公开(公告)号：US20200161157A1

公开(公告)日：2020-05-21

申请号：US16456757

申请日：2019-06-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yongwoo LEE ,  Youngjin NOH ,  Myungsun CHOI ,  Minyoung HUR ,  Seungbo SHIM ,  Jaehak LEE

IPC: H01L21/683 ,  H01L21/3065 ,  H01J37/32

Abstract: Electrostatic chucks, plasma processing apparatuses, and methods of fabricating semiconductor devices using the same are provided. The electrostatic chuck includes a chuck base, an upper plate provided on the chuck base, and an inner plate provided between the chuck base and the upper plate. A first diameter of the inner plate is less than a second diameter of the upper plate.

公开(公告)号：US20230402258A1

公开(公告)日：2023-12-14

申请号：US18136448

申请日：2023-04-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yunhwan KIM ,  Dougyong SUNG ,  Namkyun KIM ,  Minsung KIM ,  Youngjin NOH

IPC: H01J37/32 ,  H01L21/683 ,  B33Y80/00

CPC classification number: H01J37/32449 ,  H01J37/32724 ,  H01J37/32568 ,  H01J37/32082 ,  H01L21/6833 ,  B33Y80/00 ,  H01J2237/2007 ,  H01J2237/032 ,  H01J2237/334 ,  H01J2237/2001

Abstract: A plasma processing apparatus includes a process chamber in which a substrate processing process is performed; an electrostatic chuck having a microcavity; a lower electrode disposed to be in contact with a lower surface of the electrostatic chuck; a high-frequency power supply applying high-frequency power to the lower electrode; a conductive supporter disposed to be spaced apart from a lower portion of the lower electrode and grounded thereto; and a discharge suppressor located between the lower electrode and the conductive supporter, having a gas supply flow path forming a portion of a gas supply line, and molded by three dimensional printing, wherein the gas supply flow path has a space portion having a length of 5 mm or less in a direction of an electric field formed by the high-frequency power and connecting upper and lower surfaces of the discharge suppressor.

公开(公告)号：US20150153593A1

公开(公告)日：2015-06-04

申请号：US14316525

申请日：2014-06-26

Applicant: Samsung Display Co., Ltd. ,  Samsung Electronics Co., Ltd.

Inventor： Sung-Mo GU ,  SUK CHOI ,  Youngjin NOH ,  YOUNGWON KIM ,  Changhyun RYU ,  CHI YOUN CHUNG

IPC: G02F1/13 ,  H01B13/00 ,  B05D1/00

CPC classification number: G02F1/1313 ,  G02F1/1309 ,  G02F1/1334 ,  G02F1/133553 ,  G02F2001/133368

Abstract: A substrate inspection apparatus includes a liquid crystal modulator configured to be provided on a substrate, a light source unit provided to be spaced apart from the liquid crystal modulator, a beam splitter provided between the liquid crystal modulator and the light source unit configured to reflect a beam of light from the light source to the liquid crystal modulator, and a measurement unit configured to sense the beam of light reflected by the substrate.

Abstract translation: 基板检查装置包括：液晶调制器，被配置为设置在基板上;光源单元，设置为与液晶调制器间隔开;光束分离器，设置在液晶调制器和光源单元之间，该光束分离器被配置为反射 从光源到液晶调制器的光束;以及被配置为感测由基板反射的光束的测量单元。

公开(公告)号：US20250149311A1

公开(公告)日：2025-05-08

申请号：US18762910

申请日：2024-07-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junho IM ,  Younseon WANG ,  Keonwoo KIM ,  Youngjin NOH ,  Dougyong SUNG ,  Wonhee LEE ,  Sungwook JUNG

IPC: H01J37/32 ,  C23C16/458 ,  H01L21/683

Abstract: A substrate processing apparatus may include a chucking member configured to support a substrate, a base plate configured to support the chucking member, a bonding layer located between the chucking member and the base plate, the bonding layer configured to adhere the chucking member to the base plate, a coating layer on an outer side surface of the bonding layer, and a bonding protective member surrounding an outer side surface of the coating layer, wherein the coating layer conformally covers the outer side surface of the bonding layer.

公开(公告)号：US20230100582A1

公开(公告)日：2023-03-30

申请号：US17713433

申请日：2022-04-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yunhwan KIM ,  Dougyong SUNG ,  Byeongsang KIM ,  Youngjin NOH ,  Namkyun KIM

IPC: H01J37/32

Abstract: A substrate processing apparatus includes a base plate, an upper plate on the base plate, a DC power supply configured to supply power to the upper plate, and a controller interconnecting the upper plate and the DC power supply. The upper plate includes a first electrode, and a second electrode spaced apart from the first electrode. The controller includes a first controller interconnecting the first electrode and the DC power supply, and a second controller interconnecting the second electrode and the DC power supply. The DC power supply is configured to apply a first voltage to the first electrode via the first controller, and configured to apply a second voltage to the second electrode via the second controller. The first voltage and the second voltage are different.

公开(公告)号：US20200013595A1

公开(公告)日：2020-01-09

申请号：US16259185

申请日：2019-01-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yongwoo LEE ,  Youngjin NOH ,  Dowon KIM ,  Donghyeon NA ,  Seungbo SHIM

IPC: H01J37/32 ,  H01L21/67 ,  H01L21/683

Abstract: An electrostatic chuck includes a chuck base having a first hole, an upper plate provided on the chuck base, the upper plate having a second hole aligned with the first hole, and an adhesive layer attaching the upper plate to the chuck base, the adhesive layer having a thickness that is less than a diameter of the first hole and equal to a diameter of the second hole.