公开(公告)号：US09652143B2

公开(公告)日：2017-05-16

申请号：US14568288

申请日：2014-12-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngho Kim ,  Hoshin Lee ,  Sangtae Ji

IPC: G06F3/0488 ,  G06F3/0485 ,  G06F3/0481

CPC classification number: G06F3/0488 ,  G06F3/0481 ,  G06F3/0485 ,  G06F2203/04806 ,  G06F2203/04808

Abstract: An electronic device and method for the same are disclosed, including a touch device for detecting a touch input, a display unit for displaying screen information, a storage unit for storing a predetermined number of individual contacts to the touch device, and a controller. The controller compares a number of individual contacts with the predetermined number of individual contacts in response to detecting a touch input via the touch device, executes a scrolling of the displayed screen information according to a movement of the touch input when the number of individual contacts of the touch input matches the predetermined number, and when the number of individual contacts of the touch input does not match the predetermined number, executes a gesture-based zoom according to a change in area defined by the individual contacts of the touch input.

公开(公告)号：US12136581B2

公开(公告)日：2024-11-05

申请号：US18506742

申请日：2023-11-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngho Kim ,  Hwanpil Park

IPC: H01L23/34 ,  H01L23/00 ,  H01L23/367 ,  H01L23/373 ,  H01L23/40 ,  H01L23/492 ,  H01L25/10 ,  H01L23/498 ,  H01L23/538

Abstract: A method of fabricating a semiconductor package structure is provided. The structure is configured to include a base substrate, a die placed on the base substrate, the die including a semiconductor device, a solder bump placed on one surface of the die to exhaust heat generated in the die to an outside; and a solder ball placed on other surface of the die facing the one surface to transmit a signal, which is produced by the semiconductor device of the die, to an external device.

公开(公告)号：US11842941B2

公开(公告)日：2023-12-12

申请号：US17700956

申请日：2022-03-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngho Kim ,  Hwanpil Park

IPC: H01L23/34 ,  H01L23/367 ,  H01L23/373 ,  H01L23/40 ,  H01L23/492 ,  H01L23/00 ,  H01L25/10 ,  H01L23/498 ,  H01L23/538

CPC classification number: H01L23/367 ,  H01L23/3677 ,  H01L23/3736 ,  H01L23/3738 ,  H01L23/40 ,  H01L23/492 ,  H01L24/19 ,  H01L25/105 ,  H01L23/49816 ,  H01L23/5389 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/19 ,  H01L2224/73259 ,  H01L2924/15153

Abstract: A method of fabricating a semiconductor package structure is provided. The structure is configured to include a base substrate, a die placed on the base substrate, the die including a semiconductor device, a solder bump placed on one surface of the die to exhaust heat generated in the die to an outside; and a solder ball placed on other surface of the die facing the one surface to transmit a signal, which is produced by the semiconductor device of the die, to an external device.

公开(公告)号：US11315851B2

公开(公告)日：2022-04-26

申请号：US17078422

申请日：2020-10-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngho Kim ,  Hwanpil Park

IPC: H01L23/34 ,  H01L23/52 ,  H01L23/367 ,  H01L23/373 ,  H01L23/40 ,  H01L23/00 ,  H01L23/492 ,  H01L25/10 ,  H01L23/498 ,  H01L23/538

Abstract: A method of fabricating a semiconductor package structure is provided. The structure is configured to include a base substrate, a die placed on the base substrate, the die including a semiconductor device, a solder bump placed on one surface of the die to exhaust heat generated in the die to an outside; and a solder ball placed on other surface of the die facing the one surface to transmit a signal, which is produced by the semiconductor device of the die, to an external device.

公开(公告)号：US20230215698A1

公开(公告)日：2023-07-06

申请号：US17865675

申请日：2022-07-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Inhwa Baek ,  Donggap Shin ,  Yongin Lee ,  Se-Hoon Jang ,  Youngho Kim ,  Ho Kim ,  Seungdae Seok ,  Siwoong Woo

IPC: H01J37/32 ,  H01L21/67 ,  H01L21/683

CPC classification number: H01J37/3244 ,  H01J37/32862 ,  H01L21/67201 ,  H01J37/32532 ,  H01L21/67051 ,  H01L21/6833

Abstract: Plasma processing apparatuses, substrate bonding systems, and substrate bonding methods are provided. The plasma processing apparatus includes a plasma process chamber that includes a process space, a load-lock chamber connected to the process space, a first vacuum pump that adjusts a pressure of the load-lock chamber, a process gas supply that supplies the process space with a process gas, and an H2O supply that supplies the process space with H2O. The plasma process chamber includes a chuck that supports a substrate and a plasma electrode to which a radio-frequency (RF) power is applied.

公开(公告)号：USD884708S1

公开(公告)日：2020-05-19

申请号：US29660237

申请日：2018-08-20

Applicant: Samsung Electronics Co., Ltd.

Designer： Yuyoul Eom ,  Youngho Kim ,  Dan Nah ,  Deunghyeon Jeong ,  Jiyeon Han