first alignment key on the first wiring structure to be spaced apart in a first direction, a second semiconductor chip including a second wiring structure, a second bonding pad on the second wiring structure and connected to the first bonding pad, and a second alignment key on the second wiring structure to be spaced apart from the second bonding pad and not overlapping the first alignment key in the second direction, the first wiring structure including a first wiring pattern connected to the first bonding pad and not overlapping the first and second alignment keys in the second direction, and the second wiring structure including a second wiring pattern connected to the second bonding pad and not overlapping the first and second alignment keys in the second direction.

    STORAGE CONTROLLER, STORAGE SYSTEM AND OPERATING METHODS THEREOF
    2.
    发明申请
    STORAGE CONTROLLER, STORAGE SYSTEM AND OPERATING METHODS THEREOF 有权

    公开(公告)号：US20220114117A1

    公开(公告)日：2022-04-14

    申请号：US17331123

    申请日：2021-05-26

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Young Min LEE ,  Soong-Mann SHIN ,  Kyung Phil YOO

    IPC: G06F13/16 ,  G06F1/26

    Abstract: A storage system is provided. The storage system includes a storage device including a plurality of nonvolatile memories configured to transmit storage throughput information, and a host device configured to change connection configurations for the storage device based on the storage throughput information, wherein the host device changes the connection configurations by changing configurations for transmitter and receiver paths between the storage device and the host device independently.

    SEMICONDUCTOR PACKAGE
    5.
    发明公开
    SEMICONDUCTOR PACKAGE 审中-公开

    公开(公告)号：US20230395523A1

    公开(公告)日：2023-12-07

    申请号：US18234914

    申请日：2023-08-17

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Sang Cheon PARK ,  Young Min LEE ,  Dae-Woo KIM ,  Hyuek Jae LEE

    IPC: H01L23/544 ,  H01L25/065 ,  H01L23/538

    CPC classification number: H01L23/544 ,  H01L25/0657 ,  H01L23/5386 ,  H01L23/5385

    Abstract: A semiconductor package includes a substrate including a first semiconductor chip including a first wiring structure, a first bonding pad, and a first alignment key on the first wiring structure to be spaced apart in a first direction, a second semiconductor chip including a second wiring structure, a second bonding pad on the second wiring structure and connected to the first bonding pad, and a second alignment key on the second wiring structure to be spaced apart from the second bonding pad and not overlapping the first alignment key in the second direction, the first wiring structure including a first wiring pattern connected to the first bonding pad and not overlapping the first and second alignment keys in the second direction, and the second wiring structure including a second wiring pattern connected to the second bonding pad and not overlapping the first and second alignment keys in the second direction.

    ELECTRONIC DEVICE INCLUDING WIRELESS COMMUNICATION SYSTEM, FOR PROCESSING TRANSMISSION SIGNAL OR RECEPTION SIGNAL
    6.
    发明申请
    ELECTRONIC DEVICE INCLUDING WIRELESS COMMUNICATION SYSTEM, FOR PROCESSING TRANSMISSION SIGNAL OR RECEPTION SIGNAL 审中-公开

    公开(公告)号：US20200235774A1

    公开(公告)日：2020-07-23

    申请号：US16642710

    申请日：2018-09-05

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Young Min LEE

    IPC: H04B1/48 ,  H03F3/68 ,  H03F3/20

    Abstract: An electronic device is disclosed. The electronic device may include an antenna for transmitting and receiving a signal in an RF frequency band, and an RF circuit for processing the signal in the RF frequency band. The RF circuit may include an Rx path for transferring a first signal received through the antenna, a Tx path for transferring a second signal output from an amplifier to the antenna, and a coupler for transferring at least a part of the second signal obtained in the Tx path to the Rx path. In addition, various embodiments understood from the specification are possible.

    ELECTRONIC DEVICE INCLUDING WIRELESS COMMUNICATION SYSTEM, FOR PROCESSING TRANSMISSION SIGNAL OR RECEPTION SIGNAL
    8.
    发明申请
    ELECTRONIC DEVICE INCLUDING WIRELESS COMMUNICATION SYSTEM, FOR PROCESSING TRANSMISSION SIGNAL OR RECEPTION SIGNAL 有权

    公开(公告)号：US20220140857A1

    公开(公告)日：2022-05-05

    申请号：US17574999

    申请日：2022-01-13

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Young Min LEE

    IPC: H04B1/48 ,  H03F3/68 ,  H03F3/20

    Abstract: An electronic device is provided. The electronic device may include a plurality of antennas configured to transmit and receive a signal in a radio frequency (RF) frequency band; and an RF circuit configured to process the signal in the RF frequency band. The RF circuit includes a reception (Rx) path configured to transfer a first signal received through the plurality of antennas, a transmission (Tx) path configured to transfer a second signal to the plurality of antennas, and a coupler configured to transfer at least a part of the second signal obtained in the Tx path to the Rx path. The Tx path includes a power divider configured to distribute power to at least one antenna among the plurality of antennas, and the coupler is electrically connected to an input terminal of the power divider to be disposed before the power divider.

    LIQUID CRYSTAL DISPLAY AND LED MODULE THEREOF
    10.
    发明申请
    LIQUID CRYSTAL DISPLAY AND LED MODULE THEREOF 有权
    液晶显示器和LED模组

    公开(公告)号：US20130100373A1

    公开(公告)日：2013-04-25

    申请号：US13718581

    申请日：2012-12-18

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Suk Ju CHOI ,  Kun Ho CHO ,  Yong Hun KWON ,  Kye Hoon LEE ,  Gil Tae HUR ,  Young Min LEE

    IPC: F21V8/00

    CPC classification number: G02B6/0083 ,  G02B6/0031 ,  G02B6/0068 ,  G02B6/0073 ,  G02B6/0085 ,  G02B6/009 ,  G02F1/133308 ,  G02F2001/133314 ,  G02F2001/133317 ,  G02F2001/13332 ,  G02F2201/46

    Abstract: An apparatus includes a chassis assembly; a liquid crystal display panel; a light guide plate configured to guide light to the liquid crystal display panel; a light emitting diode (LED) module including a printed circuit board (PCB), a plurality of LED packages which are mounted on the PCB and emit light to a lateral side of the light guide plate, and a connector connected to the PCB such that the connector is located behind the light guide plate; and a white strip member disposed between the PCB of the LED module and the light guide plate. An edge portion of a bottom surface of the light guide plate is supported by the PCB.

    Abstract translation: 一种装置包括底盘组件; 液晶显示面板; 配置为将光引导到液晶显示面板的导光板; 包括印刷电路板（PCB）的发光二极管（LED）模块，安装在PCB上并向导光板的侧面发光的多个LED封装以及连接到PCB的连接器，使得 连接器位于导光板的后面; 以及布置在LED模块的PCB和导光板之间的白色条状构件。 导光板底面的边缘部分由PCB支撑。

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